Patents by Inventor Lynn F. Schneemeyer

Lynn F. Schneemeyer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7021518
    Abstract: The present invention provides a power micromagnetic integrated circuit having a ferromagnetic core, a method of manufacture therefor and a power processing circuit employing the same, that-includes: (1) a substrate; (2) an insulator coupled to the substrate and (3) a metallic adhesive that forms a bond between the insulator and the ferromagnetic core to secure the ferromagnetic core to the substrate.
    Type: Grant
    Filed: March 13, 2003
    Date of Patent: April 4, 2006
    Assignee: Agere Systems Inc.
    Inventors: Dean P. Kossives, Ashraf W. Lotfi, Lynn F. Schneemeyer, Michael L. Steigerwald, R. Bruce Van Dover
  • Patent number: 7016097
    Abstract: The thermo-optic behavior of an optical path over a range of temperatures is controlled by determining a figure of merit (FoM) for the optical path and including in the path a body of NaBi(Mo1-xWxO4)2 crystalline material that enables the conditions specified by the FOM to be satisfied. The NaBi(Mo1-xWxO4)2 crystalline material is highly transparent at a wavelength of radiation propagating in the path, and has a coefficient of thermal expansion (CTE) and a refractive index n such that the CTE and dn/dT of the etalon compensate one another so as to perform frequency discrimination that is essentially temperature insensitive over the range ?T. The NaBi(Mo1-xWxO4)2 crystalline material exhibits temperature independent transmission characteristics at about room temperature and at a wavelength of about 1550 nm.
    Type: Grant
    Filed: January 7, 2002
    Date of Patent: March 21, 2006
    Assignee: Triquint Technology Holding Co.
    Inventors: David A. Ackerman, Charles D. Brandle, Jr., Glen R. Kowach, Lynn F. Schneemeyer
  • Patent number: 6696744
    Abstract: A method of manufacturing an integrated circuit and an integrated circuit employing the same. In one embodiment, the method of manufacturing the integrated circuit includes (1) conformally mapping a micromagnetic device, including a ferromagnetic core, to determine appropriate dimensions therefor, (2) depositing an adhesive over an insulator coupled to a substrate of the integrated circuit and (3) forming the ferromagnetic core of the appropriate dimensions over the adhesive.
    Type: Grant
    Filed: October 15, 2001
    Date of Patent: February 24, 2004
    Assignee: Agere Systems, Inc.
    Inventors: Anatoly Feygenson, Dean P. Kossives, Ashraf W. Lotfi, Lynn F. Schneemeyer, Michael L. Steigerwald, R. Bruce Van Dover
  • Patent number: 6649422
    Abstract: An integrated circuit and method of manufacturing therefor. In one embodiment, the integrated circuit includes a substrate with an insulator and a capacitor formed over the substrate. The integrated circuit further includes an adhesive formed over the insulator. The integrated circuit still further includes a micromagnetic device. The micromagnetic device includes a ferromagnetic core formed over the adhesive. The adhesive forms a bond between the insulator and the ferromagnetic core to secure the ferromagnetic core to the substrate. The micromagnetic device also includes at least one winding, located proximate the ferromagnetic core, to impart a desired magnetic property to the ferromagnetic core. The micromagnetic device is electrically coupled to the capacitor.
    Type: Grant
    Filed: June 21, 2001
    Date of Patent: November 18, 2003
    Assignee: Agere Systems Inc.
    Inventors: Dean P. Kossives, Ashraf W. Lotfi, Lynn F. Schneemeyer, Michael L. Steigerwald, R. Bruce Van Dover
  • Publication number: 20030150898
    Abstract: The present invention provides a power micromagnetic integrated circuit having a ferromagnetic core, a method of manufacture therefor and a power processing circuit employing the same, that-includes: (1) a substrate; (2) an insulator coupled to the substrate and (3) a metallic adhesive that forms a bond between the insulator and the ferromagnetic core to secure the ferromagnetic core to the substrate.
    Type: Application
    Filed: March 13, 2003
    Publication date: August 14, 2003
    Applicant: Agere Systems Inc.
