Patents by Inventor Maciej Wojnowski

Maciej Wojnowski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180180730
    Abstract: A semiconductor package having an antenna; and a semiconductor die which is coupled to the antenna and comprises a transmitter configured to transmit wirelessly via the antenna a wireless signal having information on a local oscillator signal to a further semiconductor package comprising a further semiconductor die.
    Type: Application
    Filed: February 21, 2018
    Publication date: June 28, 2018
    Inventors: Josef Boeck, Rudolf Lachner, Maciej Wojnowski, Walter Hartner
  • Patent number: 9922946
    Abstract: A method of manufacturing a semiconductor device package includes placing a semiconductor chip on a carrier, covering the semiconductor chip with an encapsulation material to form an encapsulation body, providing a microwave component having at least one electrically conducting wall structure integrated in the encapsulation body, and forming an electrical interconnect configured to electrically couple the semiconductor chip and the microwave component.
    Type: Grant
    Filed: April 6, 2017
    Date of Patent: March 20, 2018
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Ernst Seler, Maciej Wojnowski, Walter Hartner, Josef Boeck
  • Patent number: 9910145
    Abstract: A wireless communication system includes a first semiconductor module and a second semiconductor module. The first semiconductor module includes a semiconductor die connected to an antenna structure. The semiconductor die of the first semiconductor module and the antenna structure of the first semiconductor module are arranged within a common package. The semiconductor die of the first semiconductor module includes a transmitter module configured to transmit the wireless communication signal through the antenna structure of the first semiconductor module. The second semiconductor module includes a semiconductor die connected to an antenna structure. The semiconductor die of the second semiconductor module includes a receiver module configured to receive the wireless communication signal through the antenna structure of the second semiconductor module from the first semiconductor module.
    Type: Grant
    Filed: December 19, 2013
    Date of Patent: March 6, 2018
    Assignee: Infineon Technologies AG
    Inventors: Josef Boeck, Rudolf Lachner, Maciej Wojnowski, Walter Hartner
  • Publication number: 20170309582
    Abstract: A semiconductor device includes a semiconductor die having an active main surface and an opposite main surface opposite the active main surface. The semiconductor device further includes an antenna arranged on the active main surface of the semiconductor die and a recess arranged on the opposite main surface of the semiconductor die. The recess is arranged over the antenna.
    Type: Application
    Filed: April 25, 2017
    Publication date: October 26, 2017
    Inventors: Thorsten Meyer, Walter Hartner, Maciej Wojnowski
  • Publication number: 20170271260
    Abstract: A device includes a semiconductor chip, a plurality of planar metallization layers arranged over a main surface of the semiconductor chip, and a passive component including windings, wherein each of the windings is formed in one of the plurality of planar metallization layers.
    Type: Application
    Filed: March 15, 2017
    Publication date: September 21, 2017
    Applicant: Infineon Technologies AG
    Inventors: Maciej Wojnowski, Frank Daeche, Zeeshan Umar
  • Publication number: 20170236776
    Abstract: A semiconductor device includes a semiconductor chip and a redistribution layer on a first side of the semiconductor chip. The redistribution layer is electrically coupled to the semiconductor chip. The semiconductor device includes a dielectric layer and an antenna on the dielectric layer. The dielectric layer is between the antenna and the semiconductor chip.
    Type: Application
    Filed: February 17, 2016
    Publication date: August 17, 2017
    Applicant: Infineon Technologies AG
    Inventors: Ngoc-Hoa Huynh, Franz-Xaver Muehlbauer, Claus Waechter, Veronika Huber, Dominic Maier, Thomas Kilger, Saverio Trotta, Ashutosh Baheti, Georg Meyer-Berg, Maciej Wojnowski
  • Publication number: 20170213800
    Abstract: A method of manufacturing a semiconductor device package includes placing a semiconductor chip on a carrier, covering the semiconductor chip with an encapsulation material to form an encapsulation body, providing a microwave component having at least one electrically conducting wall structure integrated in the encapsulation body, and forming an electrical interconnect configured to electrically couple the semiconductor chip and the microwave component.
    Type: Application
    Filed: April 6, 2017
    Publication date: July 27, 2017
    Inventors: Ernst Seler, Maciej Wojnowski, Walter Hartner, Josef Boeck
  • Publication number: 20170162476
    Abstract: An electronic device comprising a semiconductor package having a first main surface region and a second main surface region and comprising a semiconductor chip comprising at least one chip pad in the second main surface region and a connector block comprising at least one first electrically conductive through connection and at least one second electrically conductive through connection extending with different cross-sectional areas between the first main surface region and the second main surface region and being arranged side-by-side with the semiconductor chip.
