Abstract: A semiconductor device includes a semiconductor element, a lead frame, a conductive member, a resin composition and a sealing resin. The semiconductor element has an element front surface and an element back surface facing away in a first direction. The semiconductor element is mounted on the lead frame. The conductive member is bonded to the lead frame, electrically connecting the semiconductor element and the lead frame. The resin composition covers a bonded region where the conductive member and lead frame are bonded while exposing part of the element front surface. The sealing resin covers part of the lead frame, the semiconductor element, and the resin composition. The resin composition has a greater bonding strength with the lead frame than a bonding strength between the sealing resin and lead frame and a greater bonding strength with the conductive member than a bonding strength between the sealing resin and conductive member.

Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a substrate, a mounting layer, switching elements, a moisture-resistant layer and a sealing resin. The substrate has a front surface facing in a thickness direction. The mounting layer is electrically conductive and disposed on the front surface. Each switching element includes an element front surface facing in the same direction in which the front surface faces along the thickness direction, a back surface facing in the opposite direction of the element front surface, and a side surface connected to the element front surface and the back surface. The switching elements are electrically bonded to the mounting layer with their back surfaces facing the front surface. The moisture-resistant layer covers at least one side surface. The sealing resin covers the switching elements and the moisture-resistant layer.

Abstract: A semiconductor device includes a semiconductor element, a lead frame, a conductive member, a resin composition and a sealing resin. The semiconductor element has an element front surface and an element back surface facing away in a first direction. The semiconductor element is mounted on the lead frame. The conductive member is bonded to the lead frame, electrically connecting the semiconductor element and the lead frame. The resin composition covers a bonded region where the conductive member and lead frame are bonded while exposing part of the element front surface. The sealing resin covers part of the leadframe, the semiconductor element, and the resin composition. The resin composition has a greater bonding strength with the lead frame than a bonding strength between the sealing resin and lead frame and a greater bonding strength with the conductive member than a bonding strength between the sealing resin and conductive member.

Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a substrate, amounting layer, switching elements, a moisture-resistant layer and a sealing resin. The substrate has a front surface facing in a thickness direction. The mounting layer is electrically conductive and disposed on the front surface. Each switching element includes an element front surface facing in the same direction in which the front surface faces along the thickness direction, a back surface facing in the opposite direction of the element front surface, and a side surface connected to the element front surface and the back surface. The switching elements are electrically bonded to the mounting layer with their back surfaces facing the front surface. The moisture-resistant layer covers at least one side surface. The sealing resin covers the switching elements and the moisture-resistant layer.

Abstract: A semiconductor device includes a semiconductor element, a lead frame, a conductive member, a resin composition and a sealing resin. The semiconductor element has an element front surface and an element back surface facing away in a first direction. The semiconductor element is mounted on the lead frame. The conductive member is bonded to the lead frame, electrically connecting the semiconductor element and the lead frame. The resin composition covers a bonded region where the conductive member and lead frame are bonded while exposing part of the element front surface. The sealing resin covers part of the leadframe, the semiconductor element, and the resin composition. The resin composition has a greater bonding strength with the lead frame than a bonding strength between the sealing resin and lead frame and a greater bonding strength with the conductive member than a bonding strength between the sealing resin and conductive member.

Abstract: A semiconductor device includes a semiconductor element, a lead frame, a conductive member, a resin composition and a sealing resin. The semiconductor element has an element front surface and an element back surface facing away in a first direction. The semiconductor element is mounted on the lead frame. The conductive member is bonded to the lead frame, electrically connecting the semiconductor element and the lead frame. The resin composition covers a bonded region where the conductive member and lead frame are bonded while exposing part of the element front surface. The sealing resin covers part of the lead frame, the semiconductor element, and the resin composition. The resin composition has a greater bonding strength with the lead frame than a bonding strength between the sealing resin and lead frame and a greater bonding strength with the conductive member than a bonding strength between the sealing resin and conductive member.

Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a substrate, amounting layer, switching elements, a moisture-resistant layer and a sealing resin. The substrate has a front surface facing in a thickness direction. The mounting layer is electrically conductive and disposed on the front surface. Each switching element includes an element front surface facing in the same direction in which the front surface faces along the thickness direction, a back surface facing in the opposite direction of the element front surface, and a side surface connected to the element front surface and the back surface. The switching elements are electrically bonded to the mounting layer with their back surfaces facing the front surface. The moisture-resistant layer covers at least one side surface. The sealing resin covers the switching elements and the moisture-resistant layer.

Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a substrate, amounting layer, switching elements, a moisture-resistant layer and a sealing resin. The substrate has a front surface facing in a thickness direction. The mounting layer is electrically conductive and disposed on the front surface. Each switching element includes an element front surface facing in the same direction in which the front surface faces along the thickness direction, a back surface facing in the opposite direction of the element front surface, and a side surface connected to the element front surface and the back surface. The switching elements are electrically bonded to the mounting layer with their back surfaces facing the front surface. The moisture-resistant layer covers at least one side surface. The sealing resin covers the switching elements and the moisture-resistant layer.

Abstract: A semiconductor device includes a semiconductor element, a lead frame, a conductive member, a resin composition and a sealing resin. The semiconductor element has an element front surface and an element back surface facing away in a first direction. The semiconductor element is mounted on the lead frame. The conductive member is bonded to the lead frame, electrically connecting the semiconductor element and the lead frame. The resin composition covers a bonded region where the conductive member and lead frame are bonded while exposing part of the element front surface. The sealing resin covers part of the lead frame, the semiconductor element, and the resin composition. The resin composition has a greater bonding strength with the lead frame than a bonding strength between the sealing resin and lead frame and a greater bonding strength with the conductive member than a bonding strength between the sealing resin and conductive member.

Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a substrate, amounting layer, switching elements, a moisture-resistant layer and a sealing resin. The substrate has a front surface facing in a thickness direction. The mounting layer is electrically conductive and disposed on the front surface. Each switching element includes an element front surface facing in the same direction in which the front surface faces along the thickness direction, a back surface facing in the opposite direction of the element front surface, and a side surface connected to the element front surface and the back surface. The switching elements are electrically bonded to the mounting layer with their back surfaces facing the front surface. The moisture-resistant layer covers at least one side surface. The sealing resin covers the switching elements and the moisture-resistant layer.

Abstract: Provided is a novel display device without deterioration of display quality or a novel display device in which flickering due to a reduced refresh rate is suppressed. The display device includes a pixel for displaying a still image at a frame frequency of less than or equal to 1 Hz. The pixel includes a liquid crystal layer. The liquid crystal layer includes a molecule whose dipole moment is greater than or equal to 0 debye and less than or equal to 3 debye. Thus, flickering due to a reduced refresh rate can be suppressed, which leads to an improvement in display quality.

Abstract: Provided is a novel display device without deterioration of display quality or a novel display device in which flickering due to a reduced refresh rate is suppressed. The display device includes a pixel for displaying a still image at a frame frequency of less than or equal to 1 Hz. The pixel includes a liquid crystal layer. The liquid crystal layer includes a molecule whose dipole moment is greater than or equal to 0 debye and less than or equal to 3 debye. Thus, flickering due to a reduced refresh rate can be suppressed, which leads to an improvement in display quality.

Abstract: A novel organic compound that can be used in a variety of liquid crystal devices or a liquid crystal composition containing the novel organic compound is provided. An organic compound represented by General Formula (G1) is provided. A novel liquid crystal composition containing the organic compound is provided. In General Formula (G1), Ar1 and Ar2 separately represent a substituted or unsubstituted arylene group having 6 to 12 carbon atoms, a substituted or unsubstituted cycloalkylene group having 3 to 12 carbon atoms, or a substituted or unsubstituted cycloalkenylene group having 3 to 12 carbon atoms. In addition, m and n separately represent 0 or 1. R1 and R2 separately represent a hydrogen atom, a substituted or unsubstituted alkyl group having 1 to 11 carbon atoms, or a substituted or unsubstituted alkoxy group having 1 to 11 carbon atoms.

