Patents by Inventor Madhusudan Krishnan Iyengar
Madhusudan Krishnan Iyengar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240057297Abstract: Methods, systems, and apparatus for liquid coolant replacement in a cooling distribution unit during operation of the cooling distribution unit. Active liquid coolant to be replaced is removed from the flow cycle of the cooling distribution unit while the coolant distribution unit is operational and providing cooling to an electronic system. Additionally, replacement liquid coolant is provided to the flow cycle while the coolant distribution unit is operational and providing cooling to an electronic system.Type: ApplicationFiled: October 17, 2022Publication date: February 15, 2024Inventors: Jorge Padilla, Reza Khiabani, Madhusudan Krishnan Iyengar
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Patent number: 11832396Abstract: A server tray package includes a motherboard assembly that includes a plurality of data center electronic devices, the plurality of data center electronic devices including at least one heat generating processor device; and a liquid cold plate assembly. The liquid cold plate assembly includes a base portion mounted to the motherboard assembly, the base portion and motherboard assembly defining a volume that at least partially encloses the plurality of data center electronic devices; and a top portion mounted to the base portion and including a heat transfer member shaped to thermally contact the heat generating processor device, the heat transfer member including an inlet port and an outlet port that are in fluid communication with a cooling liquid flow path defined through the heat transfer member.Type: GrantFiled: June 2, 2020Date of Patent: November 28, 2023Assignee: Google LLCInventors: Madhusudan Krishnan Iyengar, Christopher Gregory Malone, Yuan Li, Jorge Padilla, Woon-Seong Kwon, Teckgyu Kang, Norman Paul Jouppi
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Patent number: 11564334Abstract: A server tray assembly includes a server tray support configured to receive a server board that includes a working fluid conduit fluidly coupled to a server board connector disposed on a back plane of the server board, a back wall of the server tray support includes a fluid connector configured to form an unbiased fluid connection with the server board connector; and a locking assembly secured to at least one of a server rack or the server tray support, the locking assembly disposed opposite the fluid connector is configured to engage a portion of the server board to bias the server board toward the fluid connector to fluidly seal the unbiased fluid connection between the server board connector and the fluid connector of the server tray support.Type: GrantFiled: December 7, 2020Date of Patent: January 24, 2023Assignee: Google LLCInventors: Madhusudan Krishnan Iyengar, Avinash Panga
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Publication number: 20220013435Abstract: Methods, systems, and apparatus, including an integrated circuit (IC) with a ring-shaped hot spot area. In one aspect, an IC includes a first area along an outside perimeter of a surface of the IC. The first area defines a first inner perimeter. The IC includes a second area that includes a center of the IC and that includes a first set of components. The second area defines a first outer. The IC includes a ring-shaped hot spot area between the first area and the second area. The ring-shaped hot spot area defines a ring outer perimeter that is juxtaposed with the first inner perimeter. The ring-shaped hot spot area defines a ring inner perimeter that is juxtaposed with the first outer perimeter. The ring-shaped hot spot area includes a second set of components that produce more heat than the first set of components.Type: ApplicationFiled: September 24, 2021Publication date: January 13, 2022Inventors: Madhusudan Krishnan Iyengar, Norman Paul Jouppi, Jorge Padilla, Christopher Gregory Malone
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Patent number: 11197397Abstract: Systems and methods for data center liquid cooling apparatus provisioning are described. In some aspects, such systems and methods may provision one or more data center liquid cooling apparatus, e.g., prior to such apparatus being put into service to a data center to cool data center devices, such as server trays (and more specifically, heat-generating devices such as processors, memories, voltage regulators, and other devices mounted on motherboards of the server trays). In some aspects, such liquid cooling apparatus include cold plates or evaporators that are mounted in thermal communication with the heat generating devices (in the server trays) and utilize a flow of a cooling liquid (e.g., water, glycol, refrigerant) to remove heat from the server tray (e.g., with or without a phase change of the cooling liquid).Type: GrantFiled: November 11, 2020Date of Patent: December 7, 2021Assignee: Google LLCInventors: Jerry Chiu, Skyler Salman, Madhusudan Krishnan Iyengar