    Type: Application
    Filed: December 2, 2016
    Publication date: June 8, 2017
    Inventors: Thorsten MEYER, Klaus Pressel, Maciej Wojnowski
  • Patent number: 9653426
    Abstract: A method of manufacturing an array of semiconductor device packages includes placing a plurality of semiconductor chips on a temporary carrier, covering the plurality of semiconductor chips with an encapsulation material to form an encapsulation body, providing a plurality of microwave components each including at least one electrically conducting wall structure integrated in the encapsulation body, forming a plurality of electrical interconnects each configured to electrically couple a semiconductor chip and a microwave component, and separating the encapsulation body into single semiconductor device packages each including a semiconductor chip, a microwave component and an electrical interconnect.
    Type: Grant
    Filed: May 4, 2016
    Date of Patent: May 16, 2017
    Assignee: Infineon Technologies AG
    Inventors: Ernst Seler, Maciej Wojnowski, Walter Hartner, Josef Boeck
  • Patent number: 9583811
    Abstract: A microwave device includes a semiconductor package comprising a microwave semiconductor chip and a waveguide part associated with the semiconductor package. The waveguide part is configured to transfer a microwave waveguide signal. It includes one or more pieces. The microwave device further includes a transformer element configured to transform a microwave signal from the microwave semiconductor chip into the microwave waveguide signal or to transform the microwave waveguide signal into a microwave signal for the microwave semiconductor chip.
    Type: Grant
    Filed: August 7, 2014
    Date of Patent: February 28, 2017
    Assignee: Infineon Technologies AG
    Inventors: Ernst Seler, Maciej Wojnowski, Walter Hartner, Josef Boeck
  • Patent number: 9577852
    Abstract: A common-mode suppressor for eliminating common-mode noise in high frequency differential data transmission systems and an associated method includes a long coiled differential transmission line configured to transfer data between a source and a load. The differential transmission line comprises a first conductive wire and a second conductive wire which are inductively and capacitively coupled and are laterally aligned or vertically aligned with each other. Further, the differential transmission line is matched for differential signals and un-matched for common-mode noise.
    Type: Grant
    Filed: November 3, 2014
    Date of Patent: February 21, 2017
    Assignee: Infineon Technologies AG
    Inventors: Maciej Wojnowski, Alexander Glas, Hubert Werthmann, Josef-Paul Schaffer, Francesca Arcioni, Gabriele Bettineschi
  • Publication number: 20160247780
    Abstract: A method of manufacturing an array of semiconductor device packages includes placing a plurality of semiconductor chips on a temporary carrier, covering the plurality of semiconductor chips with an encapsulation material to form an encapsulation body, providing a plurality of microwave components each including at least one electrically conducting wall structure integrated in the encapsulation body, forming a plurality of electrical interconnects each configured to electrically couple a semiconductor chip and a microwave component, and separating the encapsulation body into single semiconductor device packages each including a semiconductor chip, a microwave component and an electrical interconnect.
    Type: Application
    Filed: May 4, 2016
    Publication date: August 25, 2016
    Inventors: Ernst Seler, Maciej Wojnowski, Walter Hartner, Josef Boeck
  • Publication number: 20160240495
    Abstract: A semiconductor module comprises an integrated circuit device, the IC device embedded in a compound material, wherein the compound material at least partially extends lateral to the IC device. The semiconductor module further comprises interconnect structures arranged lateral to the IC device to provide at least one external electrical contact; a patch antenna structure integrated in the semiconductor module and electrically connected to the IC device and a layer interfacing the IC device and the compound, wherein the layer comprises first and second planar metal structures coupled to the IC device, wherein the first planar metal structure is electrically connected to the IC device and the interconnect structures and wherein the second planar metal structure is electrically connected to the IC device and the patch antenna structure.
