Patents by Inventor Makoto Sunakawa

Makoto Sunakawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5959011
    Abstract: A method for removing a resist pattern formed on a semiconductor wafer, and a curable pressure-sensitive adhesive, adhesive sheets and an apparatus used for the method. The resist-removing method comprising adhering an adhesive tape on an upper surface of a resist pattern formed on an article and peeling off the resist pattern together with the adhesive tape; the curable pressure-sensitive adhesive constituting the adhesive tape, comprising a pressure-sensitive adhesive polymer containing a non-volatile compound having at least one unsaturated double bond in the molecule and having a good affinity with a resist material to be removed; the adhesive sheet comprising a film substrate having formed thereon the curable pressure-sensitive adhesive; and the resist-removing apparatus comprising a means for press-adhering the adhesive tape, a tape-peeling means, and a substrate-washing means.
    Type: Grant
    Filed: November 18, 1996
    Date of Patent: September 28, 1999
    Assignees: Nitto Denko Corporation, Hitachi, Ltd.
    Inventors: Fumio Mizuno, Noburu Moriuchi, Seiichiro Shirai, Yutaka Moroishi, Makoto Sunakawa, Michirou Kawanishi
  • Patent number: 5466325
    Abstract: A method for removing a resist pattern formed on a semiconductor wafer, and a curable pressure-sensitive adhesive, adhesive sheets and an apparatus used for the method. The resist-removing method comprising adhering an adhesive tape on an upper surface of a resist pattern formed on an article and peeling off the resist pattern together with the adhesive tape; the curable pressure-sensitive adhesive constituting the adhesive tape, comprising a pressure-sensitive adhesive polymer containing a non-volatile compound having at least one unsaturated double bond in the molecule and having a good affinity with a resist material to be removed; the adhesive sheet comprising a film substrate having formed thereon the curable pressure-sensitive adhesive; and the resist-removing apparatus comprising a means for press-adhering the adhesive tape, a tape-peeling means, and a substrate-washing means.
    Type: Grant
    Filed: August 11, 1994
    Date of Patent: November 14, 1995
    Assignees: Nitto Denko Corporation, Hitachi Ltd.
    Inventors: Fumio Mizuno, Noboru Moriuchi, Seiichiro Shirai, Yutaka Moroishi, Makoto Sunakawa, Michirou Kawanishi
  • Patent number: 5227009
    Abstract: A masking sheet comprising a corrosion-resistant film and, formed thereon, a layer of an adhesive comprising at least one of a chloroprene rubber, a nitrile rubber, and a styrene-butadiene rubber.
    Type: Grant
    Filed: March 10, 1992
    Date of Patent: July 13, 1993
    Assignees: Nitto Denko Corporation, Shin Meiwa Industry
    Inventors: Makoto Sunakawa, Chikara Kohbayashi, Rokuo Ono
  • Patent number: 4935458
    Abstract: A release agent comprising a polyfunctional alkoxysiloxane and an organic compound which is solid at room temperature and contains a functional group capable of reacting with said polyfunctional alkoxysiloxane, and a composite material comprising a substrate and a cured film of the release agent are disclosed. The cured film of the release agent exhibits high strength and excellent release properties without causing blocking or contamination on an adherent.
    Type: Grant
    Filed: January 18, 1989
    Date of Patent: June 19, 1990
    Assignee: Nitto Denko Corporation
    Inventors: Kihachi Suzuki, Makoto Sunakawa, Hiroshi Yamamoto
  • Patent number: 4510181
    Abstract: A method for coating a metal surface by forming a corrosion-protective layer on the metal surface or a defective area of a corrosion-protective layer formed on the metal surface, which comprises using a coating material selected from the group consisting of a tape-like, sheet-like and chip-like polymerizable coating material comprising a vinyl monomer and/or a vinyl group-containing oligomer and a liquid material comprising a vinyl monomer and/or a vinyl group-containing oligomer, wherein either the coating material or the liquid material contains a polymerization initiator and the material not containing the polymerization initiator contains a polymerization accelerator, and polymerizing the vinyl monomer and/or the vinyl monomer-containing oligomer in the state such that the metal surface or the defective area is covered with the coating material by interposing the liquid material therebetween, to form the corrosion-protective layer.
    Type: Grant
    Filed: December 28, 1983
    Date of Patent: April 9, 1985
    Assignee: Nitto Electric Industrial Co., Ltd.
