Patents by Inventor Maho KAWAKAMI

Maho KAWAKAMI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240405328
    Abstract: A thermal insulation material for a battery of the present invention includes a compression adjustment layer and a thermal insulation layer laminated to each other. A ratio of a thickness of the compression adjustment layer to a thickness of the thermal insulation layer is more than 0.5 and less than 4.5, and a compressive stress is from 0.34 MPa through 3.45 MPa when the compression adjustment layer is compressed and deformed at any rate within a range of from 25% through 70% in a thickness direction with respect to a thickness before compression.
    Type: Application
    Filed: September 27, 2022
    Publication date: December 5, 2024
    Applicant: NITTO DENKO CORPORATION
    Inventors: Takehiro UI, Shu SASAKI, Kazuhiro FUKE, Maho KAWAKAMI
  • Publication number: 20240400464
    Abstract: An object is to provide a thermal insulation material excellent in both thermal insulation property and mechanical strength. A thermal insulation material includes a thermal insulation layer containing silicon dioxide particles and inorganic fibers, and is excellent in both thermal insulation property and mechanical strength, because density ? [g/cm3] of thermal insulation layer, and a cumulative proportion R1 for a fiber length of >0 mm and <4 mm regarding inorganic fibers contained in the thermal insulation layer and a cumulative proportion R2 for a fiber length of ?3 mm and <30 mm regarding inorganic fibers contained in the thermal insulation layer satisfy a relational expression (I) below, R1 and R2 being calculated according to predetermined calculation formulae when the inorganic fibers contained in the thermal insulation layer are summed up based on predetermined conditions. 0.23 R 1 + 0.24 < ? ? - 0.11 ? R 2 + 0.
    Type: Application
    Filed: October 5, 2022
    Publication date: December 5, 2024
    Applicant: NITTO DENKO CORPORATION
    Inventors: Maho KAWAKAMI, Shu SASAKI, Kazuhiro FUKE