Abstract: A chemically amplified positive-type photosensitive resin composition capable of forming a resist pattern having a nonresist portion with a favorable rectangular sectional shape, a method of manufacturing a resist pattern using the composition, a method of manufacturing a substrate with a template using the composition, and a method of manufacturing a plated article using the substrate with a template manufactured by the method. In a chemically amplified positive-type photosensitive resin composition including an acid generator, a resin whose solubility in alkali increases under the action of acid, and an organic solvent, an acrylic resin is used that includes a constituent unit derived from an acrylic acid ester including an —SO2-containing cyclic group or a lactone-containing cyclic group, and a constituent unit derived from an acrylic acid ester containing an organic group including an aromatic group and an alcoholic hydroxyl group.

Abstract: A method for forming a patterned cured film using a negative photosensitive composition. The composition includes a photopolymerizable compound and a photopolymerization initiator including an oxime ester compound of a specific structure having a 9,9-disubstituted fluorenyl group which is used for formation of a thick film resist pattern. The composition is mixed with an alkali-soluble resin which is a polymer of a monomer having an unsaturated double bond and includes a unit derived from a monomer having an aromatic group.

Abstract: A chemically amplified positive-type photosensitive resin composition capable of forming a resist pattern having a nonresist portion with a favorable rectangular sectional shape, a method of manufacturing a resist pattern using the composition, a method of manufacturing a substrate with a template using the composition, and a method of manufacturing a plated article using the substrate with a template manufactured by the method. In a chemically amplified positive-type photosensitive resin composition including an acid generator, a resin whose solubility in alkali increases under the action of acid, and an organic solvent, an acrylic resin is used that includes a constituent unit derived from an acrylic acid ester including an —SO2-containing cyclic group or a lactone-containing cyclic group, and a constituent unit derived from an acrylic acid ester containing an organic group including an aromatic group and an alcoholic hydroxyl group.

Abstract: A resist composition including a base component that exhibits changed solubility in an alkali developing solution under the action of acid, an acid-generator component that generates acid upon exposure, and a nitrogen-containing organic compound, the acid generator component including an acid generator represented by general formula (b0), the nitrogen-containing organic compound including a compound represented by general formula (d1) or general formula (d2) in which each of R1 and R2 represents an aryl group or an alkyl group, Rf represents a fluorinated alkyl group, X?represents a counter anion, each of R3 and R4 represents an aliphatic hydrocarbon group, R5 represents a hydrocarbon group having 5 or more carbon atoms, and each of R6 and R7 independently represents a hydrogen atom, an aliphatic hydrocarbon group, or —C(?O)—O—R5.

Abstract: A chemically amplified positive-type photosensitive resin composition for thick-film application capable of forming a resist pattern having a nonresist section with a good rectangular cross-sectional shape under a low exposure level even when a resist pattern having a film thickness of 10 ?m or more is formed. A chemically amplified positive-type photosensitive resin composition for thick-film application comprising an acid generator and an organic solvent, in which an acrylic resin is added that contains a constituent unit derived from an acrylic acid ester comprising an —SO2-containing cyclic group or a lactone-containing cyclic group as a resin whose solubility in alkali increases under the action of acid.

Abstract: A chemically amplified photosensitive resin composition including a compound represented by formula (1) and/or formula (4), a resin having an acid-dissociative dissolution-controlling group whose solubility in alkali increases under the action of an acid or an alkali-soluble resin, a photoacid generator, and an organic solvent, in which the solid concentration is 40% by mass to 65% by mass. R1, R2, and R3 independently represent a hydrogen atom or an alkyl group, R4 represents a group represented by formula (2) or (3), and R5 and R6 represent a monovalent hydrocarbon group which may have a substituent.

Abstract: A chemically amplified positive-type photosensitive resin composition including a compound represented by the following formula (1), having a melting point of 40° C. or lower at 1 atm, a resin whose solubility in alkali increases under the action of an acid, and a photoacid generator. In the formula, R1 represents a hydrogen atom or an organic group; and R2, R3, and R4 independently represent a monovalent hydrocarbon group which may have a substituent, and at least two of R2, R3, and R4 may be bonded to each other to form a cyclic structure.

