Patents by Inventor Makoto Dobashi

Makoto Dobashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060051675
    Abstract: Disclosed is a negative electrode for a nonaqueous secondary battery included of a current collector and an active material structure containing an electro-conductive material having low capability of forming a lithium compound on at least one side of the current collector, the active material structure containing 5 to 80% by weight of active material particles containing a material having high capability of forming a lithium compound. The active material structure preferably has an active material layer containing the active material particles and a surface coating layer formed on the active material layer.
    Type: Application
    Filed: November 25, 2003
    Publication date: March 9, 2006
    Applicant: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Shinichi Musha, Hitohiko Honda, Yoshiki Sakaguchi, Kiyotaka Yasuda, Akihiro Modeki, Tomoyoshi Matsushima, Takeo Taguchi, Kazuko Taniguchi, Makoto Dobashi
  • Patent number: 6984453
    Abstract: An object is the provision of a peelable electrodeposited copper foil with carrier foil that stabilizes the peel strength between the carrier foil and the electrodeposited copper foil layer even when used in manufacture of the printed wiring boards that requires pressing at the temperatures of 200° C. or higher. For the purpose of achieving the object, the electrodeposited copper foil with carrier foil 1, which includes an adhesive interface layer 4 arranged on one face of the carrier foil 2 and an electrodeposited copper foil layer 3 arranged on the adhesive interface layer 4, characterized in that the adhesive interface layer 4 is composed of a metal oxide layer ML and an organic material layer OL, and the like are used.
    Type: Grant
    Filed: December 12, 2002
    Date of Patent: January 10, 2006
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Akiko Sugimoto, Junshi Yoshioka, Makoto Dobashi
  • Publication number: 20050208379
    Abstract: Disclosed is a negative electrode for a nonaqueous secondary battery comprised of a current collector and an active material structure containing an electro-conductive material having low capability of forming a lithium compound on at least one side of the current collector, the active material structure containing 5 to 80% by weight of active material particles containing a material having high capability of forming a lithium compound. The active material structure preferably has an active material layer containing the active material particles and a surface coating layer formed on the active material layer.
    Type: Application
    Filed: January 5, 2005
    Publication date: September 22, 2005
    Inventors: Shinichi Musha, Hitohiko Honda, Yoshiki Sakaguchi, Kiyotaka Yasuda, Akihiro Modeki, Tomoyoshi Matsushima, Takeo Taguchi, Kazuko Taniguchi, Makoto Dobashi
  • Publication number: 20050175900
    Abstract: An anode for a nonaqueous secondary battery comprising a current collector having formed thereon a first covering layer containing tin, a tin alloy, aluminum or an aluminum alloy and a second covering layer containing a metal having low capability of forming a lithium compound in that order. The anode may have an additional first covering layer formed on the second covering layer. A covering layer containing a copper etc. may be formed as an uppermost layer. Each layer can be formed by heat treating to get desired property. As heat treatment can be done in a short time, it has a great cost merit.
    Type: Application
    Filed: April 21, 2003
    Publication date: August 11, 2005
    Inventors: Kiyotaka Yasuda, Yoshiki Sakaguchi, Kazuko Taniguchi, Makoto Dobashi
  • Publication number: 20050161149
    Abstract: A method of forming a dielectric layer containing dielectric filler, which is excellent in film thickness uniformity, from a polyimide electrodeposition liquid containing dielectric filler. In particular, a method of forming a polyimide coating container dielectric filler on a surface of metallic material according to the electrodeposition coating technique, characterized in that as the dielectric filler, use is made of dielectric powder of perovskite structure in approximately spherical form which has an average particle diameter (D1A) of 0.05 to 1.0 ?m and a weight cumulative particle diameter (D50), measured in accordance with the laser diffraction scattering type particle size distribution measuring method, of 0.1 to 2.0 ?m and further exhibits an aggregation degree, in terms of D50/D1a wherein D50 and D1a represent a weight cumulative particle diameter and an average particle diameter obtained by image analysis, respectively, of 4.5 or less.
