Patents by Inventor Mamoru KAWAUCHI

Mamoru KAWAUCHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240038436
    Abstract: A multilayer coil component includes an element body, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a principal surface that is a mounting surface, and an end surface positioned adjacent to the principal surface and extending in a direction crossing to the principal surface. The external electrode includes an underlying metal layer and a conductive resin layer. The underlying metal layer is formed on the principal surface and the end surface. The conductive resin layer is formed to cover the underlying metal layer. A thickness of the conductive resin layer at an end positioned above the principal surface of the underlying metal layer is equal to or greater than 50% of a maximum thickness of a portion positioned above the principal surface of the conductive resin layer.
    Type: Application
    Filed: October 11, 2023
    Publication date: February 1, 2024
    Applicant: TDK CORPORATION
    Inventors: Masashi SHIMOYASU, Shinichi SATO, Seiichi NAKAGAWA, Mamoru KAWAUCHI, Shigetoshi KINOUCHI, Mitsuru ITO, Yuto SHIGA
  • Patent number: 11817252
    Abstract: A multilayer coil component includes an element body, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a principal surface that is a mounting surface, and an end surface positioned adjacent to the principal surface and extending in a direction crossing to the principal surface. The external electrode includes an underlying metal layer and a conductive resin layer. The underlying metal layer is formed on the principal surface and the end surface. The conductive resin layer is formed to cover the underlying metal layer. A thickness of the conductive resin layer at an end positioned above the principal surface of the underlying metal layer is equal to or greater than 50% of a maximum thickness of a portion positioned above the principal surface of the conductive resin layer.
    Type: Grant
    Filed: January 11, 2022
    Date of Patent: November 14, 2023
    Assignee: TDK CORPORATION
    Inventors: Masashi Shimoyasu, Shinichi Sato, Seiichi Nakagawa, Mamoru Kawauchi, Shigetoshi Kinouchi, Mitsuru Ito
  • Publication number: 20220130594
    Abstract: A multilayer coil component includes an element body, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a principal surface that is a mounting surface, and an end surface positioned adjacent to the principal surface and extending in a direction crossing to the principal surface. The external electrode includes an underlying metal layer and a conductive resin layer. The underlying metal layer is formed on the principal surface and the end surface. The conductive resin layer is formed to cover the underlying metal layer. A thickness of the conductive resin layer at an end positioned above the principal surface of the underlying metal layer is equal to or greater than 50% of a maximum thickness of a portion positioned above the principal surface of the conductive resin layer.
    Type: Application
    Filed: January 11, 2022
    Publication date: April 28, 2022
    Applicant: TDK CORPORATION
    Inventors: Masashi SHIMOYASU, Shinichi SATO, Seiichi NAKAGAWA, Mamoru KAWAUCHI, Shigetoshi KINOUCHI, Mitsuru ITO
  • Patent number: 11270833
    Abstract: A multilayer coil component includes an element body, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a principal surface that is a mounting surface, and an end surface positioned adjacent to the principal surface and extending in a direction crossing to the principal surface. The external electrode includes an underlying metal layer and a conductive resin layer. The underlying metal layer is formed on the principal surface and the end surface. The conductive resin layer is formed to cover the underlying metal layer. A thickness of the conductive resin layer at an end positioned above the principal surface of the underlying metal layer is equal to or greater than 50% of a maximum thickness of a portion positioned above the principal surface of the conductive resin layer.
    Type: Grant
    Filed: February 13, 2020
    Date of Patent: March 8, 2022
    Assignee: TDK CORPORATION
    Inventors: Masashi Shimoyasu, Shinichi Sato, Seiichi Nakagawa, Mamoru Kawauchi, Shigetoshi Kinouchi, Mitsuru Ito
  • Patent number: 11239020
    Abstract: A multilayer coil component includes an element body, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a principal surface that is a mounting surface, and an end surface positioned adjacent to the principal surface and extending in a direction crossing to the principal surface. The external electrode includes an underlying metal layer and a conductive resin layer. The underlying metal layer is formed on the principal surface and the end surface. The conductive resin layer is formed to cover the underlying metal layer. A thickness of the conductive resin layer at an end positioned above the principal surface of the underlying metal layer is equal to or greater than 50% of a maximum thickness of a portion positioned above the principal surface of the conductive resin layer.
