Patents by Inventor Makoto Akita

Makoto Akita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240100799
    Abstract: A printing device, a printing machine, and a box making machine are provided with printing cylinders on which printing plates can be mounted, ink supply rolls that are placed on the upstream or downstream sides of the printing cylinders in a sheet-conveying direction and that can be in contact with the printing cylinders, ink supply units that can supply ink to the ink supply rolls, first covers that cover the upper parts of the printing cylinders in the vertical direction and that can be opened and closed, and footholds that cover the vertically upper parts of the ink supply rolls and that can be operated by an operator.
    Type: Application
    Filed: October 28, 2021
    Publication date: March 28, 2024
    Inventors: Mitsuhiro NADACHI, Kazuya AKITA, Makoto SHIMOHATSUBO
  • Patent number: 9946157
    Abstract: A resist composition contains: a novolak resin (A1) having a protective group capable of being cleaved by action of an acid, an acid generator (B), an anticorrosive agent (G), and a solvent (D) as well as a method for producing a resist pattern includes steps (1) to (4); (1) applying the resist composition according to the above onto a substrate; (2) drying the applied composition to form a composition layer; (3) exposing the composition layer; and (4) developing the exposed composition layer.
    Type: Grant
    Filed: March 30, 2016
    Date of Patent: April 17, 2018
    Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Maki Kawamura, Makoto Akita
  • Publication number: 20160291464
    Abstract: A resist composition contains: a novolak resin (A1) having a protective group capable of being cleaved by action of an acid, an acid generator (B), an anticorrosive agent (G), and a solvent (D) as well as a method for producing a resist pattern includes steps (1) to (4); (1) applying the resist composition according to the above onto a substrate; (2) drying the applied composition to form a composition layer; (3) exposing the composition layer; and (4) developing the exposed composition layer.
    Type: Application
    Filed: March 30, 2016
    Publication date: October 6, 2016
    Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Maki KAWAMURA, Makoto AKITA
  • Patent number: 8808960
    Abstract: A compound represented by the formula (I): wherein R1 represents a hydrogen atom etc., R2 and R3 each independently represent a hydrogen atom etc., R4 represents a C1-C8 divalent hydrocarbon group, R5 represents a single bond etc., and R6 represents an unsubstituted or substituted C6-C20 aromatic hydrocarbon group, a polymer comprising a structural unit derived from the compound represented by the formula (I) and a chemically amplified positive resist composition comprising the polymer, at least one acid generator and at least one solvent.
    Type: Grant
    Filed: March 8, 2010
    Date of Patent: August 19, 2014
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Makoto Akita, Isao Yoshida, Kazuhiko Hashimoto
  • Patent number: 7972763
    Abstract: The present invention provides a chemically amplified positive resist composition comprising (A) a resin obtainable by reacting a novolak resin, a poly(hydroxystyrene) and a compound having at least two vinyl ether structures, and (B) an acid generator.
    Type: Grant
    Filed: November 13, 2007
    Date of Patent: July 5, 2011
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Masumi Suetsugu, Makoto Akita, Kazuhiko Hashimoto
  • Patent number: 7893293
    Abstract: A chemically amplified positive resist composition comprising (A) a resin which comprises (i) a polymerization unit represented by the formula (I): wherein R7 represents a hydrogen atom etc., R8 represents a C1-C4 alkyl group, p represents an integer of 1 to 3, and q represents an integer of 0 to 2, (ii) at least one polymerization unit selected from a group consisting of a polymerization unit represented by the formula (II): wherein R1 represents a hydrogen atom etc., R2 represents a C1-C8 alkyl group and ring X represents an alicyclic hydrocarbon group, and a polymerization unit represented by the formula (IV): wherein R3 represents a hydrogen atom etc., R4 and R5 independently represents a hydrogen atom etc., R10 represents a C1-C6 alkyl group etc., and (iii) a polymerization unit represented by the formula (III): wherein R3, R4 and R5 are the same as defined above, E represents a divalent hydrocarbon group, G represents a single bond etc., Z represents a carbonyl group etc.
