Abstract: To efficiently cool down heat of a heating element 20, this electronic device 100 is provided with a circuit board 10 having a heating element 20 that is attached to a first main surface 11 thereof, a case 30 having an opening part 31 that is formed in a surface facing the heating element 20 and housing a refrigerant COO therein, and a connection part 40 connecting the opening part 31 and the heating element 20 so as to enclose the refrigerant COO, the connecting part has a thickness of at most 0.21 mm.

Abstract: An outdoor unit in which, by installing small fans near the ventilation surface of a heat exchanger so as to be parallel with the ventilation surface of the heat exchanger and arranging the small fans so that the ventilation areas of the small fans and the heat exchanger are equivalent, the number of small fans that can be installed is maximized while reducing power consumption.

Abstract: An outdoor unit includes a fan, a heat exchanger, a vapor pipe, a liquid pipe, and a refrigerant flowing through these pipes, in which the heat exchanger is a parallel flow heat exchanger divided into a plurality and connected in parallel between the vapor pipe and the liquid pipe. The heat exchanger is connected from the vapor pipe via a vapor branch pipe, and the heat exchanger is connected from the vapor pipe via the vapor branch pipe. In addition, the liquid pipe is connected from the heat exchanger via the liquid branch pipe, and the liquid pipe is connected from the heat exchanger via the liquid branch pipe.

Abstract: Provided are a phase change cooler with enhanced cooling performance and enhanced pressure resistance performance, and an electronic device using such a phase change cooler. The phase change cooler includes a heat receiving unit, a heat dissipating unit, a vapor pipe and a liquid pipe that interconnect the heat receiving unit and the heat dissipating unit to form a loop, and refrigerant encapsulated inside the phase change cooler. The heat receiving unit has an approximately semicircular cross section, and the vapor pipe is coupled to an inclined face of the heat receiving unit.

Abstract: An evaporator includes: a first surface which conducts heat; a heat medium in the evaporator, which vaporizes as a result of the heat absorbed; a condenser which liquefies the heat medium in a vaporized state; a vapour pipe which guides the heat medium in the vaporized state from the evaporator to the condenser; and a liquid pipe which guides the heat medium in a liquefied state from the condenser to the evaporator. A first opening of the vapour pipe and a second opening of the liquid pipe are disposed in different positions from each other in a first direction, and are disposed so as to open into a heat medium accommodation space inside the evaporator at different positions from each other in a second direction, and which is different to the first direction, and also at different positions from each other in a third direction which intersects the first surface.

Abstract: This electronic apparatus 100 comprises a heating element 20, and a case 30. The case 30 has an opening hole 31. In order that a refrigerant COO will be sealed between the case 30 and the heating element 20, the outer periphery part of a first heating element external surface 21, which is the external surface of the heating element 20, is attached to the outer periphery part of the opening hole 31. Also, the refrigerant COO is a refrigerant that is capable of phase change from a liquid refrigerant LP-COO to a gas phase refrigerant GP-COO. As a result, it is possible to more efficiently cool the heat of the heating element 20.

Abstract: An evaporator includes: a first surface which conducts heat; a heat medium in the evaporator, which vaporizes as a result of the heat absorbed; a condenser which liquefies the heat medium in a vaporized state; a vapour pipe which guides the heat medium in the vaporized state from the evaporator to the condenser; and a liquid pipe which guides the heat medium in a liquefied state from the condenser to the evaporator. A first opening of the vapour pipe and a second opening of the liquid pipe are disposed in different positions from each other in a first direction, and are disposed so as to open into a heat medium accommodation space inside the evaporator at different positions from each other in a second direction, and which is different to the first direction, and also at different positions from each other in a third direction which intersects the first surface.

Abstract: A cooler grows in size and its structure becomes complicated in a phase-change cooler if it is intended to cool a plurality of heating elements; therefore, a phase-change cooler according to an exemplary aspect of the present invention includes a heat-conducting board configured to be thermally connected to a cooling object; heat receiving means for storing a refrigerant and receiving heat of the cooling object through the heat-conducting board; radiation means for radiating heat, condensing and devolatilizing a vapor-phase refrigerant arising from vaporization of the refrigerant in the heat receiving means; and connection means for connecting the heat receiving means and the radiation means.