    Type: Application
    Filed: June 27, 2003
    Publication date: July 28, 2005
    Applicant: Mitsui Mining & Smelting Co.,
    Inventors: Toshiko Yokota, Susumu Takahashi, Hideaki Matsushima, Makoto Dobashi, Takuya Yamamoto
  • Patent number: 6835297
    Abstract: The method for electrolytically refining copper makes use of crude copper as an anode and is characterized in that the temperature of the electrolyte in an electrolytic cell is maintained at a level of not less than 55° C.; that the electrolyte is continuously introduced into the electrolytic cell from the top of the cell, continuously discharged from the bottom of the cell along with slime, the slime is removed from the electrolyte discharged from the electrolytic cell and the electrolyte free of any slime is recirculated in the cell; and that the electrolyte is passed through the space between the electrodes at an average electrolyte velocity sufficient for allowing the electrolyte to flow on the whole surface of the cathode downward or in the direction opposite to that of the upward stream of the electrolyte generated on the cathode surface when the electrolysis is initiated while the electrolyte is in the stationary state.
    Type: Grant
    Filed: June 24, 2002
    Date of Patent: December 28, 2004
    Assignee: Mitsui Mining and Smelting Co., Ltd.
    Inventors: Toshiko Yokota, Susumu Takahashi, Makoto Dobashi, Yoshiaki Kinoshita
  • Publication number: 20040188263
    Abstract: The object is to provide carrier foil-incorporated copper foil which permits drilling by a carbon dioxide laser when on the surface of outer-layer copper foil of a copper-clad laminate there is no nickel assist metal layer or an organic material film to increase the absorption of laser light. For this purpose, there is used, for example, carrier foil-incorporated copper foil in which copper foil for printed wiring board manufacturing having a nodular-treated surface on the side of one surface of a bulk copper layer and carrier foil are laminated via an adhesive interface layer on a side opposite to the nodular-treated surface of the bulk copper layer, the bulk copper layer being formed from a high-carbon copper with a carbon content of 0.03 wt % to 0.40 wt %.
    Type: Application
    Filed: December 11, 2003
    Publication date: September 30, 2004
    Inventors: Akiko Sugimoto, Junshi Yoshioka, Makoto Dobashi, Kenjirou Izutani, Youzo Itagaki, Osamu Nakano
  • Publication number: 20040170858
    Abstract: The object is to provide a method of manufacturing electrodeposited copper foil with a carrier foil for high-temperature heat-resistance in which the peeling of the carrier foil is easy even by press working at temperatures of not less than 200° C.
    Type: Application
    Filed: January 14, 2004
    Publication date: September 2, 2004
    Inventors: Akitoshi Takanashi, Kenichiro Iwakiri, Akiko Sugimoto, Junshi Yoshioka, Shinichi Obata, Makoto Dobashi
  • Patent number: 6777108
    Abstract: To control peel strength at an organic release interface between a carrier foil and a copper-microparticle layer which constitute an electrodeposited copper foil with carrier. In the present invention, (1) a barrier copper layer is formed on the release interface layer and copper microparticles are formed on the barrier layer; (2) the anti-corrosion treatment is carried out by use of a plating bath containing a single metallic component or a plurality of metallic components for forming an alloy, the plating bath(s) having a deposition potential less negative than −900 mV (vs. AgCl/Ag reference electrode); and (3) methods (1) and (2) are combined.
    Type: Grant
    Filed: May 18, 2001
    Date of Patent: August 17, 2004
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Shin-ichi Obata, Makoto Dobashi
  • Publication number: 20040067377
    Abstract: An object is the provision of a peelable electrodeposited copper foil with carrier foil that stabilizes the peel strength between the carrier foil and the electrodeposited copper foil layer even when used in manufacture of the printed wiring boards that requires pressing at the temperatures of 200° C. or higher. For the purpose of achieving the object, the electrodeposited copper foil with carrier foil 1, which includes an adhesive interface layer 4 arranged on one face of the carrier foil 2 and an electrodeposited copper foil layer 3 arranged on the adhesive interface layer 4, characterized in that the adhesive interface layer 4 is composed of a metal oxide layer ML and an organic material layer OL, and the like are used.