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Patent number: 11158566Abstract: Methods, systems, and apparatus, including an integrated circuit (IC) with a ring-shaped hot spot area. In one aspect, an IC includes a first area along an outside perimeter of a surface of the IC. The first area defines a first inner perimeter. The IC includes a second area that includes a center of the IC and that includes a first set of components. The second area defines a first outer. The IC includes a ring-shaped hot spot area between the first area and the second area. The ring-shaped hot spot area defines a ring outer perimeter that is juxtaposed with the first inner perimeter. The ring-shaped hot spot area defines a ring inner perimeter that is juxtaposed with the first outer perimeter. The ring-shaped hot spot area includes a second set of components that produce more heat than the first set of components.Type: GrantFiled: June 14, 2019Date of Patent: October 26, 2021Assignee: Google LLCInventors: Madhusudan Krishnan Iyengar, Norman Paul Jouppi, Jorge Padilla, Christopher Gregory Malone
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Patent number: 10966352Abstract: This disclosure describes a cooling system, for example, for rack mounted electronic devices (e.g., servers, processors, memory, networking devices or otherwise) in a data center. In various disclosed implementations, the cooling system may be or include a liquid cold plate assembly that is part of or integrated with a server tray package. In some implementations, the liquid cold plate assembly includes a base portion and a top portion that, in combination, form a cooling liquid flow path through which a cooling liquid is circulated and a thermal interface between one or more heat generating devices and the cooling liquid.Type: GrantFiled: September 24, 2018Date of Patent: March 30, 2021Assignee: Google LLCInventors: Madhusudan Krishnan Iyengar, Jorge Padilla
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Publication number: 20210092872Abstract: A server tray assembly includes a server tray support configured to receive a server board that includes a working fluid conduit fluidly coupled to a server board connector disposed on a back plane of the server board, a back wall of the server tray support includes a fluid connector configured to form an unbiased fluid connection with the server board connector; and a locking assembly secured to at least one of a server rack or the server tray support, the locking assembly disposed opposite the fluid connector is configured to engage a portion of the server board to bias the server board toward the fluid connector to fluidly seal the unbiased fluid connection between the server board connector and the fluid connector of the server tray support.Type: ApplicationFiled: December 7, 2020Publication date: March 25, 2021Inventors: Madhusudan Krishnan Iyengar, Avinash Panga
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Publication number: 20210068309Abstract: Systems and methods for data center liquid cooling apparatus provisioning are described. In some aspects, such systems and methods may provision one or more data center liquid cooling apparatus, e.g., prior to such apparatus being put into service to a data center to cool data center devices, such as server trays (and more specifically, heat-generating devices such as processors, memories, voltage regulators, and other devices mounted on motherboards of the server trays). In some aspects, such liquid cooling apparatus include cold plates or evaporators that are mounted in thermal communication with the heat generating devices (in the server trays) and utilize a flow of a cooling liquid (e.g., water, glycol, refrigerant) to remove heat from the server tray (e.g., with or without a phase change of the cooling liquid).Type: ApplicationFiled: November 11, 2020Publication date: March 4, 2021Inventors: Jerry Chiu, Skyler Salman, Madhusudan Krishnan Iyengar
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Patent number: 10869412Abstract: Systems and methods for data center liquid cooling apparatus provisioning are described. In some aspects, such systems and methods may provision one or more data center liquid cooling apparatus, e.g., prior to such apparatus being put into service to a data center to cool data center devices, such as server trays (and more specifically, heat-generating devices such as processors, memories, voltage regulators, and other devices mounted on motherboards of the server trays). In some aspects, such liquid cooling apparatus include cold plates or evaporators that are mounted in thermal communication with the heat generating devices (in the server trays) and utilize a flow of a cooling liquid (e.g., water, glycol, refrigerant) to remove heat from the server tray (e.g., with or without a phase change of the cooling liquid).Type: GrantFiled: January 17, 2019Date of Patent: December 15, 2020Assignee: Google LLCInventors: Jerry Chiu, Skyler Salman, Madhusudan Krishnan Iyengar