    Type: Grant
    Filed: June 20, 2008
    Date of Patent: February 22, 2011
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Makoto Akita, Isao Yoshida, Kazuhiko Hashimoto
  • Patent number: 7861908
    Abstract: A component mounting apparatus includes a component feeder that feeds a component with its bump electrodes facing down, a mounting head that mounts the component onto a substrate, a supporting base that secures the substrate, and a positioning device that aligns the component with the substrate. The mounting head includes an ultrasonic vibration generator, an ultrasonic vibration propagation member that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face holding the component as vibration parallel thereto, a pressure loader that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto, and a heater that heats the vicinity of the working face. Thereby, ultrasonic bonding is carried out with high reliability even if the component has a number of bump electrodes on its face.
    Type: Grant
    Filed: March 30, 2007
    Date of Patent: January 4, 2011
    Assignee: Panasonic Corporation
    Inventors: Shozo Minamitani, Takaharu Mae, Yasuharu Ueno, Akira Yamada, Shinji Kanayama, Makoto Akita, Nobuhisa Watanabe, Akira Mori, Hiroyuki Naito, Shinya Marumo, Makoto Morikawa
  • Publication number: 20100233628
    Abstract: A compound represented by the formula (I): wherein R1 represents a hydrogen atom etc., R2 and R3 each independently represent a hydrogen atom etc., R4 represents a C1-C8 divalent hydrocarbon group, R5 represents a single bond etc., and R6 represents an unsubstituted or substituted C6-C20 aromatic hydrocarbon group, a polymer comprising a structural unit derived from the compound represented by the formula (I) and a chemically amplified positive resist composition comprising the polymer, at least one acid generator and at least one solvent.
    Type: Application
    Filed: March 8, 2010
    Publication date: September 16, 2010
    Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Makoto AKITA, Isao Yoshida, Kazuhiko Hashimoto
  • Patent number: 7794913
    Abstract: A chemically amplified positive resist composition comprising (A) a resin which comprises (i) a polymerization unit represented by the formula (I): (ii) a polymerization unit represented by the formula (II): and (iii) at least one polymerization unit selected from the group consisting of a polymerization unit represented by the formula (III): and a polymerization unit represented by the formula (IV): and (B) at least one acid generator.
    Type: Grant
    Filed: May 15, 2008
    Date of Patent: September 14, 2010
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Makoto Akita, Masumi Suetsugu, Kazuhiko Hashimoto
  • Patent number: 7759045
    Abstract: A chemically amplified positive resist composition comprising (A) a salt represented by the formula (I): A+?O3S—R??(I) wherein R represents a 9,10-anthraquinonyl group which may be substituted with at least one group selected from the group consisting of a C1-C4 alkyl group, a C1-C4 alkoxy group and a hydroxyl group, and the C1-C4 alkyl group and the C1-C4 alkoxy group may be substituted, and A+ represents an organic counter cation, and (B) a resin which contains a structural unit which has an acid-labile group and which itself is insoluble or poorly soluble in an aqueous alkali solution but becomes soluble in an aqueous alkali solution by the action of an acid.
    Type: Grant
    Filed: June 24, 2008
    Date of Patent: July 20, 2010
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Makoto Akita, Isao Yoshida, Yukako Harada
  • Publication number: 20100074738
    Abstract: A blower (1) has a blow fan (20) provided in a casing (10), a drive device (30) for rotating the blow fan (20), and a blow duct (40) for discharging airflow outside, which the air flow is generated by the rotating blow fan (20), wherein a dust proof cover (60) is attached to a suction inlet (11) formed in the casing (10), and openings (64a, 65a) for drawing outside air are formed in the left and right side faces (64, 65) of the dust proof cover (60), and the left and right side faces (64, 65) are inclined inward in the right-and-left width direction as they extend downward. According to such a configuration, the openings (64a, 65a) of the dust proof cover (60) are prevented from being clogged with dust such as dead leaves to prevent overheating of the drive device (30).
