Abstract: The present disclosure describes a method of controlling a manufacturing system using multivariate time series and includes storing recording data as a plurality of time series, each time series having a first recorded value and a final recorded value, interpolating, within a first time window, missing values in the plurality of time series using a Bayesian model, the missing values falling between a first and an end time of the respective time series, storing the interpolated values as prediction data, each interpolated value including an uncertainty, loading recorded data of a second time window, loading prediction data of the second time window, predicting, using the Bayesian model, values for each time series that is absent recorded data and prediction data, storing the predicted values, each prediction value including an uncertainty, and adjusting a device that generates the recorded data based on the prediction values within the second time window.

Abstract: The present disclosure describes a computer-implemented method for detecting anomalies during lot production, wherein the products within a production lot are processed according to a sequence of steps that include manufacturing steps and one or more quality control steps interspersed among the manufacturing steps, the method comprising: obtaining process quality inspection data from each of the one or more quality control steps for a first production lot; obtaining product characteristics data for the products in the first production lot after the final step in the sequence; training a Gaussian process regression model using the process quality inspection data and the product characteristics data from the first production lot; generating a predictive distribution of the product characteristics data using the Gaussian process regression model that uses a bathtub kernel function; obtaining process quality inspection data from each of the quality control steps for a second production lot; identifying anomalies

Abstract: An imaging device that includes a wiring substrate, an image sensor package mounted on the wiring substrate, a package frame attached to a light receiving surface side of the image sensor package, and a lens holder arranged to cover the package frame and holding a lens unit so that the lens unit faces the light receiving surface of the image sensor package. The package frame includes a material having a larger coefficient of linear expansion than a material of the lens holder, and includes a wall portion that extends in a direction perpendicular to the wiring substrate toward the wiring substrate. A gap is provided between the wall portion of the package frame and the image sensor package, and between an end of the wall portion of the package frame and the wiring substrate. The lens holder includes a wall portion facing the wall portion of the package frame.

Abstract: In a semiconductor device, a first package is provided with a first substrate under which a semiconductor chip configured to output a signal and a first wiring electrically connected to the semiconductor chip are arranged. A second package is provided with a second substrate above which a processing circuit configured to process the output signal, a second wiring electrically connected to the processing circuit, and an encapsulant configured to seal the processing circuit are arranged, the semiconductor chip and the encapsulant being arranged to face each other in a non-contact manner. A connection portion electrically connects the first wiring and the second wiring.

Abstract: The present disclosure describes a method of controlling a manufacturing system using multivariate time series, the method comprising: recording data from one or more devices in the manufacturing system; storing the recorded data in a data storage as a plurality of time series, wherein each time series has a first recorded value corresponding to a first time and a final recorded value corresponding to an end of the time series; interpolating, within a first time window, missing values in the plurality of time series using a Bayesian model, wherein the missing values fall between the first and end time of the respective time series; storing the interpolated values as prediction data in a prediction storage, wherein the interpolated values include the uncertainty of each interpolated value; loading the recorded data that fall within a second time window from the data storage; loading prediction data from the prediction storage that fall within the second time window and for which no recorded data are available;

Abstract: An inspection method for a pillar-shaped honeycomb filter having a honeycomb-shaped first end face and a honeycomb-shaped second end face, including: allowing gas containing fine particles to flow into the first end face; imaging the entire second end face covered with the sheet-like light using a camera while the gas that has flowed into the first end face flows out of the second end face through the filter, and generating an image of the entire second end face covered with the sheet-like light; selecting an inspection area of the second end face and measuring information concerning a sum of luminance of all pixels in the inspection area; and determining quality of the filter based on at least the information concerning the concentration of the fine particles in the gas before the gas flows into the first end face and the information concerning the sum of luminance.

Abstract: A vehicle strengthening member includes a top wall and a pair of lateral walls so that the vehicle strengthening member has a hat-shaped cross section. The vehicle strengthening member further includes a plurality of bend portions each of which is bent along a fold line extending in a transverse direction so that the vehicle strengthening member is curved as a whole. The top wall includes a recess extending in a longitudinal direction along a center of the top wall. The top wall also includes a pair of ridges extending in the longitudinal direction on lateral sides of the recess. The top wall further includes at least one raised bead formed in the recess at a position corresponding to each of the bend portions, each raised bead extending in the transverse direction. Each raised bead comprises ends, each of which is joined to a side of the ridge.

