Patents by Inventor Magan S. Patel

Magan S. Patel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrical and/or thermal interconnections and methods for obtaining such
    Patent number: 5189261
    Abstract: Circuit boards or cards containing metallic layers on opposite major surfaces of a dielectric substrate whereby electrical and/or thermal interconnection between the metallic layers is provided in vias that extend through one of the metallic layers, and the dielectric substrate and into the other metallic layer.
    Type: Grant
    Filed: October 9, 1990
    Date of Patent: February 23, 1993
    Assignee: IBM Corporation
    Inventors: Lawrence C. Alexander, Bernd K. Appelt, David K. Balkin, James J. Hansen, Joseph Hromek, Ronald A. Kaschak, John M. Lauffer, Irving Memis, Magan S. Patel, Andrew M. Seman, Robin A. Susko