Patents by Inventor Lynn C. Furman

Lynn C. Furman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4611389
    Abstract: A semiconductor device package structure having a conventional base outline, a heat spreader, and top-mounted, quick-connect terminals for external connection is described. A pre-packaged semiconductor device is attached to a lead frame containing terminals in a predetermined configuration, and then overmolded with a plastic encapsulant so that the heat spreader of the prepackaged device protrudes a predetermined distance from the mounting surface of the package to make possible good thermal contact with a heat sink. Insulated means to facilitate mounting are built-in.
    Type: Grant
    Filed: March 18, 1985
    Date of Patent: September 16, 1986
    Assignee: Motorola, Inc.
    Inventors: Kelvin R. Blair, Lynn C. Furman, David M. Knott
  • Patent number: 4530003
    Abstract: A semiconductor device package structure having a conventional base outline, a heat spreader, and top-mounted, quick-connect terminals for external connection is described. A pre-packaged semiconductor device is attached to a lead frame containing terminals in a predetermined configuration, and then overmolded with a plastic encapsulant so that the heat spreader of the prepackaged device protrudes a predetermined distance from the mounting surface of the package to make possible good thermal contact with a heat sink. Insulated means to facilitate mounting are built-in.
    Type: Grant
    Filed: November 3, 1983
    Date of Patent: July 16, 1985
    Assignee: Motorola, Inc.
    Inventors: Kelvin R. Blair, Lynn C. Furman, David M. Knott