Abstract: The present disclosure describes a method of controlling a manufacturing system using multivariate time series, the method comprising: recording data from one or more devices in the manufacturing system; storing the recorded data in a data storage as a plurality of time series, wherein each time series has a first recorded value corresponding to a first time and a final recorded value corresponding to an end of the time series; interpolating, within a first time window, missing values in the plurality of time series using a Bayesian model, wherein the missing values fall between the first and end time of the respective time series; storing the interpolated values as prediction data in a prediction storage, wherein the interpolated values include the uncertainty of each interpolated value; loading the recorded data that fall within a second time window from the data storage; loading prediction data from the prediction storage that fall within the second time window and for which no recorded data are available;

Abstract: Provided is a press-formed article manufacturing method including pressing a blank with the first pressing apparatus to form a first intermediate formed article having a pair of bent portions bent to one side in the plate thickness direction and having a spacing between the bent portions narrower than the width of the top plate and equal to or more than the width of the top portion of the convex portion, and moving the second die relative to the second punch side punch with respect to the die pad and the second punch and forming a second intermediate formed article in a state where a portion between the bent portions is sandwiched between the die pad and the convex portion, with one side of the first intermediate formed article in the plate thickness direction as the convex portion side of the second pressing apparatus.

Abstract: The present disclosure describes a computer-implemented method for detecting anomalies during lot production, wherein the products within a production lot are processed according to a sequence of steps that include manufacturing steps and one or more quality control steps interspersed among the manufacturing steps, the method comprising: obtaining process quality inspection data from each of the one or more quality control steps for a first production lot; obtaining product characteristics data for the products in the first production lot after the final step in the sequence; training a Gaussian process regression model using the process quality inspection data and the product characteristics data from the first production lot; generating a predictive distribution of the product characteristics data using the Gaussian process regression model that uses a bathtub kernel function; obtaining process quality inspection data from each of the quality control steps for a second production lot; identifying anomalies

Abstract: The present disclosure describes a method of controlling a manufacturing system using multivariate time series, the method comprising: recording data from one or more devices in the manufacturing system; storing the recorded data in a data storage as a plurality of time series, wherein each time series has a first recorded value corresponding to a first time and a final recorded value corresponding to an end of the time series; interpolating, within a first time window, missing values in the plurality of time series using a Bayesian model, wherein the missing values fall between the first and end time of the respective time series; storing the interpolated values as prediction data in a prediction storage, wherein the interpolated values include the uncertainty of each interpolated value; loading the recorded data that fall within a second time window from the data storage; loading prediction data from the prediction storage that fall within the second time window and for which no recorded data are available;

Abstract: An autonomous cart includes an obstacle detecting member, a driving member, a storing section, and a control section. The obstacle detecting member outputs detection information including an obstacle position and obstacle luminance within a planar obstacle-detection region. The storing section stores designated area map information indicating a position of an obstacle within a designated area. At least one command member to which a command for the control section is assigned is included in the obstacle and is disposed within the designated area at a position where execution of the command is desired. The control section controls the driving member based on the designated area map information and a current position of the autonomous cart to cause the autonomous cart to autonomously travel while avoiding the obstacle within the designated area. The control section follows the command detected by the control section based on the obstacle luminance in the detection information.

Abstract: An omnidirectional wheel includes a plurality of first and second rollers, a plurality of roller support parts, a wheel hub, and a fixing member. The wheel hub has a shaft portion and an extension. The fixing member and an elastic body are disposed to surround the shaft portion. Spaces are provided between the elastic body and the shaft portion, or between the elastic body and the roller support parts. A plurality of first pins and second pins are formed to protrude from the extension and the fixing member, respectively. The elastic body has a plurality of first holes and second holes. The first holes and the second holes are shifted from each other in a circumferential direction of the elastic body.