    Type: Application
    Filed: August 11, 2003
    Publication date: April 8, 2004
    Inventors: Akiko Sugimoto, Junshi Yoshioka, Makoto Dobashi
  • Patent number: 6652725
    Abstract: An object of the invention is to provide a method for continuously producing electrodeposited copper foil while thiourea-decomposed products remaining in copper electrolyte are removed through activated carbon treatment. Another object is to provide high-resistivity copper foil obtained through the method. The present invention further provides an electrodeposition apparatus including a path for circulating a copper sulfate solution, whereby in said path is provided a filtration means for removal of thiourea-decomposed products remaining in copper electrolyte.
    Type: Grant
    Filed: April 20, 2001
    Date of Patent: November 25, 2003
    Assignees: Mitsui Mining, Smelting Co., Ltd.
    Inventors: Kazuko Taniguchi, Makoto Dobashi, Hisao Sakai, Yasuji Hara
  • Patent number: 6649274
    Abstract: An object of the present invention is to reduce and to stabilize peel strength of a carrier foil in an electrodeposited copper foil with carrier employing an organic adhesive interface, thereby facilitating peeling of the carrier foil. The electrodeposited copper foil with carrier of the present invention contains a carrier foil layer, an organic adhesive interface layer formed on the carrier foil layer, and an electrodeposited copper foil layer formed on the organic adhesive interface layer, wherein the difference between the coefficient of thermal expansion of material forming the carrier foil layer at a certain temperature and that of material forming the electrodeposited copper foil at the same temperature is 4×10−7/deg.C or more.
    Type: Grant
    Filed: November 7, 2001
    Date of Patent: November 18, 2003
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Sakiko Taenaka, Makoto Dobashi, Akiko Sugimoto, Naotomi Takahashi
  • Patent number: 6610418
    Abstract: The present invention provides electrodeposited copper foil with carrier which has an organic adhesive interface layer permitting control of the lower limit of peel strength between a carrier foil and an electrodeposited copper foil and to a method for producing the electrodeposited copper foil with carrier. In the electrodeposited copper foil with carrier including a carrier foil, an adhesive interface layer formed on the carrier foil, and an electrodeposited copper foil formed on the adhesive interface layer, the carrier foil is formed of a copper foil and the adhesive interface layer contains an organic agent and metallic particles, the organic agent and the metallic particles being in an intermingled state.
    Type: Grant
    Filed: November 7, 2001
    Date of Patent: August 26, 2003
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Junshi Yoshioka, Akiko Sugimoto, Makoto Dobashi, Ken-ichiro Iwakiri, Yutaka Hirasawa
  • Patent number: 6544664
    Abstract: A copper foil for use in making a printed wiring board and a copper clad laminate comprising the copper foil are herein disclosed and the copper foil is characterized in that a metal chromium layer is formed on at least one side of the copper foil by vapor deposition or characterized in that one side of the copper foil is supported by a carrier through a releasing layer and a metal chromium layer is formed on the other side of the foil by vapor deposition. The copper foil is excellent in the adhesion to various substrates (the peel strength between the substrate and the copper foil), moisture resistance, chemical resistance and heat resistance and therefore, the copper foil can suitably be used in the production of printed wiring boards.
    Type: Grant
    Filed: May 24, 2000
    Date of Patent: April 8, 2003
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Naotomi Takahashi, Yoichi Babasaki, Tsutomu Higuchi, Osamu Nakano, Hiroshi Watanabe, Masaru Takahashi, Makoto Dobashi
  • Patent number: 6541126
    Abstract: To provide an electrodeposited copper foil with carrier, in which electrical connection holes such as through holes (PTH), interstitial via holes (IVH), and blind via holes (BVH) can be readily formed. The invention provides an electrodeposited copper foil with carrier comprising a carrier foil, an organic release interface layer formed on a surface of the carrier foil, and an electrodeposited copper foil layer deposited on the release interface layer, wherein copper microparticles are deposited on the surface of the carrier foil onto which the organic release interface layer and the electrodeposited copper layer are formed.
