Abstract: An electrically conductive resinous composition is prepared by cleaning the surface of copper flakes, mixing from about 25 to 75 percent by weight copper flakes with a resinous composition containing a curative selected from the group consisting of a dicyandiamide, a boron trifluoride releasing complex, a boron trichloride releasing complex or mixtures thereof, curing a layer of the resinous composition on an insulated substrate whereby a nonconductive layer is prepared and momentarily applying a voltage to the nonconductive resinous layer whereby the resinous layer becomes conductive. The one component resinous composition comprises from about 25 to about 70 percent by weight copper flakes with the balance of the compositions consisting of a resinous binder with from 1 to about 10 parts per hundred parts resinous binder of a curative selected from dicyandiamide, a boron trifluoride releasing complex, a boron trichloride complex and mixtures thereof.