Abstract: A structure and method for the wafer level testing of interposer-based photonic integrated circuits is described that includes the formation of an upturned mirror structure and the method of utilizing the interposer-based mirror structure for electrical and optical testing of optoelectrical circuits that include emitting components such as lasers, detecting components such as photodetectors, and both emitting and detecting components. Electrical activation of the optoelectrical emitting or sending devices and the subsequent detection and measurement of the optical signals in detecting or receiving devices provides information on the operability or functionality of the PIC on the die at the wafer level, prior to die separation or singulation, using the electrical and optical components of the PIC circuit.

Abstract: A structure and method for the formation of a reflector structure having three-dimensional surface curvature is disclosed. Beam narrowing upon reflection from the three-dimensionally curved surface in embodiments can provide improved coupling efficiency in addition to the directional change provided by the reflector.

Abstract: A structure and method for the formation of a reflector structure having three-dimensional surface curvature is disclosed. Beam narrowing upon reflection from the three-dimensionally curved surface in embodiments can provide improved coupling efficiency in addition to the directional change provided by the reflector.

Abstract: An interposer PIC structure having a fanout waveguide structure is described for which the patterned planar waveguides of the fanout waveguide structure is formed from a same hard mask patterning step comprising a patterned area for a lateral alignment aid used to align the linearly configured cores of a multicore fiber with a terminal end of the fanout waveguide structure. Areas of the same patterned hard mask may optionally include one or more fiducials and one or more alignment pillars for aligning mounted devices onto the PIC structure. Interposer PIC assemblies are described comprising the interposer PIC structure, multicore fibers having linearly configured arrays of cores, and devices mounted or otherwise formed on the interposer PIC structure. Methods of forming the interposer PIC structures and assemblies are also disclosed.

Abstract: Embodiments of alignment structures are disclosed that enable the alignment of a fiber attach unit (FAU) and the optical fibers contained therein to optical components on optical interposers or substrates on which photonic integrated circuits (PICs) are formed. Alignment of the optical fibers is enabled without the requirement for powering of the active optoelectrical devices in the PIC, but rather use an external testing apparatus to provide one or more optical signals to facilitate alignment. Methods for alignment using embodiments of the alignment structure is also disclosed.

Abstract: A switch module includes a switch integrated circuit (IC), a silicon photonics chips, and a planar lightwave circuits (PLCs).

Abstract: A structure and method for the wafer level testing of interposer-based photonic integrated circuits is described that includes the formation of an upturned mirror structure and the method of utilizing the interposer-based mirror structure for electrical and optical testing of optoelectrical circuits that include emitting components such as lasers, detecting components such as photodetectors, and both emitting and detecting components. Electrical activation of the optoelectrical emitting or sending devices and the subsequent detection and measurement of the optical signals in detecting or receiving devices provides information on the operability or functionality of the PIC on the die at the wafer level, prior to die separation or singulation, using the electrical and optical components of the PIC circuit.

Abstract: A structure and method for the wafer level testing of interposer-based photonic integrated circuits is described that includes the formation of an upturned mirror structure and the method of utilizing the interposer-based mirror structure for electrical and optical testing of optoelectrical circuits that include emitting components such as lasers, detecting components such as photodetectors, and both emitting and detecting components. Electrical activation of the optoelectrical emitting or sending devices and the subsequent detection and measurement of the optical signals in detecting or receiving devices provides information on the operability or functionality of the PIC on the die at the wafer level, prior to die separation or singulation, using the electrical and optical components of the PIC circuit.

Abstract: An optical transceiver may include a circuit board, lasers, and a PLC including optical multiplexers and demultiplexers. The PLC may be coupled to fiber optic lines at a forward edge of the PLC, with a rear edge of the PLC receiving light for transmission generated by the lasers. Light received at the forward edge of the PLC may be demultiplexed into data channels and routed to a top surface of the PLC for optoelectronic conversion by photodetectors. In some embodiments each data channel is routed into a corresponding plurality of waveguides, with each of the corresponding plurality of waveguides providing light to the same photodetector. In some embodiments at least some receive side electronic circuitry, other than photodetectors, is stacked on top of the PLC.

