Patents by Inventor Mamoru FUKUNAGA

Mamoru FUKUNAGA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220248530
    Abstract: A wiring substrate having no core substrate includes a build-up layer including insulating layers and conductor layers such that the insulating layers include first, second, third and fourth insulating layers and that the conductor layers include a first conductor layer formed on the first insulating layer and a second conductor layer formed on the second insulating layer. The build-up layer has a first surface having the first insulating and first conductor layers, a second surface having the second insulating and second conductor layers, the third insulating layer formed on the first insulating layer on the opposite side of the first conductor layer, and the fourth insulating layer formed on the second insulating layer on the opposite side of the second conductor layer, and the build-up layer is formed such that the first and second insulating layers contain no core material and the third and fourth insulating layer include core material.
    Type: Application
    Filed: January 20, 2022
    Publication date: August 4, 2022
    Applicant: IBIDEN CO., LTD.
    Inventors: Yoji MORI, Mamoru FUKUNAGA, Shota TACHIBANA