    Type: Application
    Filed: April 25, 2016
    Publication date: August 18, 2016
    Inventors: Rudolf Lachner, Linus Maurer, Maciej Wojnowski
  • Patent number: 9356332
    Abstract: An integrated-circuit module includes a package molding compound layer, a radio-frequency (RF) integrated circuit embedded within the package molding compound layer and having an RF port, a waveguide transition structure embedded within the package molding compound layer, and a redistribution layer. The waveguide transition structure includes a transmission line interface section, a waveguide interface section configured for coupling to a rectangular waveguide housing, and a transformer section configured to provide a mode transition between the transmission line interface section and the waveguide interface section. The redistribution layer includes at least one insulating layer and at least one metallization layer, extending between the RF integrated circuit and the waveguide transition structure across a surface of the package molding compound layer.
    Type: Grant
    Filed: April 29, 2013
    Date of Patent: May 31, 2016
    Assignee: Infineon Technologies AG
    Inventors: Ernst Seler, Maciej Wojnowski, Walter Hartner
  • Patent number: 9349696
    Abstract: A semiconductor module comprises a wafer package comprising an integrated circuit (IC) device embedded within the wafer package and a layer comprising at least one antenna structure and redistribution structures, wherein the antenna structure is coupled to the IC device and wherein the redistribution structures are coupled to the IC device.
    Type: Grant
    Filed: January 6, 2014
    Date of Patent: May 24, 2016
    Assignee: Infineon Technologies AG
    Inventors: Rudolf Lachner, Linus Maurer, Maciej Wojnowski
  • Patent number: 9337159
    Abstract: A semiconductor device package includes an encapsulant and a semiconductor chip. The semiconductor chip is at least partly embedded in the encapsulant. A microwave component including at least one electrically conducting wall structure is integrated in the encapsulant. Further, the semiconductor device package includes an electrical interconnect configured to electrically couple the microwave component to the semiconductor chip.
    Type: Grant
    Filed: December 13, 2013
    Date of Patent: May 10, 2016
    Assignee: Infineon Technologies AG
    Inventors: Ernst Seler, Maciej Wojnowski, Walter Hartner, Josef Boeck
  • Patent number: 9337522
    Abstract: According to an embodiment, a circuit board includes a signal line including at least portion of a first conductive layer that has a first portion extending over a cavity in the circuit board from a first side of the cavity. The circuit board also includes a first plurality of conductive vias surrounding the cavity and the first plurality of vias include at least one blind via disposed adjacent to the first side of the cavity.
    Type: Grant
    Filed: October 30, 2013
    Date of Patent: May 10, 2016
    Assignee: Infineon Technologies AG
    Inventors: Saverio Trotta, Jagjit Singh Bal, Maciej Wojnowski, Ernst Seler, Mehran Pour Mousavi
  • Publication number: 20160127157
    Abstract: A common-mode suppressor for eliminating common-mode noise in high frequency differential data transmission systems and an associated method includes a long coiled differential transmission line configured to transfer data between a source and a load. The differential transmission line comprises a first conductive wire and a second conductive wire which are inductively and capacitively coupled and are laterally aligned or vertically aligned with each other. Further, the differential transmission line is matched for differential signals and un-matched for common-mode noise.
    Type: Application
    Filed: November 3, 2014
    Publication date: May 5, 2016
    Inventors: Maciej Wojnowski, Alexander Glas, Hubert Werthmann, Josef-Paul Schaffer, Francesca Arcioni, Gabriele Bettineschi
  • Publication number: 20160043455
    Abstract: A microwave device includes a semiconductor package comprising a microwave semiconductor chip and a waveguide part associated with the semiconductor package. The waveguide part is configured to transfer a microwave waveguide signal. It includes one or more pieces. The microwave device further includes a transformer element configured to transform a microwave signal from the microwave semiconductor chip into the microwave waveguide signal or to transform the microwave waveguide signal into a microwave signal for the microwave semiconductor chip.
    Type: Application
    Filed: August 7, 2014
    Publication date: February 11, 2016
    Inventors: Ernst Seler, Maciej Wojnowski, Walter Hartner, Josef Boeck
  • Patent number: 9230926
    Abstract: An electronic device which comprises at least one interconnect, a semiconductor chip comprising at least one electric chip pad, an encapsulant structure packaging at least a part of the semiconductor chip, and an electrically conductive redistribution layer arranged between and electrically coupled with the at least one interconnect and the at least one chip pad, wherein the redistribution layer comprises at least one adjustment structure configured for adjusting radio frequency properties of a transition between the semiconductor chip and its periphery.
    Type: Grant
    Filed: August 31, 2013
    Date of Patent: January 5, 2016
    Assignee: Infineon Technologies AG
    Inventors: Ernst Seler, Maciej Wojnowski