    Type: Application
    Filed: September 7, 2007
    Publication date: March 25, 2010
    Applicant: SHINDAIWA CORPORATION
    Inventors: Toshinobu Yoshizaki, Makoto Akita
  • Publication number: 20090004601
    Abstract: A chemically amplified positive resist composition comprising (A) a salt represented by the formula (I): A+?O3S—R??(I) wherein R represents a 9,10-anthraquinonyl group which may be substituted with at least one group selected from the group consisting of a C1-C4 alkyl group, a C1-C4 alkoxy group and a hydroxyl group, and the C1-C4 alkyl group and the C1-C4 alkoxy group may be substituted, and A+ represents an organic counter cation, and (B) a resin which contains a structural unit which has an acid-labile group and which itself is insoluble or poorly soluble in an aqueous alkali solution but becomes soluble in an aqueous alkali solution by the action of an acid.
    Type: Application
    Filed: June 24, 2008
    Publication date: January 1, 2009
    Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Makoto Akita, Isao Yoshida, Yukako Harada
  • Publication number: 20090004600
    Abstract: A chemically amplified positive resist composition comprising (A) a resin which comprises (i) a polymerization unit represented by the formula (I): wherein R7 represents a hydrogen atom etc., R8 represents a C1-C4 alkyl group, p represents an integer of 1 to 3, and q represents an integer of 0 to 2, (ii) at least one polymerization unit selected from a group consisting of a polymerization unit represented by the formula (II): wherein R1 represents a hydrogen atom etc., R2 represents a C1-C8 alkyl group and ring X represents an alicyclic hydrocarbon group, and a polymerization unit represented by the formula (IV): wherein R3 represents a hydrogen atom etc., R4 and R5 independently represents a hydrogen atom etc., R10 represents a C1-C6 alkyl group etc., and (iii) a polymerization unit represented by the formula (III): wherein R3, R4 and R5 are the same as defined above, E represents a divalent hydrocarbon group, G represents a single bond etc., Z represents a carbonyl group etc.
    Type: Application
    Filed: June 20, 2008
    Publication date: January 1, 2009
    Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Makoto Akita, Isao Yoshida, Kazuhiko Hashimoto
  • Publication number: 20080286691
    Abstract: A chemically amplified positive resist composition comprising (A) a resin which comprises (i) a polymerization unit represented by the formula (I): (ii) a polymerization unit represented by the formula (II): and (iii) at least one polymerization unit selected from the group consisting of a polymerization unit represented by the formula (III): and a polymerization unit represented by the formula (IV): and (B) at least one acid generator.
    Type: Application
    Filed: May 15, 2008
    Publication date: November 20, 2008
    Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Makoto AKITA, Masumi Suetsugu, Kazuhiko Hashimoto
  • Publication number: 20080153036
    Abstract: The present invention provides a chemically amplified positive resist composition comprising (A) a resin obtainable by reacting a novolak resin, a poly(hydroxystyrene) and a compound having at least two vinyl ether structures, and (B) an acid generator.
    Type: Application
    Filed: November 13, 2007
    Publication date: June 26, 2008
    Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Masumi Suetsugu, Makoto Akita, Kazuhiko Hashimoto
  • Patent number: 7296727
    Abstract: After detection of contact between respective solder bumps of an electronic component, sucked and held by a suction nozzle of a head tool, and respective solder portions of a circuit board, the solder bumps and the solder portions are melted by heating. Releasing of the electronic component from suction and holding by the suction nozzle of the head tool is performed, not at a time during solder melting, but at a time after the solder is melted, cooled and solidified. Thus, an electronic component mounting method and apparatus capable of mounting high-end electronic components having narrow-pitched bumps are provided.