Abstract: An organic compound represented by General Formula (G100) is provided. A novel liquid crystal composition containing the organic compound is provided.

Abstract: A liquid crystal composition for forming a polymer/liquid crystal composite in which disorder of an orientation state is reduced is provided. The liquid crystal composition includes a liquid crystal material exhibiting a blue phase and a liquid crystalline monomer represented by the following general formula (G1). Note that the liquid crystal composition may include a non-liquid-crystalline monomer and a polymerization initiator. In the general formula (G1), X represents a mesogenic skeleton; and Y1 and Y2 individually represent an alkylene group having a sum of carbon atoms and/or oxygen atoms of 1 to 20. Also in the general formula (G1), the alkylene group and the alkyl group may include a carbonyl group and may have an ether bond. In addition, the carbonyl group and the ether bond may form an ester structure. In the general formula (G1), Z1 and Z2 individually represent an acryloyl group or a methacryloyl group.

Abstract: A novel polymerizable monomer compound that can be used for a variety of liquid crystal devices is provided. Particularly, a novel liquid crystal composition including the novel polymerizable monomer compound and exhibiting a blue phase is provided. Further, a liquid crystal display device manufactured with the use of the liquid crystal composition is provided. A polymerizable monomer compound represented by the following general formula (G1) is provided. In the general formula (G1), n and m are individually an integer from 1 to 20 and may be the same as or different from each other, and R1 and R2 individually represent hydrogen or a methyl group.

Abstract: [Object] Provided is a novel display device without deterioration of display quality or a novel display device in which flickering due to a reduced refresh rate is suppressed. [Solution] The display device includes a pixel for displaying a still image at a frame frequency of less than or equal to 1 Hz. The pixel includes a liquid crystal layer. The liquid crystal layer has a dielectric constant anisotropy of higher than or equal to 2 and lower than or equal to 3.8. Thus, flickering due to a reduced refresh rate can be suppressed, which leads to an improvement in display quality.

Abstract: A signal-transferring device having a first circuit and a second circuit that operate on different ground references, and a third circuit for transferring signals while providing insulation between the first circuit and the second circuit. The second circuit switches a logic level of an output signal in accordance with the logic level of an input signal notified by the first circuit, and notifies the first circuit about the logic level of the output signal. The first circuit notifies the second circuit about the logic level of the input signal not only when the logic level of the input signal has been switched, but also when the logic level of the output signal notified by the second circuit does not match the logic level of the input signal.

Abstract: Defective display by a liquid crystal display device is reduced. In a liquid crystal composition which contains a liquid crystal material exhibiting a blue phase and has a transmission spectrum with a single peak in a temperature range where the liquid crystal material exhibits a blue phase, it is found that the blue phase of the liquid crystal material can be stabilized in a wide temperature range by polymer stabilization treatment. Thus, the liquid crystal composition allows the polymer stabilization treatment to be achieved in a wider temperature range. This makes it possible to reduce defective orientation in a composite of polymer and liquid crystal formed by subjecting the liquid crystal composition to the treatment. As a result, it is possible to reduce defective display by a liquid crystal display device which includes the composite of polymer and liquid crystal.

Abstract: An object is to provide a novel liquid crystal composition that can be used for a variety of liquid crystal devices. Particularly, a novel liquid crystal composition is used to achieve a reduction in driving voltage of a liquid crystal element and a reduction in power consumption of a liquid crystal display device. The liquid crystal composition includes a polymerizable monomer represented by the general formula (G1), a nematic liquid crystal, and a chiral agent. In the general formula (G1), n and m are individually an integer from 1 to 20, and R1 and R2 individually represent hydrogen or a methyl group.