    Type: Grant
    Filed: April 23, 2001
    Date of Patent: April 1, 2003
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Junshi Yoshioka, Akiko Sugimoto, Sakiko Taenaka, Makoto Dobashi, Tsutomu Higuchi, Takuya Yamamoto, Ken-ichiro Iwakiri
  • Publication number: 20020064019
    Abstract: To provide a cathodic electrode material widely applicable to electro winning of a metal, easy in maintenance and capable of producing a deposited metal good in physical properties and shapes. For this purpose, a cathodic electrode material used for electrolytic deposition of a metal, characterized in that the cathodic electrode is made of titanium and the surface on which a metal is electrolytically deposited is provided with a ceramic layer is used. Furthermore, applying this cathodic electrode material to a cathode used for production of an electrolytic copper foil permits an electrolytic copper foil excellent in quality to be obtained.
    Type: Application
    Filed: August 10, 2001
    Publication date: May 30, 2002
    Inventors: Makoto Dobashi, Sakiko Taenaka, Naotomi Takahashi, Nobuyoshi Kasahara
  • Patent number: 6335099
    Abstract: A corrosion-resistant article of a magnesium material having the gloss of the metal substrate surface comprises an anodic oxide film formed on the external surface of an article of magnesium or a magnesium alloy, which never changes the gloss of the metal substrate and a colorless or colored transparent electrodeposition coating film on the anodic film. Such an article can be prepared by immersing an article of magnesium or a magnesium alloy in an electrolyte containing a phosphate and an aluminate to thus form an anodic oxide film through anodization of the surface of the article and forming a colorless or colored transparent electrodeposition coating film on the anodic film through electrodeposition coating.
    Type: Grant
    Filed: October 22, 1999
    Date of Patent: January 1, 2002
    Assignee: Mitsui Mining and Smelting Co., Ltd.
    Inventors: Tsutomu Higuchi, Mitsuo Suzuki, Makoto Dobashi
  • Patent number: 6322904
    Abstract: A copper foil having improved resistance to abrasion damage during the manufacture of printed circuit boards has a uniform deposit of benzotriazole (BTA) or BTA derivative, optionally a mixture thereof, of at least about 5 mg/m2.
    Type: Grant
    Filed: March 20, 1997
    Date of Patent: November 27, 2001
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Makoto Dobashi, Hiroaki Kurihara, Toshiko Yokota, Hiroshi Hata, Naotomi Takahashi, Tatsuya Sudo
  • Publication number: 20010042686
    Abstract: An object of the invention is to provide a method for continuously producing electrodeposited copper foil while thiourea-decomposed products remaining in copper electrolyte are removed through activated carbon treatment. Another object is to provide high-resistivity copper foil obtained through the method.
    Type: Application
    Filed: April 20, 2001
    Publication date: November 22, 2001
    Applicant: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Kazuko Taniguchi, Makoto Dobashi, Hisao Sakai, Yasuji Hara
  • Publication number: 20010019780
    Abstract: An object of the present invention is to provide a technology for preventing wrinkles on metal foils such as nickel, tin, cobalt, chromium and iron from being generated in order to facilitate their handling. The object is accomplished by using a carrier foil manufactured by bonding a carrier foil layer with a metal foil layer via an organic adhesive interface layer, wherein a metal foil layer comprising one of nickel, tin, cobalt, chromium, lead, iron and zinc, or an alloy as a combination of two or more of them or an alloy of them is used for the metal foil with carrier.
    Type: Application
    Filed: February 27, 2001
    Publication date: September 6, 2001
    Applicant: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Shin-ichi Obata, Makoto Dobashi, Takashi Kataoka