Abstract: A switch module includes a switch integrated circuit (IC), a silicon photonics chips, and an interface having removably coupled first side and second side. The first side includes a lens array optically coupled to a SiP chip and the second side includes a connector having a plurality of planar lightwave circuits (PLCs) optically coupled to another lens array.

Abstract: An optical transceiver may include a circuit board, lasers, and a PLC including optical multiplexers and demultiplexers. The PLC may be coupled to fiber optic lines at a forward edge of the PLC, with a rear edge of the PLC receiving light for transmission generated by the lasers. Light received at the forward edge of the PLC may be demultiplexed into data channels and routed to a top surface of the PLC for optoelectronic conversion by photodetectors. In some embodiments each data channel is routed into a corresponding plurality of waveguides, with each of the corresponding plurality of waveguides providing light to the same photodetector. In some embodiments at least some receive side electronic circuitry, other than photodetectors, is stacked on top of the PLC.

Abstract: A switch module includes a switch integrated circuit (IC), a silicon photonics chips, and an interface having removably coupled first side and second side. The first side includes a lens array optically coupled to a SiP chip and the second side includes a connector having a plurality of planar lightwave circuits (PLCs) optically coupled to another lens array.

Abstract: A switch module includes a switch integrated circuit (IC), a photonic integrated circuit (PIC), and a planar lightwave circuit (PLC). The PIC may include a plurality of light sources, an optical splitter, and a plurality of modulators. A dual MEMS may be used to align lens arrays, which may be used to couple light from the PIC to the PLC.

Abstract: A switch module includes a switch integrated circuit (IC), a photonic integrated circuit (PIC), and a planar lightwave circuit (PLC). The PIC may include a plurality of light sources, an optical splitter, and a plurality of modulators. A dual MEMS may be used to align lens arrays, which may be used to couple light from the PIC to the PLC.

Abstract: Roughly described, an integrated optical device includes both a PLC chip and an attached SiPh chip. The PLC chip has a PLC waveguide which terminates at an end facet. The SiPh chip has a SiPh waveguide which includes a Bragg grating which diffracts light from the SiPh waveguide toward the PLC chip. The PLC chip also has a turning mirror to reflect light emitted from the Bragg grating onto the end facet of the PLC waveguide. The Bragg grating is designed to direct light emitted from the Bragg grating into the end facet of the PLC waveguide so that after reflecting off the turning mirror the light focuses within one Rayleigh distance of the end facet of the PLC chip.

Abstract: An optical transceiver may include a circuit board, lasers, and a PLC including optical multiplexers and demultiplexers. The PLC may be coupled to fiber optic lines at a forward edge of the PLC, with a rear edge of the PLC receiving light for transmission generated by the lasers. Light received at the forward edge of the PLC may be demultiplexed into data channels and routed to a top surface of the PLC for optoelectronic conversion by photodetectors. In some embodiments each data channel is routed into a corresponding plurality of waveguides, with each of the corresponding plurality of waveguides providing light to the same photodetector. In some embodiments at least some receive side electronic circuitry, other than photodetectors, is stacked on top of the PLC.

Abstract: A switch module includes a switch integrated circuit (IC), a silicon photonics chips, and a planar lightwave circuits (PLCs).

Abstract: A switch module includes a switch integrated circuit (IC), a silicon photonics chips, and an interface having removably coupled first side and second side. The first side includes a lens array optically coupled to a SiP chip and the second side includes a connector having a plurality of planar lightwave circuits (PLCs) optically coupled to another lens array.

Abstract: A switch module includes a switch integrated circuit (IC), an InP chip, and a planar lightwave circuit (PLC). The InP chip may include a plurality of light sources, an optical splitter, and a plurality of modulators.

Abstract: An assembly of waveguide wavelength multiplexers and demultiplexers, together with continuous wave (CW) laser transmitters that interface to grating couplers on a silicon photonics chip, providing CW sources, multiplexed output and optionally multiplexed input, all using a single photonic lightwave circuit (PLC).