Patents by Inventor Makoto Imai

Makoto Imai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9198332
    Abstract: A cooling type switching element module includes an outer conductor pipe, an inner conductor pipe that transmits electric power in conjunction with the outer conductor pipe, and first and second switching elements. The first switching elements are provided on outer surfaces of the outer conductor pipe, and the second switching elements are provided on outer surfaces of a projecting portion of the inner conductor pipe. A coolant flows within the inner conductor pipe, and outside the outer conductor pipe. The first and second switching elements are cooled from both sides by the coolant flowing within the inner conductor pipe, and by the coolant flowing outside the outer conductor pipe. By employing the above-described structure, it is possible to provide a switching element module having a cooling function, in which improved cooling performance, improved electrical performance, and downsizing are achieved.
    Type: Grant
    Filed: December 31, 2013
    Date of Patent: November 24, 2015
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Hiroshi Osada, Masanori Usui, Takahide Sugiyama, Tomoyuki Shoji, Satoshi Hirose, Makoto Imai, Norimune Orimoto
  • Publication number: 20150295489
    Abstract: A semiconductor device presented herein includes a first wiring including a first end and a second end configured to receive a voltage lower than a voltage of the first end. The semiconductor device includes a second wiring including a third end connected to the first end, and a fourth end connected to the second end. The semiconductor device includes a switching element set on the first wiring, a capacitor set on the second wiring, and a fuse portion set on the second wiring and positioned on a third end side of the capacitor. The semiconductor device includes a potential sensing portion connected to the second wiring between the fuse portion and the capacitor and configured to sense a potential of a connection point thereof.
    Type: Application
    Filed: December 25, 2012
    Publication date: October 15, 2015
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventor: Makoto IMAI
  • Publication number: 20150218123
    Abstract: An object of the present invention is to provide an optically active bicyclic ?-amino acid derivative in a high purity.
    Type: Application
    Filed: February 6, 2015
    Publication date: August 6, 2015
    Applicant: Daiichi Sankyo Company, Limited
    Inventors: Yoshitaka NAKAMURA, Kazutoshi UKAI, Takafumi KITAWAKI, Takumi NAKAJIMA, Yutaka KITAGAWA, Yukito FURUYA, Makoto IMAI, Eiji NUMAGAMI, Masakazu WAKAYAMA, Ayako SAITO
  • Patent number: 9082274
    Abstract: An odor generation alarm and a method for informing an unusual situation having a high attention attracting effect and a high degree of safety are provided. An odor generation alarm includes an odorant receptacle, a drive section, a detector and a circuit section which is a controller. The odorant receptacle contains an odorant. A concentration of the odorant in air at which a person can no longer tolerate a strength of smell is lower than a no observed effect concentration of the odorant. The drive section causes the odorant to be emitted from the odorant receptacle. The detector detects occurrence of an unusual situation, and outputs a detection signal. When the detection signal from the detector is inputted, the controller causes the drive section to emit the odorant in accordance with the detection signal.
    Type: Grant
    Filed: February 5, 2009
    Date of Patent: July 14, 2015
    Assignees: AIR WATER SAFETY SERVICE, INC., SEEMS INC.
    Inventors: Hideaki Goto, Tomo Sakai, Koichiro Mizoguchi, Yukinobu Tajima, Makoto Imai
  • Patent number: 9084295
    Abstract: An induction heating cooker includes a top plate adapted to have an object placed thereon, plural heating coils provided below a lower surface of the top plate, an inverter for supplying high-frequency power to the heating coils, a data memory, and a controller controlling the inverter. The data memory stores first and second heating coil patterns. Each of the first and second heating coil patterns defines one or more heatable regions and one or more non-heatable regions. The controller selects a heating coil pattern from the first and second coil patterns. The controller controls the inverter such that high-frequency power can be supplied to one or more first heating coils out of the plural heating coils located in the one or more heatable regions of the selected heating coil pattern.
    Type: Grant
    Filed: March 25, 2009
    Date of Patent: July 14, 2015
    Assignee: Panasonic Corporation
    Inventors: Hideki Sadakata, Atsushi Fujita, Makoto Imai, Yuta Miura, Shinichiro Sumiyoshi
  • Patent number: 9069490
    Abstract: A source device includes: a low-speed data supply section configured to supply, as low-speed data, data generated in synchronization with a low clock signal out of clock signals having different frequencies, the low clock signal having a frequency lower than a predetermined value; a high-speed data supply section configured to supply, as high-speed data, data generated in synchronization with a high clock signal out of the clock signals, the high clock signal having a frequency higher than that of the low clock signal; a dividing section configured to divide the low-speed data into a predetermined number of pieces of data in accordance with a ratio between the frequencies of the high and low clock signals; and a data transmitting section configured to store the high-speed data and the divided pieces of low-speed data in data having a predetermined data size, and to transmit the stored data.