Abstract: A chemically amplified positive-type photosensitive resin composition for thick-film application capable of forming a resist pattern having a nonresist section with a good rectangular cross-sectional shape under a low exposure level even when a resist pattern having a film thickness of 10 ?m or more is formed. A chemically amplified positive-type photosensitive resin composition for thick-film application comprising an acid generator and an organic solvent, in which an acrylic resin is added that contains a constituent unit derived from an acrylic acid ester comprising an —SO2— containing cyclic group or a lactone-containing cyclic group as a resin whose solubility in alkali increases under the action of acid.

Abstract: A chemically amplified positive-type photosensitive resin composition including a compound represented by the following formula (1), having a melting point of 40° C. or lower at 1 atm, a resin whose solubility in alkali increases under the action of an acid, and a photoacid generator. In the formula, R1 represents a hydrogen atom or an organic group; and R2, R3, and R4 independently represent a monovalent hydrocarbon group which may have a substituent, and at least two of R2, R3, and R4 may be bonded to each other to form a cyclic structure.

Abstract: A chemically amplified photosensitive resin composition including a compound represented by formula (1) and/or formula (4), a resin having an acid-dissociative dissolution-controlling group whose solubility in alkali increases under the action of an acid or an alkali-soluble resin, a photoacid generator, and an organic solvent, in which the solid concentration is 40% by mass to 65% by mass. R1, R2, and R3 independently represent a hydrogen atom or an alkyl group, R4 represents a group represented by formula (2) or (3), and R5 and R6 represent a monovalent hydrocarbon group which may have a substituent.

Abstract: A resist composition including a base component (A) which exhibits changed solubility in a developing solution under the action of acid and an acid-generator component (B) which generates acid upon exposure, the base component (A) containing a resin component (A1) including a structural unit (a0) represented by general formula (a0-1) shown below and a structural unit derived from an acrylate ester which may have the hydrogen atom bonded to the carbon atom on the ?-position substituted with a substituent and contains an acid decomposable group which exhibits increased polarity by the action of acid (wherein R represents a hydrogen atom, an alkyl group of 1 to 5 carbon atoms or a halogenated alkyl group of 1 to 5 carbon atoms).

Abstract: A method of forming a film including forming a film on a substrate by coating a composition for forming a film containing a solvent and a resin by a spin coating method, in which a maximum radius among the radii from the center to the outer periphery of the substrate is 150 mm or more and a thickness of the film is 50 ?m or more, a vapor pressure of the solvent at 25° C. is 0.4 kPa or less, and a viscosity of the solvent measured by a Cannon-Fenske viscometer at 25° C. is 1.5 mPa·s or less.

Abstract: A resist composition including a base component (A) which exhibits changed solubility in a developing solution under the action of acid and an acid-generator component (B) which generates acid upon exposure, the base component (A) containing a polymeric compound (A1) including a structural unit (a0) represented by general formula (a0-1) and a structural unit (a1) containing an acid decomposable group which exhibits increased polarity by the action of acid (R1 represents a hydrogen atom, an alkyl group of 1 to 5 carbon atoms or a halogenated alkyl group of 1 to 5 carbon atoms; W represents —COO—, a —CONH— group or a divalent aromatic hydrocarbon group; Y1 and Y2 represent a divalent linking group or a single bond; R?1 represents a hydrogen atom or an alkyl group of 1 to 6 carbon atoms; R?2 represents a monovalent aliphatic hydrocarbon group; and R2 represents an —SO2— containing cyclic group).

Abstract: A resist composition for immersion exposure and a method of forming a resist pattern which can satisfy both of excellent resistance to an immersion medium and lithography properties. The resist composition for immersion exposure includes a resin component (A) which exhibits changed alkali solubility under action of acid and an acid-generator component (B) which generates acid upon irradiation, the resin component (A) including a resin (A1) which contains a fluorine atom and a resin (A2) which has a structural unit (a?) derived from acrylic acid and contains no fluorine atom, and the amount of the resin (A1) contained in the resin component (A) being within the range from 0.1 to 50% by weight.