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Patent number: 10863651Abstract: A server tray assembly includes a server tray support configured to receive a server board that includes a working fluid conduit fluidly coupled to a server board connector disposed on a back plane of the server board, a back wall of the server tray support includes a fluid connector configured to form an unbiased fluid connection with the server board connector; and a locking assembly secured to at least one of a server rack or the server tray support, the locking assembly disposed opposite the fluid connector is configured to engage a portion of the server board to bias the server board toward the fluid connector to fluidly seal the unbiased fluid connection between the server board connector and the fluid connector of the server tray support.Type: GrantFiled: September 24, 2018Date of Patent: December 8, 2020Assignee: Google LLCInventors: Madhusudan Krishnan Iyengar, Avinash Panga
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Publication number: 20200373222Abstract: Methods, systems, and apparatus, including an integrated circuit (IC) with a ring-shaped hot spot area. In one aspect, an IC includes a first area along an outside perimeter of a surface of the IC. The first area defines a first inner perimeter. The IC includes a second area that includes a center of the IC and that includes a first set of components. The second area defines a first outer. The IC includes a ring-shaped hot spot area between the first area and the second area. The ring-shaped hot spot area defines a ring outer perimeter that is juxtaposed with the first inner perimeter. The ring-shaped hot spot area defines a ring inner perimeter that is juxtaposed with the first outer perimeter. The ring-shaped hot spot area includes a second set of components that produce more heat than the first set of components.Type: ApplicationFiled: June 14, 2019Publication date: November 26, 2020Inventors: Madhusudan Krishnan Iyengar, Norman Paul Jouppi, Jorge Padilla, Christopher Gregory Malone
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Publication number: 20200296862Abstract: A server tray package includes a motherboard assembly that includes a plurality of data center electronic devices, the plurality of data center electronic devices including at least one heat generating processor device; and a liquid cold plate assembly. The liquid cold plate assembly includes a base portion mounted to the motherboard assembly, the base portion and motherboard assembly defining a volume that at least partially encloses the plurality of data center electronic devices; and a top portion mounted to the base portion and including a heat transfer member shaped to thermally contact the heat generating processor device, the heat transfer member including an inlet port and an outlet port that are in fluid communication with a cooling liquid flow path defined through the heat transfer member.Type: ApplicationFiled: June 2, 2020Publication date: September 17, 2020Inventors: Madhusudan Krishnan Iyengar, Christopher Gregory Malone, Yuan Li, Jorge Padilla, Woon-Seong Kwon, Teckgyu Kang, Norman Paul Jouppi
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Publication number: 20200187388Abstract: Systems and methods for data center liquid cooling apparatus provisioning are described. In some aspects, such systems and methods may provision one or more data center liquid cooling apparatus, e.g., prior to such apparatus being put into service to a data center to cool data center devices, such as server trays (and more specifically, heat-generating devices such as processors, memories, voltage regulators, and other devices mounted on motherboards of the server trays). In some aspects, such liquid cooling apparatus include cold plates or evaporators that are mounted in thermal communication with the heat generating devices (in the server trays) and utilize a flow of a cooling liquid (e.g., water, glycol, refrigerant) to remove heat from the server tray (e.g., with or without a phase change of the cooling liquid).Type: ApplicationFiled: January 17, 2019Publication date: June 11, 2020Inventors: Jerry Chiu, Skyler Salman, Madhusudan Krishnan Iyengar
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Patent number: 10681846Abstract: A server tray package includes a motherboard assembly that includes a plurality of data center electronic devices, the plurality of data center electronic devices including at least one heat generating processor device; and a liquid cold plate assembly. The liquid cold plate assembly includes a base portion mounted to the motherboard assembly, the base portion and motherboard assembly defining a volume that at least partially encloses the plurality of data center electronic devices; and a top portion mounted to the base portion and including a heat transfer member shaped to thermally contact the heat generating processor device, the heat transfer member including an inlet port and an outlet port that are in fluid communication with a cooling liquid flow path defined through the heat transfer member.Type: GrantFiled: April 19, 2018Date of Patent: June 9, 2020Assignee: Google LLCInventors: Madhusudan Krishnan Iyengar, Christopher Gregory Malone, Yuan Li, Jorge Padilla, Woon-Seong Kwon, Teckgyu Kang, Norman Paul Jouppi