    Type: Grant
    Filed: January 13, 2014
    Date of Patent: June 30, 2015
    Assignee: Sony Corporation
    Inventors: Keiji Morikawa, Satoshi Kametani, Makoto Imai, Kazumasa Nishimoto
  • Patent number: 9013047
    Abstract: A semiconductor device includes a semiconductor element, a capacitor, a first resin, lead frames and a second resin. The first resin forms a resin molding which covers the semiconductor element and the capacitor. The lead frames are attached to two surfaces of the resin molding and are connected to the semiconductor element and the capacitor. The second resin directly covers the capacitor and has a rigidity lower than a rigidity of the first resin. An outside of the second resin is directly covered with the first resin.
    Type: Grant
    Filed: October 17, 2013
    Date of Patent: April 21, 2015
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Makoto Imai, Toru Tanaka
  • Patent number: 8957354
    Abstract: Disclosed is an inductive heating device which can lower losses in the device and readily provide cooling, wherein a controller is operated in a first control mode which controls the operation so that a unipolar first switching element and a unipolar second switching element conduct alternately when one of a bipolar third switching element and a bipolar fourth switching element is conducting and the other is disconnected when an aluminum object to be heated is heated, and in a second control mode in which the conduction of the first switching element and the fourth switching element and the conduction of the second switching element and the third switching element alternate when an iron object to be heated is heated.
    Type: Grant
    Filed: May 13, 2009
    Date of Patent: February 17, 2015
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Atsushi Fujita, Makoto Imai, Hideki Sadakata, Yuta Miura, Shinichiro Sumiyoshi
  • Patent number: 8933484
    Abstract: A heat transfer member is disposed between a semiconductor element and an electrode plate. The heat transfer member comprises a metal portion extending between a first face at the semiconductor element side and a second face at the plate electrode side, and a ceramic portion surrounding the metal portion. An area of the first face is less than an area of the second face in the metal portion.
    Type: Grant
    Filed: May 31, 2013
    Date of Patent: January 13, 2015
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Makoto Imai, Atsushi Tanida, Takashi Asada, Masanori Usui, Tomoyuki Shoji
  • Publication number: 20140205046
    Abstract: A source device includes: a low-speed data supply section configured to supply, as low-speed data, data generated in synchronization with a low clock signal out of clock signals having different frequencies, the low clock signal having a frequency lower than a predetermined value; a high-speed data supply section configured to supply, as high-speed data, data generated in synchronization with a high clock signal out of the clock signals, the high clock signal having a frequency higher than that of the low clock signal; a dividing section configured to divide the low-speed data into a predetermined number of pieces of data in accordance with a ratio between the frequencies of the high and low clock signals; and a data transmitting section configured to store the high-speed data and the divided pieces of low-speed data in data having a predetermined data size, and to transmit the stored data.
    Type: Application
    Filed: January 13, 2014
    Publication date: July 24, 2014
    Applicant: Sony Corporation
    Inventors: Keiji Morikawa, Satoshi Kametani, Makoto Imai, Kazumasa Nishimoto
  • Publication number: 20140198449
    Abstract: A cooling type switching element module includes an outer conductor pipe, an inner conductor pipe that transmits electric power in conjunction with the outer conductor pipe, and first and second switching elements. The first switching elements are provided on outer surfaces of the outer conductor pipe, and the second switching elements are provided on outer surfaces of a projecting portion of the inner conductor pipe. A coolant flows within the inner conductor pipe, and outside the outer conductor pipe. The first and second switching elements are cooled from both sides by the coolant flowing within the inner conductor pipe, and by the coolant flowing outside the outer conductor pipe. By employing the above-described structure, it is possible to provide a switching element module having a cooling function, in which improved cooling performance, improved electrical performance, and downsizing are achieved.
    Type: Application
    Filed: December 31, 2013
    Publication date: July 17, 2014
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Hiroshi OSADA, Masanori USUI, Takahide SUGIYAMA, Tomoyuki SHOJI, Satoshi HIROSE, Makoto IMAI, Norimune ORIMOTO
  • Publication number: 20140151872
    Abstract: A semiconductor module includes semiconductor device, at least one cooler, at least one fastening member. The semiconductor device has a flat shape. The at least one cooler is arranged adjacent to the semiconductor device. The at least one fastening member has a pressure-contact part that is configured to apply a pressure to the at least one cooler. Furthermore, the at least one fastening member fastens a layered body including the semiconductor device and the at least one cooler in a layer direction of the layered body. A dent configured to accommodate the pressure-contact part is provided in the at least one cooler.
    Type: Application
    Filed: December 3, 2013
    Publication date: June 5, 2014
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Takaoki Ogawa, Makoto Imai, Shizuyasu Matsubayashi
  • Publication number: 20140131845
    Abstract: A semiconductor device includes a semiconductor element, a capacitor, a first resin, lead frames and a second resin. The first resin forms a resin molding which covers the semiconductor element and the capacitor. The lead frames are attached to two surfaces of the resin molding and are connected to the semiconductor element and the capacitor. The second resin directly covers the capacitor and has a rigidity lower than a rigidity of the first resin. An outside of the second resin is directly covered with the first resin.
