Abstract: A semiconductor light emitting device includes a plane substrate having a flat substrate surface, a semiconductor light emitting element mounted on the substrate surface, and a lens formed of a resin which embeds the semiconductor light emitting element and condenses light emitted from the semiconductor light emitting element. A circular ring-shaped metal ring body surrounding the semiconductor light emitting element, and a plurality of regulation holes arranged inside the metal ring body at positions rotationally symmetric with respect to the center of the metal ring body are provided on the substrate surface. A bottom of the lens is defined by the metal ring body and the regulation holes. A body part of the lens has a plurality of valley portions extending toward the top of the lens from the positions of the regulation holes. The top of the lens has a surface as a spheroid surface with an axis vertical to the substrate surface and passing through the center of the metal ring body as a major axis.

Abstract: A method for producing a multi-layer bus bar unit includes preparing a plurality of metal flat plate-shaped bus bars, each with electrode terminal parts at two or more locations, depositing a coating film over an entire surface of each bus bar by electrodeposition coating, subjecting a coating film of a predetermined bus bar to a heating treatment so that the coating film is completely cured, subjecting another bus bar to a heat treatment so that the bus bar is semi-cured, and obtaining a multi-layer structure by alternately overlapping, and then subjecting to a pressure and heating treatment, the bus bar with the completely-cured coating film and the bus bar with the semi-cured coating film, so that the semi-cured coating film is completely cured and the plurality of bus bars adhere to each other by the completely-cured coating film.

Abstract: Some embodiments provide a substrate terminal board in which the number of components is reduced by utilizing a conductor board per se constituting the substrate terminal board while ensuring heat dissipation, and which has a simple structure. Heat-dissipation fins can be cut and raised at a plurality of positions around element mounting portions of an upper-substrate conductor board, thus providing heat-dissipation fins and heat-dissipation openings. The upper-substrate conductor board can be coated with a paint film to form an upper substrate. A lower-substrate conductor board can be coated with the paint film to form a lower substrate. In a pressing/heating process, the lower substrate and the upper substrate can overlap each other and be vertically pressed while the lower substrate and the upper substrate are heated to completely cure the paint film, thereby causing the paint film on the lower substrate and the paint film on the upper substrate to adhere to each other.

Abstract: Some embodiments provide a substrate terminal board in which the number of components is reduced by utilizing a conductor board per se constituting the substrate terminal board while ensuring heat dissipation, and which has a simple structure. Heat-dissipation fins can be cut and raised at a plurality of positions around element mounting portions of an upper-substrate conductor board, thus providing heat-dissipation fins and heat-dissipation openings. The upper-substrate conductor board can be coated with a paint film to form an upper substrate. A lower-substrate conductor board can be coated with the paint film to form a lower substrate. In a pressing/heating process, the lower substrate and the upper substrate can overlap each other and be vertically pressed while the lower substrate and the upper substrate are heated to completely cure the paint film, thereby causing the paint film on the lower substrate and the paint film on the upper substrate to adhere to each other.

Abstract: A method for producing a multi-layer bus bar unit includes preparing a plurality of metal flat plate-shaped bus bars, each with electrode terminal parts at two or more locations, depositing a coating film over an entire surface of each bus bar by electrodeposition coating, subjecting a coating film of a predetermined bus bar to a heating treatment so that the coating film is completely cured, subjecting another bus bar to a heat treatment so that the bus bar is semi-cured, and obtaining a multi-layer structure by alternately overlapping, and then subjecting to a pressure and heating treatment, the bus bar with the completely-cured coating film and the bus bar with the semi-cured coating film, so that the semi-cured coating film is completely cured and the plurality of bus bars adhere to each other by the completely-cured coating film.

Abstract: Methods for manufacturing semiconductor light-emitting devices and semiconductor light-emitting devices having a high radiating performance and can include a metallic laminate substrate, a semiconductor light-emitting chip and a transparent resin. The metallic laminate substrate can include a cavity so as to be able to accurately mount the light-emitting chip, and also can structures to efficiently radiate heat generated from the light-emitting chip. The transparent resin to encapsulate the semiconductor light-emitting chip in the cavity can include various wavelength converting materials. Additionally, the light-emitting devices can be manufactured in manufacturing processes similar to conventional light-emitting devices.

Abstract: Methods for manufacturing semiconductor light-emitting devices and semiconductor light-emitting devices having a high radiating performance and can include a metallic laminate substrate, a semiconductor light-emitting chip and a transparent resin. The metallic laminate substrate can include a cavity so as to be able to accurately mount the light-emitting chip, and also can structures to efficiently radiate heat generated from the light-emitting chip. The transparent resin to encapsulate the semiconductor light-emitting chip in the cavity can include various wavelength converting materials. Additionally, the light-emitting devices can be manufactured in manufacturing processes similar to conventional light-emitting devices.