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Patent number: 10645847Abstract: A data center cooling system includes a server rack sub-assembly that includes a motherboard mounted on a support member and a heat generating electronic devices mounted on the a motherboard; a cold plate positioned in thermal communication with at least a portion of the heat generating electronic devices, the cold plate configured to receive a flow of a cooling liquid circulated through a supply conduit fluidly coupled to a liquid inlet of the cold plate, through the cold plate, and through a return conduit fluidly coupled to a liquid outlet of the cold plate; and a modulating control valve attached to either of the motherboard or the support member and positioned in either of the supply conduit or the return conduit, the modulating control valve configured to adjust a rate of the flow of the cooling liquid based on an operating condition of at least one of the heat generating electronic devices.Type: GrantFiled: April 20, 2018Date of Patent: May 5, 2020Assignee: Google LLCInventors: William Edwards, Madhusudan Krishnan Iyengar, Sundar Rajan, Jorge Padilla, Norman Paul Jouppi
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Publication number: 20200100392Abstract: A server tray assembly includes a server tray support configured to receive a server board that includes a working fluid conduit fluidly coupled to a server board connector disposed on a back plane of the server board, a back wall of the server tray support includes a fluid connector configured to form an unbiased fluid connection with the server board connector; and a locking assembly secured to at least one of a server rack or the server tray support, the locking assembly disposed opposite the fluid connector is configured to engage a portion of the server board to bias the server board toward the fluid connector to fluidly seal the unbiased fluid connection between the server board connector and the fluid connector of the server tray support.Type: ApplicationFiled: September 24, 2018Publication date: March 26, 2020Inventors: Madhusudan Krishnan Iyengar, Avinash Panga
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Publication number: 20200100396Abstract: This disclosure describes a cooling system, for example, for rack mounted electronic devices (e.g., servers, processors, memory, networking devices or otherwise) in a data center. In various disclosed implementations, the cooling system may be or include a liquid cold plate assembly that is part of or integrated with a server tray package. In some implementations, the liquid cold plate assembly includes a base portion and a top portion that, in combination, form a cooling liquid flow path through which a cooling liquid is circulated and a thermal interface between one or more heat generating devices and the cooling liquid.Type: ApplicationFiled: September 24, 2018Publication date: March 26, 2020Inventors: Madhusudan Krishnan Iyengar, Jorge Padilla
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Patent number: 10548239Abstract: A cooling system, for example, for rack mounted electronic devices (e.g., servers, processors, memory, networking devices or otherwise) in a data center. In various disclosed implementations, the cooling system may be or include a liquid cold plate assembly that is part of or integrated with a server tray package. In some implementations, the liquid cold plate assembly includes a base portion and a top portion that, in combination, form a cooling liquid flow path through which a cooling liquid is circulated and a thermal interface between one or more heat generating devices and the cooling liquid.Type: GrantFiled: October 23, 2018Date of Patent: January 28, 2020Assignee: Google LLCInventors: Madhusudan Krishnan Iyengar, Gregory Sizikov, Yuan Li, Jorge Padilla, Woon-Seong Kwon, Teckgyu Kang
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Patent number: 10548240Abstract: A server tray package includes a motherboard assembly that includes a plurality of data center electronic devices; and a liquid cold plate assembly. The liquid cold plate assembly includes a base portion mounted to the motherboard assembly, the base portion and motherboard assembly defining a volume that at least partially encloses the plurality of data center electronic devices; and a top portion mounted to the base portion and including a heat transfer member that includes a first number of inlet ports and a second number of outlet ports that are in fluid communication with a cooling liquid flow path defined through the heat transfer member, the first number of inlet ports being different that the second number of outlet ports.Type: GrantFiled: January 11, 2019Date of Patent: January 28, 2020Assignee: Google LLCInventors: Madhusudan Krishnan Iyengar, Christopher Gregory Malone, Yuan Li, Jorge Padilla, Woon-Seong Kwon, Teckgyu Kang, Norman Paul Jouppi