Abstract: An inspection method for a pillar-shaped honeycomb filter having a honeycomb-shaped first end face and a honeycomb-shaped second end face, including: allowing gas containing fine particles to flow into the first end face; imaging the entire second end face covered with the sheet-like light using a camera while the gas that has flowed into the first end face flows out of the second end face through the filter, and generating an image of the entire second end face covered with the sheet-like light; selecting an inspection area of the second end face and measuring information concerning a sum of luminance of each pixel in the inspection area; and determining quality of the filter based on at least the information concerning the concentration of the fine particles in the gas before the gas flows into the first end face and the information concerning the sum of luminance.

Abstract: In a semiconductor device, a first package is provided with a first substrate under which a semiconductor chip configured to output a signal and a first wiring electrically connected to the semiconductor chip are arranged. A second package is provided with a second substrate above which a processing circuit configured to process the output signal, a second wiring electrically connected to the processing circuit, and an encapsulant configured to seal the processing circuit are arranged, the semiconductor chip and the encapsulant being arranged to face each other in a non-contact manner. A connection portion electrically connects the first wiring and the second wiring.

Abstract: In the semiconductor device, a first package is provided with a first substrate under which a semiconductor chip configured to output a signal and a first wiring electrically connected to the semiconductor chip are arranged. A second package is provided with a second substrate above which a processing circuit configured to process the output signal, a second wiring electrically connected to the processing circuit, and an encapsulant configured to seal the processing circuit are arranged, the semiconductor chip and the encapsulant being arranged to face each other in a non-contact manner. A connection portion electrically connects the first wiring and the second wiring.

Abstract: An imaging device includes: a wiring substrate; an image sensor package mounted on the wiring substrate; a package frame attached to a light receiving surface side of the image sensor package; and a lens holder arranged to cover the package frame and holding a lens unit so that the lens unit faces the light receiving surface of the image sensor package. The package frame includes a material having a larger coefficient of linear expansion than a material of the lens holder, and includes a wall portion that extends in a direction perpendicular to the wiring substrate toward the wiring substrate. A gap is provided between the wall portion of the package frame and the image sensor package, and between an end of the wall portion of the package frame and the wiring substrate. The lens holder includes a wall portion facing the wall portion of the package frame. An end of the wall portion of the lens holder is fixed to the end of the wall portion of the package frame while being separated from the wiring substrate.

Abstract: A semiconductor chip includes a chip body and a plurality of solder-including electrodes provided on an element-formation surface of the chip body. A packaging substrate includes a substrate body, a plurality of wirings, and a solder resist layer, in which the plurality of wirings and the solder resist layer are provided on a front surface of the substrate body. The solder resist layer is provided as a continuous layer on the front surface of the substrate body and the plurality of wirings, and has an aperture on each of the plurality of wirings. The plurality of solder-including electrodes include at least one gap control electrode. The at least one gap control electrode includes a columnar metal layer and a solder layer in order named from side on which the chip body is disposed, and includes an overlap region where the columnar metal layer and the solder resist layer overlap each other, along part or all of an aperture end of the aperture.

Abstract: A semiconductor chip includes a chip body and a plurality of solder-including electrodes provided on an element-formation surface of the chip body. A packaging substrate includes a substrate body, and one or more conductive layers and a solder resist layer that are provided on a front surface of the substrate body. The solder resist layer is provided as a continuous layer on the front surface of the substrate body and the one or more conductive layers, and has one or more apertures on each of the one or more conductive layers. The plurality of solder-including electrodes include two or more first electrodes having a same function other than a function of power supply. The one or more conductive layers include a continuous first conductive layer. The two or more first electrodes are connected to the continuous first conductive layer. The one or more apertures are confronted with the respective two or more first electrodes.

Abstract: Provided is a press-formed article manufacturing method including a first step of pressing a blank with the first pressing apparatus to form a first intermediate formed article having a pair of bent portions that is bent to one side in the plate thickness direction and having a spacing between the bent portions that is narrower than the width of the top plate and equal to or more than the width of the top portion of the convex portion, and a second step of moving the second die relative to the second punch side punch with respect to the die pad and the second punch and forming a second intermediate formed article, having the standing wall formed therein, with the second die and the second punch, in a state where a portion between the bent portions is sandwiched between the die pad protruding from the second die to the second punch side punch, and the convex portion, with one side of the first intermediate formed article in the plate thickness direction as the convex portion side of the second pressing apparat