    Type: Grant
    Filed: February 13, 2020
    Date of Patent: February 1, 2022
    Assignee: TDK CORPORATION
    Inventors: Masashi Shimoyasu, Shinichi Sato, Seiichi Nakagawa, Mamoru Kawauchi, Shigetoshi Kinouchi, Mitsuru Ito
  • Patent number: 11189413
    Abstract: First internal conductors are separated from each other in a first direction. Each of the first internal conductors includes a coil portion and a pad portion having a width larger than a width of the coil portion. The pad portions adjacent to each other in the first direction are connected to each other via a through-hole conductor and overlap each other when viewed from the first direction. When viewed from the first direction, each of the coil portions includes a first portion not overlapping the pad portion adjacent in the first direction and a second portion overlapping a part of the pad portion adjacent in the first direction. A second internal conductor is disposed on the same layer as the second portion and is positioned to overlap a portion of the pad portion adjacent in the first direction not overlapping the second portion when viewed from the first direction.
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: November 30, 2021
    Assignee: TDK CORPORATION
    Inventors: Yuya Oshima, Shinichi Kondo, Junichi Otsuka, Yohei Tadaki, Kazuo Iwai, Masayuki Suzuki, Shigeshi Osawa, Kazuhiro Ebina, Makoto Yoshino, Mamoru Kawauchi
  • Patent number: 11127529
    Abstract: A method of manufacturing a laminated coil component is a method of manufacturing a laminated coil component provided with a laminate obtained by laminating a coil conductor forming a spiral coil and an insulator layer. The method of manufacturing a laminated coil component includes a step of providing a conductor pattern configured to become a coil conductor on a green sheet configured to become an insulator layer, and a step of laminating a plurality of green sheets provided with the conductor pattern. The conductor pattern includes a pair of first side surfaces opposed to each other in an orthogonal direction orthogonal to a laminating direction of the green sheet. At the step of laminating a plurality of green sheets, a depression is formed on at least one of the pair of first side surfaces.
    Type: Grant
    Filed: April 8, 2020
    Date of Patent: September 21, 2021
    Assignee: TDK CORPORATION
    Inventors: Yuya Oshima, Makoto Yoshino, Yoji Tozawa, Junichi Otsuka, Kazuo Iwai, Yohei Tadaki, Shinichi Kondo, Kazuhiro Ebina, Mamoru Kawauchi
  • Publication number: 20200234877
    Abstract: A method of manufacturing a laminated coil component is a method of manufacturing a laminated coil component provided with a laminate obtained by laminating a coil conductor forming a spiral coil and an insulator layer. The method of manufacturing a laminated coil component includes a step of providing a conductor pattern configured to become a coil conductor on a green sheet configured to become an insulator layer, and a step of laminating a plurality of green sheets provided with the conductor pattern. The conductor pattern includes a pair of first side surfaces opposed to each other in an orthogonal direction orthogonal to a laminating direction of the green sheet. At the step of laminating a plurality of green sheets, a depression is formed on at least one of the pair of first side surfaces.
    Type: Application
    Filed: April 8, 2020
    Publication date: July 23, 2020
    Applicant: TDK CORPORATION
    Inventors: Yuya OSHIMA, Makoto YOSHINO, Yoji TOZAWA, Junichi OTSUKA, Kazuo IWAI, Yohei TADAKI, Shinichi KONDO, Kazuhiro EBINA, Mamoru KAWAUCHI
  • Publication number: 20200185144
    Abstract: A multilayer coil component includes an element body, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a principal surface that is a mounting surface, and an end surface positioned adjacent to the principal surface and extending in a direction crossing to the principal surface. The external electrode includes an underlying metal layer and a conductive resin layer. The underlying metal layer is formed on the principal surface and the end surface. The conductive resin layer is formed to cover the underlying metal layer. A thickness of the conductive resin layer at an end positioned above the principal surface of the underlying metal layer is equal to or greater than 50% of a maximum thickness of a portion positioned above the principal surface of the conductive resin layer.
    Type: Application
    Filed: February 13, 2020
    Publication date: June 11, 2020
    Applicant: TDK CORPORATION
    Inventors: Masashi SHIMOYASU, Shinichi SATO, Seiichi NAKAGAWA, Mamoru KAWAUCHI, Shigetoshi KINOUCHI, Mitsuru ITO
  • Patent number: 10665388
    Abstract: A method of manufacturing a laminated coil component is a method of manufacturing a laminated coil component provided with a laminate obtained by laminating a coil conductor forming a spiral coil and an insulator layer. The method of manufacturing a laminated coil component includes a step of providing a conductor pattern configured to become a coil conductor on a green sheet configured to become an insulator layer, and a step of laminating a plurality of green sheets provided with the conductor pattern. The conductor pattern includes a pair of first side surfaces opposed to each other in an orthogonal direction orthogonal to a laminating direction of the green sheet. At the step of laminating a plurality of green sheets, a depression is formed on at least one of the pair of first side surfaces.