    Type: Grant
    Filed: December 20, 2002
    Date of Patent: November 20, 2007
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Shunji Onobori, Shuichi Hirata, Masakazu Yamano, Kazuya Yamamoto, Satoshi Shida, Takaharu Mae, Makoto Akita, Shozo Minamitani
  • Publication number: 20070187457
    Abstract: A component mounting apparatus includes a component feeder that feeds a component with its bump electrodes facing down, a mounting head that mounts the component onto a substrate, a supporting base that secures the substrate, and a positioning device that aligns the component with the substrate. The mounting head includes an ultrasonic vibration generator, an ultrasonic vibration propagation member that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face holding the component as vibration parallel thereto, a pressure loader that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto, and a heater that heats the vicinity of the working face. Thereby, ultrasonic bonding is carried out with high reliability even if the component has a number of bump electrodes on its face.
    Type: Application
    Filed: March 30, 2007
    Publication date: August 16, 2007
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Shozo Minamitani, Takaharu Mae, Yasuharu Ueno, Akira Yamada, Shinji Kanayama, Makoto Akita, Nobuhisa Watanabe, Akira Mori, Hiroyuki Naito, Shinya Marumo, Makoto Morikawa
  • Patent number: 7229854
    Abstract: A component mounting apparatus includes a component feeder (20) that feeds a component (2) with its bump electrodes facing down, a mounting head (5) that mounts the component onto a substrate (3), a supporting base (8) that secures the substrate, and a positioning device (6, 7) that aligns the component with the substrate. The mounting head includes an ultrasonic vibration generator (24), an ultrasonic vibration propagation member (34, 38, 54) that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face (33, 41, 57) holding the component as vibration parallel thereto, a pressure loader (22, 23, 39, 55, 59) that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto, and a heater (32, 47, 49, 50, 51, 52, 53) that heats the vicinity of the working face. Thereby, ultrasonic bonding is carried out with high reliability even if the component has a number of bump electrodes (2a) on its face.
    Type: Grant
    Filed: March 27, 2003
    Date of Patent: June 12, 2007
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Shozo Minamitani, Takaharu Mae, Yasuharu Ueno, Akira Yamada, Shinji Kanayama, Makoto Akita, Nobuhisa Watanabe, Akira Mori, Hiroyuki Naito, Shinya Marumo, Makoto Morikawa
  • Patent number: 7001706
    Abstract: A sulfonate of the formula (I): wherein Q1, Q2, Q3, Q4 and Q5 each independently represents a certain substituent, and A+ represents a counter ion, with the proviso that at least one of Q1, Q2, Q3, Q4 and Q5 is a group of the formula (II) wherein R1 and R2 each independently an alkyl having 1 to 12 carbon atoms or the like; and a chemical amplification type positive resist composition comprising the sulfate of the formula (I) and a resin which contains a structural unit having an acid labile group and which itself is insoluble or poorly soluble in an alkali aqueous solution but becomes soluble in an alkali aqueous solution by the action of an acid.
    Type: Grant
    Filed: July 16, 2004
    Date of Patent: February 21, 2006
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Satoshi Yamaguchi, Makoto Akita, Isao Yoshida
  • Publication number: 20050227429
    Abstract: A component mounting apparatus includes a component feeder (20) that feeds a component (2) with its bump electrodes facing down, a mounting head (5) that mounts the component onto a substrate (3), a supporting base (8) that secures the substrate, and a positioning device (6, 7) that aligns the component with the substrate. The mounting head includes an ultrasonic vibration generator (24), an ultrasonic vibration propagation member (34, 38, 54) that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face (33, 41, 57) holding the component as vibration parallel thereto, a pressure loader (22, 23, 39, 55, 59) that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto, and a heater (32, 47, 49, 50, 51, 52, 53) that heats the vicinity of the working face. Thereby, ultrasonic bonding is carried out with high reliability even if the component has a number of bump electrodes (2a) on its face.
    Type: Application
    Filed: March 27, 2003
    Publication date: October 13, 2005
    Inventors: Shozo Minamitani, Takaharu Mae, Yasuharu Ueno, Akira Yamada, Shinji Kanayama, Makoto Akita, Nobuhisa Watanabe, Akira Mori, Hiroyuki Naito, Shinya Marumo, Makoto Morikawa