Abstract: Provided are a phase change cooler with enhanced cooling performance and enhanced pressure resistance performance, and an electronic device using such a phase change cooler. The phase change cooler includes a heat receiving unit, a heat dissipating unit, a vapor pipe and a liquid pipe that interconnect the heat receiving unit and the heat dissipating unit to form a loop, and refrigerant encapsulated inside the phase change cooler. The heat receiving unit has an approximately semicircular cross section, and the vapor pipe is coupled to an inclined face of the heat receiving unit.

Abstract: The cooling system according to the present invention comprises a heat-receiving section including an approximately constant cross-sectional area along a longitudinal direction. The longitudinal direction is a direction in which a length of the heat-receiving section is longest and a direction along an arrangement of the heat source in the cooling region. The cooling system also comprises a supply tube for supplying a refrigerant in a liquid state into the heat-receiving section, and a recovery tube for recovering the refrigerant, which is vaporized upon reception of heat, from an inside of the heat-receiving section. The cooling system further comprises a heat radiation section for cooling the recovered refrigerant and supplying the refrigerant in a liquid state to the supply tube. The heat-receiving section comprises a refrigerant pathway which causes the refrigerant supplied from the supply tube to flow out into the heat-receiving section along the longitudinal direction.

Abstract: A cooling device 100 includes a first heat receiving unit 400, a second heat receiving unit 410, a first heat dissipating unit 700, and a second heat dissipating unit 710. The first heat dissipating unit 700 and the second heat dissipating unit 710 have a flat plate shape and have a structure in which air passes in a direction approximately perpendicular to a principal surface having a flat plate shape and a first principal surface 730 that is a principal surface having a flat plate shape in the first heat dissipating unit 700 and a second principal surface 740 that is a principal surface having a flat plate shape in the second heat dissipating unit 710 are arranged so as to face to each other. As a result, the size of the cooling device 100 can be reduced without degrading a heat dissipation performance to dissipate heat generated by a heat generating element.

Abstract: A cooler grows in size and its structure becomes complicated in a phase-change cooler if it is intended to cool a plurality of heating elements; therefore, a phase-change cooler according to an exemplary aspect of the present invention includes a heat-conducting board configured to be thermally connected to a cooling object; heat receiving means for storing a refrigerant and receiving heat of the cooling object through the heat-conducting board; radiation means for radiating heat, condensing and devolatilizing a vapor-phase refrigerant arising from vaporization of the refrigerant in the heat receiving means; and connection means for connecting the heat receiving means and the radiation means.

Abstract: A cooling device 100 includes a first heat receiving unit 400, a second heat receiving unit 410, a first heat dissipating unit 700, and a second heat dissipating unit 710. The first heat dissipating unit 700 and the second heat dissipating unit 710 have a flat plate shape and have a structure in which air passes in a direction approximately perpendicular to a principal surface having a flat plate shape and a first principal surface 730 that is a principal surface having a flat plate shape in the first heat dissipating unit 700 and a second principal surface 740 that is a principal surface having a flat plate shape in the second heat dissipating unit 710 are arranged so as to face to each other. As a result, the size of the cooling device 100 can be reduced without degrading a heat dissipation performance to dissipate heat generated by a heat generating element.

Abstract: A control mechanism becomes complex when an optimum volume of refrigerant is stably supplied to a plurality of objects to be cooled that have differing heat generation values. The present invention is a cooling system which comprises a first refrigerant tank that stores a liquid-phase refrigerant, a plurality of evaporators that gasify the liquid-phase refrigerant supplied from the first refrigerant tank, a condenser that liquefies the gas-phase refrigerant that was gasified by the evaporators, a vapor pipe that connects the evaporators and the condenser and in which the gas-phase refrigerant flows, and a liquid pipe that connects the condenser and the first refrigerant tank and connects the first refrigerant tank and the plurality of evaporators and in which the liquid-phase refrigerant flows, wherein the condenser is located higher than the plurality of evaporators, and the first refrigerant tank is located lower than the condenser.

Abstract: This cooling device has: an evaporation section for storing a refrigerant; a condensation section for radiating the heat of a gas-phase refrigerant, which has been gasified by the evaporation section, by condensing and liquefying the gas-phase refrigerant; a vapor pipe for transporting the gas-phase refrigerant to the condensation section; a liquid pipe for transporting a liquid-phase refrigerant, which has been condensed by the condensation section, to the evaporation section; and a mounting plate provided with a connection structure connected to the device side which is to be cooled. The evaporation section is disposed on one surface of the mounting plate, and the condensation section is disposed on the other side of the mounting plate.