    Inventors: Toshimitsu Okuno, Yutaka Hori, Makoto Sunakawa, Sadayuki Inagaki
  • Patent number: 4500683
    Abstract: A pressure-sensitive adhesive composition containing as a polymer component an addition-polymerization polymer of an acryl-based polymer having sticking properties at room temperature and one or more ethylenically unsaturated monomers capable of forming a homo- or co-polymer having a glass transition point of at least 273.degree. K.; the addition-polymerization polymer is prepared by polymerizing one or more ethylenically unsaturated monomers in the presence of the acryl-based polymer; the present pressure-sensitive adhesive composition has high adhesive strength and cohesive strength.
    Type: Grant
    Filed: June 8, 1984
    Date of Patent: February 19, 1985
    Assignee: Nitto Electric Industrial Co., Ltd.
    Inventors: Yutaka Hori, Makoto Sunakawa, Kikuo Takayama, Naoki Matsuoka, Yutaka Moroishi
  • Patent number: 4453997
    Abstract: A method for bonding which comprises: interposing between the articles to be bonded at least one of which has an aqueous moisture content in a normal condition of at least about 1% by weight based on the weight of the article, a moisture curable adhesive material and then heating the assembly under pressure to supply water vapor from the moisture-containing article to cure the adhesive material, wherein said adhesive material comprises a sheet, film or tape of a thermofusible adhesive resin and/or rubber containing about 0.1 to 20% by weight based on the weight of the resin and/or rubber of a carboxyl group and not more than about 0.5% by weight free water and uniformly dispersed therein, a powder of an oxide of a metal of Group IIa of Mendeleev's Periodic Table having an average particle diameter of about 0.1 to 1,000.mu..
    Type: Grant
    Filed: February 28, 1983
    Date of Patent: June 12, 1984
    Assignee: Nitto Electric Industrial Co., Ltd.
    Inventors: Yutaka Hori, Makoto Sunakawa, Michio Satsuma
  • Patent number: 4442258
    Abstract: A water-soluble pressure-sensitive adhesive composition is described containing a polymerization product obtained by the solution polymerization of a water-soluble ethylenically unsaturated monomer in the presence of an alcoholic plasticizer having a molecular weight of less than about 3,000 and which is a liquid at room temperature, selected from the group consisting of polyether polyols and polyhydric alcohols, wherein the polymerization product contains as a polymer component at least an addition copolymer of the water-soluble ethylenically unsaturated monomer and the alcoholic plasticizer.
    Type: Grant
    Filed: July 3, 1980
    Date of Patent: April 10, 1984
    Assignee: Nitto Electric Industrial Co., Ltd.
    Inventors: Makoto Sunakawa, Yutaka Moroishi, Isao Mune
  • Patent number: 4243462
    Abstract: A heat-curable multilayer composite sheet comprising a layer comprising one or more unsaturated compounds which are normally solid or liquid free radical reactive unsaturated compounds and a layer comprising a normally solid or liquid free radical initiator, the layers being bonded to each other as a laminate as separate layers at a temperature at which the free radical initiator does not lose its free radical reaction-initiating capability, and,a process for preparing a heat-curable multilayer composite sheet, which comprises coating a layer-forming material containing a normally solid or liquid free radical reactive unsaturated compound on a strippable sheet to form an unsaturated compound material layer on the strippable sheet, coating a layer-forming material containing a normally solid or liquid free radical initiator on a strippable sheet to form a free initiator layer on the strippable sheet, bringing the unsaturated compound material layer into contact with the free radical initiator layer, and bondin
    Type: Grant
    Filed: May 4, 1979
    Date of Patent: January 6, 1981
    Assignee: Nitto Electric Industrial Co., Ltd.
    Inventors: Yutaka Hori, Hidekazu Takahashi, Makoto Sunakawa, Ichiro Ijichi, Kiyohiro Kamei
  • Patent number: 4091157
    Abstract: A heat-curable multilayer composite sheet comprising a layer comprising one or more unsaturated compounds which are normally solid or liquid free radical reactive unsaturated compounds and a layer comprising a normally solid or liquid free radical initiator, the layers being bonded to each other as a laminate as separate layers at a temperature at which the free radical initiator does not lose its free radical reaction initiating capability, and,A process for preparing a heat-curable multilayer composite sheet, which comprises coating a layer-forming material containing a normally solid or liquid free radical reactive unsaturated compound on a strippable sheet to form an unsaturated compound material layer on the strippable sheet, coating a layer-forming material containing a normally solid or liquid free radical initiator on a strippable sheet to form a free initiator layer on the strippable sheet, bringing the unsaturated compound material layer into contact with the free radical initiator layer, and bondin
    Type: Grant
    Filed: February 4, 1976
    Date of Patent: May 23, 1978
    Assignee: Nitto Electric Industrial Co., Ltd.
    Inventors: Yutaka Hori, Hidekazu Takahashi, Makoto Sunakawa, Ichiro Ijichi, Kiyohiro Kamei