Abstract: A resist composition including a base component (A) which exhibits changed solubility in a developing solution under the action of acid and an acid-generator component (B) which generates acid upon exposure, the base component (A) containing a polymeric compound (A1) including a structural unit (A) represented by general formula (a0-1) and a structural unit (a1) containing an acid decomposable group which exhibits increased polarity by the action of acid (R1 represents a hydrogen atom, an alkyl group of 1 to 5 carbon atoms or a halogenated alkyl group of 1 to 5 carbon atoms; W represents —COO—, a —CONH— group or a divalent aromatic hydrocarbon group; Y1 and Y2 represent a divalent linking group or a single bond; represents a hydrogen atom or an alkyl group of 1 to 6 carbon atoms; R?2 represents a monovalent aliphatic hydrocarbon group; and R2 represents an —SO2— containing cyclic group).

Abstract: A resist composition for immersion lithography of the present invention includes a resin component (A) which exhibits changed alkali solubility under the action of acid; and an acid generator component (B) which generates acid on exposure, wherein the resin component (A) includes a resin (A1) containing a fluorine atom and no acid-dissociable group, and a resin (A2) containing a structural unit (a?) derived from an acrylic acid and no fluorine atom.

Abstract: A resist composition including a base component (A) which exhibits changed solubility in a developing solution under the action of acid and an acid-generator component (B) which generates acid upon exposure, the base component (A) containing a resin component (A1) including a structural unit (a0) represented by general formula (a0-1) shown below and a structural unit derived from an acrylate ester which may have the hydrogen atom bonded to the carbon atom on the ?-position substituted with a substituent and contains an acid decomposable group which exhibits increased polarity by the action of acid (wherein R represents a hydrogen atom, an alkyl group of 1 to 5 carbon atoms or a halogenated alkyl group of 1 to 5 carbon atoms).

Abstract: Provided are a novel positive resist composition that includes a low molecular weight material as a base material component, and a method of forming a resist pattern using the positive resist composition. A positive resist composition including: a base material component (A) that exhibits increased solubility in an alkali developing solution under the action of acid; and an acid generator component (B) that generates acid upon exposure, wherein the base material component (A) comprises a compound (A1) in which either a portion of, or all of, the hydrogen atoms of hydroxyl groups (—OH) within a phenolic compound (I) described below have been substituted with a group containing an acid dissociable, dissolution inhibiting group: the phenolic compound (I) including 4 triphenylmethane structures, and a tetravalent linking moiety that links the 4 triphenylmethane structures, wherein at least one of the 4 triphenylmethane structures has at least one phenolic hydroxyl group.

Abstract: A positive resist composition including a resin component (A) which exhibits increased solubility in an alkali developing solution under action of acid and an acid-generator component (B) which generates acid upon exposure, the resin component (A) including a structural unit (a0) represented by general formula (a0) (wherein R represents a hydrogen atom, a lower alkyl group of 1 to 5 carbon atoms or a halogenated lower alkyl group of 1 to 5 carbon atoms; Q represents a divalent linking group containing a nitrogen atom or an oxygen atom; R6 represents a lower alkyl group of 1 to 5 carbon atoms or an alkoxy group of 1 to 5 carbon atoms; p represents an integer of 1 to 3; and q represents an integer of 0 to 2) and a structural unit (a1) derived from an acrylate ester containing an acid dissociable, dissolution inhibiting group exclusive of groups that exhibit aromaticity.

Abstract: A resist composition for immersion exposure and a method of forming a resist pattern which can satisfy both of excellent resistance to an immersion medium and lithography properties. The resist composition for immersion exposure includes a resin component (A) which exhibits changed alkali solubility under action of acid and an acid-generator component (B) which generates acid upon irradiation, the resin component (A) including a resin (A1) which contains a fluorine atom and a resin (A2) which has a structural unit (a?) derived from acrylic acid and contains no fluorine atom, and the amount of the resin (A1) contained in the resin component (A) being within the range from 0.1 to 50% by weight.