    Type: Grant
    Filed: October 4, 2017
    Date of Patent: May 26, 2020
    Assignee: TDK CORPORATION
    Inventors: Yuya Oshima, Makoto Yoshino, Yoji Tozawa, Junichi Otsuka, Kazuo Iwai, Yohei Tadaki, Shinichi Kondo, Kazuhiro Ebina, Mamoru Kawauchi
  • Patent number: 10643781
    Abstract: A multilayer coil component includes an element body, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a principal surface that is a mounting surface, and an end surface positioned adjacent to the principal surface and extending in a direction crossing to the principal surface. The external electrode includes an underlying metal layer and a conductive resin layer. The underlying metal layer is formed on the principal surface and the end surface. The conductive resin layer is formed to cover the underlying metal layer. A thickness of the conductive resin layer at an end positioned above the principal surface of the underlying metal layer is equal to or greater than 50% of a maximum thickness of a portion positioned above the principal surface of the conductive resin layer.
    Type: Grant
    Filed: May 18, 2017
    Date of Patent: May 5, 2020
    Assignee: TDK CORPORATION
    Inventors: Masashi Shimoyasu, Shinichi Sato, Seiichi Nakagawa, Mamoru Kawauchi, Shigetoshi Kinouchi, Mitsuru Ito, Yuto Shiga
  • Publication number: 20190122800
    Abstract: First internal conductors are separated from each other in a first direction. Each of the first internal conductors includes a coil portion and a pad portion having a width larger than a width of the coil portion. The pad portions adjacent to each other in the first direction are connected to each other via a through-hole conductor and overlap each other when viewed from the first direction. When viewed from the first direction, each of the coil portions includes a first portion not overlapping the pad portion adjacent in the first direction and a second portion overlapping a part of the pad portion adjacent in the first direction. A second internal conductor is disposed on the same layer as the second portion and is positioned to overlap a portion of the pad portion adjacent in the first direction not overlapping the second portion when viewed from the first direction.
    Type: Application
    Filed: October 12, 2018
    Publication date: April 25, 2019
    Applicant: TDK CORPORATION
    Inventors: Yuya OSHIMA, Shinichi KONDO, Junichi OTSUKA, Yohei TADAKI, Kazuo IWAI, Masayuki SUZUKI, Shigeshi OSAWA, Kazuhiro EBINA, Makoto YOSHINO, Mamoru KAWAUCHI
  • Publication number: 20180096789
    Abstract: A method of manufacturing a laminated coil component is a method of manufacturing a laminated coil component provided with a laminate obtained by laminating a coil conductor forming a spiral coil and an insulator layer. The method of manufacturing a laminated coil component includes a step of providing a conductor pattern configured to become a coil conductor on a green sheet configured to become an insulator layer, and a step of laminating a plurality of green sheets provided with the conductor pattern. The conductor pattern includes a pair of first side surfaces opposed to each other in an orthogonal direction orthogonal to a laminating direction of the green sheet. At the step of laminating a plurality of green sheets, a depression is formed on at least one of the pair of first side surfaces.
    Type: Application
    Filed: October 4, 2017
    Publication date: April 5, 2018
    Applicant: TDK CORPORATION
    Inventors: Yuya OSHIMA, Makoto YOSHINO, Yoji TOZAWA, Junichi OTSUKA, Kazuo IWAI, Yohei TADAKI, Shinichi KONDO, Kazuhiro EBINA, Mamoru KAWAUCHI
  • Publication number: 20170345553
    Abstract: A multilayer coil component includes an element body, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a principal surface that is a mounting surface, and an end surface positioned adjacent to the principal surface and extending in a direction crossing to the principal surface. The external electrode includes an underlying metal layer and a conductive resin layer. The underlying metal layer is formed on the principal surface and the end surface. The conductive resin layer is formed to cover the underlying metal layer. A thickness of the conductive resin layer at an end positioned above the principal surface of the underlying metal layer is equal to or greater than 50% of a maximum thickness of a portion positioned above the principal surface of the conductive resin layer.
    Type: Application
    Filed: May 18, 2017
    Publication date: November 30, 2017
    Applicant: TDK CORPORATION
    Inventors: Masashi SHIMOYASU, Shinichi SATO, Seiichi NAKAGAWA, Mamoru KAWAUCHI, Shigetoshi KINOUCHI, Mitsuru ITO, Yuto SHIGA