    Type: Application
    Filed: October 17, 2013
    Publication date: May 15, 2014
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Makoto IMAI, Toru Tanaka
  • Patent number: 8659150
    Abstract: A semiconductor module that can be connected with simple wiring is provided. A semiconductor device of the semiconductor module is provided with a semiconductor substrate, a first electrode formed on one surface of the semiconductor substrate, and a second electrode formed on a surface of the semiconductor substrate opposite to the one surface. The semiconductor module is provided with a first electrode plate being in contact with the first electrode, a second electrode plate being in contact with the second electrode, and a first wiring member connected to the second electrode plate and penetrating the first electrode plate in a state of being insulated from the first electrode plate. The first electrode plate, the semiconductor device, and the second electrode plate are fixed with each other by an application of a pressure pressurizing the semiconductor device on the first electrode plate and the second electrode plate.
    Type: Grant
    Filed: July 20, 2012
    Date of Patent: February 25, 2014
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventor: Makoto Imai
  • Publication number: 20130341781
    Abstract: A heat transfer member is disposed between a semiconductor element and an electrode plate. The heat transfer member comprises a metal portion extending between a first face at the semiconductor element side and a second face at the plate electrode side, and a ceramic portion surrounding the metal portion. An area of the first face is less than an area of the second face in the metal portion.
    Type: Application
    Filed: May 31, 2013
    Publication date: December 26, 2013
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Makoto IMAI, Atsushi TANIDA, Takashi ASADA, Masanori USUI, Tomoyuki SHOJI
  • Patent number: 8604608
    Abstract: A semiconductor module is disclosed that includes a semiconductor element, a capacitor configured to be electrically connected to the semiconductor element and a heat sink, wherein the semiconductor and the capacitor are stacked with each other via the heat sink, and wherein the semiconductor element is disposed in a position overlapping with the capacitor as viewed from a stack direction.
    Type: Grant
    Filed: April 17, 2012
    Date of Patent: December 10, 2013
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Jiro Tsuchiya, Torahiko Sasaki, Makoto Imai, Hideki Tojima, Tadakazu Harada, Tomoaki Mitsunaga
  • Patent number: 8405221
    Abstract: Disclosed herein is a semiconductor device including: an input terminal receiving, if a preceding-stage semiconductor device is layered on a predetermined one of an upper layer and a lower layer, a bit train outputted from the preceding-stage semiconductor device; a semiconductor device identifier hold block holding a semiconductor device identifier for uniquely identifying the semiconductor device; a semiconductor device identifier computation block executing computation by using the semiconductor device identifier to update the semiconductor device identifier held in the semiconductor device identifier hold block according to a result of the computation; a control block once holding data of a bit train entered from the input terminal to control updating of the semiconductor device identifier executed by the semiconductor device identifier computation block based on the held data; and an output terminal outputting the bit train held in the control block to a succeeding-stage semiconductor device layered on a
    Type: Grant
    Filed: June 17, 2011
    Date of Patent: March 26, 2013
    Assignee: Sony Corporation
    Inventor: Makoto Imai
  • Publication number: 20130062749
    Abstract: A semiconductor module that can be connected with simple wiring is provided. A semiconductor device of the semiconductor module is provided with a semiconductor substrate, a first electrode formed on one surface of the semiconductor substrate, and a second electrode formed on a surface of the semiconductor substrate opposite to the one surface. The semiconductor module is provided with a first electrode plate being in contact with the first electrode, a second electrode plate being in contact with the second electrode, and a first wiring member connected to the second electrode plate and penetrating the first electrode plate in a state of being insulated from the first electrode plate. The first electrode plate, the semiconductor device, and the second electrode plate are fixed with each other by an application of a pressure pressurizing the semiconductor device on the first electrode plate and the second electrode plate.
    Type: Application
    Filed: July 20, 2012
    Publication date: March 14, 2013
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAIHSA
    Inventor: Makoto IMAI
  • Publication number: 20130009168
    Abstract: A semiconductor module is disclosed that includes a semiconductor element, a capacitor configured to be electrically connected to the semiconductor element and a heat sink, wherein the semiconductor and the capacitor are stacked with each other via the heat sink, and wherein the semiconductor element is disposed in a position overlapping with the capacitor as viewed from a stack direction.
    Type: Application
    Filed: April 17, 2012
    Publication date: January 10, 2013
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Jiro TSUCHIYA, Torahiko SASAKI, Makoto IMAI, Hideki TOJIMA, Tadakazu HARADA, Tomoaki MITSUNAGA
  • Patent number: 8324425
    Abstract: Methods for producing compounds having activity as an ?2? ligand are provided.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: December 4, 2012
    Assignee: Daiichi Sankyo Company, Limited
    Inventors: Yutaka Kitagawa, Makoto Imai