Patents by Inventor Magnus KALLMARK

Magnus KALLMARK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12114467
    Abstract: The invention relates to a heatsink for transferring heat from one or more electrical devices to a heat transfer medium. The heatsink includes a plurality of fins arranged on a frontside of the heatsink. The plurality of fins includes a first group of fins extending in a first planar direction and a second group of fins extending in a second planar direction angled in relation to the first planar direction. For example, the first group of fins may extend from the bottom to the top of the heatsink, while the second group of fins may extend from the first group of fins to the sides of the heatsink. In this way, the sides of the heatsink can be used as air outlets and the airflow through the heatsink can be increased.
    Type: Grant
    Filed: July 22, 2022
    Date of Patent: October 8, 2024
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Magnus Kallmark, Fredrik Ohlsson, Vadim Tsoi, Reine Granstrom
  • Publication number: 20220361372
    Abstract: The invention relates to a heatsink for transferring heat from one or more electrical devices to a heat transfer medium. The heatsink includes a plurality of fins arranged on a frontside of the heatsink. The plurality of fins includes a first group of fins extending in a first planar direction and a second group of fins extending in a second planar direction angled in relation to the first planar direction. For example, the first group of fins may extend from the bottom to the top of the heatsink, while the second group of fins may extend from the first group of fins to the sides of the heatsink. In this way, the sides of the heatsink can be used as air outlets and the airflow through the heatsink can be increased.
    Type: Application
    Filed: July 22, 2022
    Publication date: November 10, 2022
    Inventors: Magnus KALLMARK, Fredrik OHLSSON, Vadim TSOI, Reine GRANSTROM
  • Patent number: 9258927
    Abstract: A heat transfer arrangement for heat exchange between an inside of an electronic component housing and an ambient environment. The heat transfer arrangement comprises a refrigerant circuit with an evaporator a condenser and conduits (202). A refrigerant is arranged to self-circulate in a refrigerant flow in the refrigerant circuit. A flow control device (124) comprises a movable member (206) adapted to control the refrigerant flow. The movable member (206) affects a through flow area of one of the conduits (202). The movable member (206) is adapted to move in response to a pressure change inside the refrigerant circuit by being affected from a first side by a refrigerant pressure inside the refrigerant circuit and from a second side by a spring force such that the refrigerant flow is changed.
    Type: Grant
    Filed: September 15, 2009
    Date of Patent: February 9, 2016
    Assignee: Telefonaktiebolaget L M Ericsson (publ)
    Inventors: Magnus Källmark, Klas Hedberg, Fredrik Jonsson
  • Patent number: 9198329
    Abstract: The present invention relates to a method in a cabinet and a cabinet for controlling the temperature inside the cabinet. The cabinet is comprised in a radio network node. The cabinet comprises a first set of electronic equipment and a second set of electronic equipment, a first climate system and a second climate system. The first and second climate systems are arranged to transfer heat from an internal volume to an external volume of the cabinet. A first air flow is generated using a first air moving device of the first climate system, which first air flow substantially affects the first set of electronic equipment. A second air flow is generated using a second air moving device of the second climate system, which second air flow substantially affects the second set of electronic equipment. A temperature is measured within the internal volume by using a temperature sensor.
    Type: Grant
    Filed: April 22, 2010
    Date of Patent: November 24, 2015
    Assignee: Telefonaktiebolaget L M Ericsson (publ)
    Inventors: Klas Hedberg, Magnus Källmark
  • Patent number: 8650891
    Abstract: A heat transfer arrangement (100) comprises a refrigerant circuit (102), which refrigerant circuit (102) comprises an evaporator (104) adapted to be arranged inside an electronic component housing (112), a condenser (108) adapted to be arranged outside the electronic component housing (112), a first conduit (106) and a second conduit (110). A refrigerant is present in the refrigerant circuit (102) and in use is arranged to self-circulate by evaporating in the evaporator (104), rising as a gas through the first conduit (106), condensing in the condenser (108) and flowing through the second conduit (110) to the evaporator (104). The heat transfer arrangement (100) further comprises a reservoir (124) for liquid refrigerant connected to the refrigerant circuit (102).
    Type: Grant
    Filed: April 16, 2009
    Date of Patent: February 18, 2014
    Assignee: Telefonaktiebolaget L M Ericsson (publ)
    Inventors: Fredrik Jonsson, Klas Hedberg, Magnus Källmark
  • Publication number: 20130025314
    Abstract: The present invention relates to a method in a cabinet and a cabinet for controlling the temperature inside the cabinet. The cabinet is comprised in a radio network node. The cabinet comprises a first set of electronic equipment and a second set of electronic equipment, a first climate system and a second climate system. The first and second climate systems are arranged to transfer heat from an internal volume to an external volume of the cabinet. A first air flow is generated using a first air moving device of the first climate system, which first air flow substantially affects the first set of electronic equipment. A second air flow is generated using a second air moving device of the second climate system, which second air flow substantially affects the second set of electronic equipment. A temperature is measured within the internal volume by using a temperature sensor.
    Type: Application
    Filed: April 22, 2010
    Publication date: January 31, 2013
    Applicant: TELEFONAKTIEBOLAGET LM ERICSSON (PUBL)
    Inventors: Klas Hedberg, Magnus Källmark
  • Publication number: 20120186291
    Abstract: A heat transfer arrangement for heat exchange between an inside of an electronic component housing and an ambient environment. The heat transfer arrangement comprises a refrigerant circuit with an evaporator a condenser and conduits (202). A refrigerant is arranged to self-circulate in a refrigerant flow in the refrigerant circuit. A flow control device (124) comprises a movable member (206) adapted to control the refrigerant flow. The movable member (206) affects a through flow area of one of the conduits (202). The movable member (206) is adapted to move in response to a pressure change inside the refrigerant circuit by being affected from a first side by a refrigerant pressure inside the refrigerant circuit and from a second side by a spring force such that the refrigerant flow is changed.
    Type: Application
    Filed: September 15, 2009
    Publication date: July 26, 2012
    Applicant: TELEFONAKTIEBOLAGET LM ERICSSON (PUBL)
    Inventors: Magnus Källmark, Klas Hedberg, Fredrik Jonsson
  • Publication number: 20120031123
    Abstract: A heat transfer arrangement (100) comprises a refrigerant circuit (102), which refrigerant circuit (102) comprises an evaporator (104) adapted to be arranged inside an electronic component housing (112), a condenser (108) adapted to be arranged outside the electronic component housing (112), a first conduit (106) and a second conduit (110). A refrigerant is present in the refrigerant circuit (102) and in use is arranged to self-circulate by evaporating in the evaporator (104), rising as a gas through the first conduit (106), condensing in the condenser (108) and flowing through the second conduit (110) to the evaporator (104). The heat transfer arrangement (100) further comprises a reservoir (124) for liquid refrigerant connected to the refrigerant circuit (102).
    Type: Application
    Filed: April 16, 2009
    Publication date: February 9, 2012
    Applicant: TELEFONAKTIEBOLAGET LM ERICSSON (PUBL)
    Inventors: Fredrik Jonsson, Klas Hedberg, Magnus Källmark