    Inventors: Dean P. Kossives, Ashraf W. Lotfi, Lynn F. Schneemeyer, Michael L. Steigerwald, R. Bruce Van Dover
  • Publication number: 20030128990
    Abstract: The thermo-optic behavior of an optical path over a range of temperatures is controlled by determining a figure of merit (FoM) for the optical path and including in the path a body of NaBi(Mo1−xWxO4)2 crystalline material that enables the conditions specified by the FOM to be satisfied. The NaBi(Mo1−xWxO4)2 crystalline material is highly transparent at a wavelength of radiation propagating in the path, and has a coefficient of thermal expansion (CTE) and a refractive index n such that the CTE and dn/dT of the etalon compensate one another so as to perform frequency discrimination that is essentially temperature insensitive over the range &Dgr;T. The NaBi(Mo1−xWxO4)2 crystalline material exhibits temperature independent transmission characteristics at about room temperature and at a wavelength of about 1550 nm.
    Type: Application
    Filed: January 7, 2002
    Publication date: July 10, 2003
    Inventors: David A. Ackerman, Charles D. Brandle, Glen R. Kowach, Lynn F. Schneemeyer
  • Patent number: 6440750
    Abstract: A method of manufacturing an integrated circuit and an integrated circuit employing the same. In one embodiment, the method of manufacturing the integrated circuit includes (1) conformally mapping a micromagnetic device, including a ferromagnetic core, to determine appropriate dimensions therefor, (2) depositing an adhesive over an insulator coupled to a substrate of the integrated circuit and (3) forming the ferromagnetic core of the appropriate dimensions over the adhesive.
    Type: Grant
    Filed: February 23, 2000
    Date of Patent: August 27, 2002
    Assignee: Agere Systems Guardian Corporation
    Inventors: Anatoly Feygenson, Dean P. Kossives, Ashraf W. Lotfi, Lynn F. Schneemeyer, Michael L. Steigerwald, R. Bruce Van Dover
  • Publication number: 20020037434
    Abstract: A method of manufacturing an integrated circuit and an integrated circuit employing the same. In one embodiment, the method of manufacturing the integrated circuit includes (1) conformally mapping a micromagnetic device, including a ferromagnetic core, to determine appropriate dimensions therefor, (2) depositing an adhesive over an insulator coupled to a substrate of the integrated circuit and (3) forming the ferromagnetic core of the appropriate dimensions over the adhesive.
    Type: Application
    Filed: October 15, 2001
    Publication date: March 28, 2002
    Inventors: Anatoly Feygenson, Dean P. Kossives, Ashraf W. Lotfi, Lynn F. Schneemeyer, Michael L. Steigerwald, R. Bruce Van Dover
  • Publication number: 20010036702
    Abstract: An integrated circuit and method of manufacturing therefor. In one embodiment, the integrated circuit includes a substrate with an insulator and a capacitor formed over the substrate. The integrated circuit further includes an adhesive formed over the insulator. The integrated circuit still further includes a micromagnetic device. The micromagnetic device includes a ferromagnetic core formed over the adhesive. The adhesive forms a bond between the insulator and the ferromagnetic core to secure the ferromagnetic core to the substrate. The micromagnetic device also includes at least one winding, located proximate the ferromagnetic core, to impart a desired magnetic property to the ferromagnetic core. The micromagnetic device is electrically coupled to the capacitor.
    Type: Application
    Filed: June 21, 2001
    Publication date: November 1, 2001
    Inventors: Dean P. Kossives, Ashraf W. Lotfi, Lynn F. Schneemeyer, Michael L. Steigerwald, R. Bruce Van Dover
  • Patent number: 6255714
    Abstract: An integrated circuit and method of manufacturing therefor. In one embodiment, the integrated circuit includes a substrate with an insulator and a capacitor formed over the substrate. The integrated circuit further includes an adhesive formed over the insulator. The integrated circuit still further includes a micromagnetic device. The micromagnetic device includes a ferromagnetic core formed over the adhesive. The adhesive forms a bond between the insulator and the ferromagnetic core to secure the ferromagnetic core to the substrate. The micromagnetic device also includes at least one winding, located proximate the ferromagnetic core, to impart a desired magnetic property to the ferromagnetic core. The micromagnetic device is electrically coupled to the capacitor.
    Type: Grant
    Filed: June 22, 1999
    Date of Patent: July 3, 2001
    Assignee: Agere Systems Guardian Corporation
    Inventors: Dean P. Kossives, Ashraf W. Lotfi, Lynn F. Schneemeyer, Michael L. Steigerwald, R. Bruce Van Dover
  • Patent number: 6191495
    Abstract: For use with an integrated circuit having a substrate and an insulator coupled to the substrate, a micromagnetic device and method of manufacturing therefor. In one embodiment, the micromagnetic device includes an adhesive coupled to the insulator and a ferromagnetic core, coupled to the adhesive that forms a bond between the insulator and the ferromagnetic core, having an anisotropic property.
    Type: Grant
    Filed: April 16, 1999
    Date of Patent: February 20, 2001
    Assignee: Lucent Technologies Inc.
    Inventors: Dean P. Kossives, Ashraf W. Lotfi, Lynn F. Schneemeyer, Michael L. Steigerwald, R. Bruce Van Dover
  • Patent number: 6163234
    Abstract: A data transmission micromagnetic integrated circuit having a ferromagnetic core, a method of manufacture therefor and a data transmission circuit employing the same. In one embodiment, the micromagnetic integrated circuit includes: (1) a substrate; (2) an insulator coupled to the substrate and (3) a metallic adhesive that forms a bond between the insulator and the ferromagnetic core to secure the ferromagnetic core to the substrate.
    Type: Grant
    Filed: July 2, 1998
    Date of Patent: December 19, 2000
    Assignee: Lucent Technologies Inc.
    Inventors: Dean P. Kossives, Ashraf W. Lotfi, Lynn F. Schneemeyer, Michael L. Steigerwald, R. Bruce Van Dover
  • Patent number: 6160721
    Abstract: The present invention provides a power micromagnetic integrated circuit having a ferromagnetic core, a method of manufacture therefor and a power processing circuit employing the same, that includes: (1) a substrate; (2) an insulator coupled to the substrate and (3) a metallic adhesive that forms a bond between the insulator and the ferromagnetic core to secure the ferromagnetic core to the substrate.
    Type: Grant
    Filed: January 24, 2000
    Date of Patent: December 12, 2000
    Assignee: Lucent Technologies Inc.
    Inventors: Dean P. Kossives, Ashraf W. Lotfi, Lynn F. Schneemeyer, Michael L. Steigerwald, R. Bruce Van Dover
  • Patent number: 6118351
    Abstract: The present invention provides a power micromagnetic integrated circuit having a ferromagnetic core, a method of manufacture therefor and a power processing circuit employing the same, that includes: (1) a substrate; (2) an insulator coupled to the substrate and (3) a metallic adhesive that forms a bond between the insulator and the ferromagnetic core to secure the ferromagnetic core to the substrate.
    Type: Grant
    Filed: June 10, 1997
    Date of Patent: September 12, 2000
    Assignee: Lucent Technologies Inc.
    Inventors: Dean P. Kossives, Ashraf W. Lotfi, Lynn F. Schneemeyer, Michael L. Steigerwald, R. Bruce Van Dover
  • Patent number: 5530267
    Abstract: We have discovered advantageous substrates for III-V nitride semiconductors such as GaN. The substrate material is of the YbFe.sub.2 O.sub.4 or InFeO.sub.3 (ZnO).sub.n structure type and has general composition RAO.sub.3 (MO).sub.n, where R is one or more of Sc, In, Y and the lanthanides (atomic number 67-71); A is one or more of Fe(III), Ga, and Al; M is one or more of Mg, Mn, Fe(II), Co, Cu, Zn and Cd; and n is an integer.gtoreq.1, typically<9. Furthermore, the substrate material is selected to have a lattice constant that provides less than .+-.5% lattice mismatch with the III-V nitride semiconductor material that is to be deposited thereon. At least some of the substrate materials (e.g., ScMgAlO.sub.4) typically can be readily and relatively cheaply produced in single crystal form, are readily clearable on the basal plane, and do essentially not interact chemically with the III-V nitride under typical deposition conditions.
    Type: Grant
    Filed: March 14, 1995
    Date of Patent: June 25, 1996
    Assignee: AT&T Corp.
    Inventors: Charles D. Brandle, Jr., Denis N. Buchanan, Elliot H. Hartford, Jr., Eric S. Hellman, Lynn F. Schneemeyer
  • Patent number: 5039653
    Abstract: A bismuth-strontium calcium cuprate material shows commercial promise as a high-T.sub.c superconductor material, means are desired for producing such (as well as isostructural) superconductor material in the form of macroscopic single-crystal bodies. The invention provides for the growth of such bodies from a fluxed melt, in bulk or epitaxially on a substrate, the fluxing agent being chosen to include sodium chloride, potassium chloride, or a mixture of sodium chloride and potassium chloride.
    Type: Grant
    Filed: March 29, 1990
    Date of Patent: August 13, 1991
    Assignee: AT&T Bell Laboratories
    Inventors: Kenneth A. Jackson, Lynn F. Schneemeyer