Patents by Inventor Manoocher Birang

Manoocher Birang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7255629
    Abstract: The polishing pad for a chemical mechanical polishing apparatus, and a method of making the same. The polishing pad has a covering layer with a polishing surface and a backing layer which is adjacent to the platen. A first opening in the covering layer with a first cross-sectional area and a second opening in the backing layer with a second, different cross-sectional area form an aperture through the polishing pad. A substantially transparent polyurethane plug is positioned in the aperture, and an adhesive material fixes the plug in the aperture.
    Type: Grant
    Filed: September 15, 2006
    Date of Patent: August 14, 2007
    Assignee: Applied Materials, Inc.
    Inventors: Manoocher Birang, Allan Gleason, William L. Guthrie
  • Publication number: 20070139043
    Abstract: An eddy current monitoring system may include an elongated core. One or more coils may be coupled with the elongated core for producing an oscillating magnetic field that may couple with one or more conductive regions on a wafer. The core may be translated relative to the wafer to provide improved resolution while maintaining sufficient signal strength. An eddy current monitoring system may include a DC-coupled marginal oscillator for producing an oscillating magnetic field at a resonant frequency, where the resonant frequency may change as a result of changes to one or more conductive regions. Eddy current monitoring systems may be used to enable real-time profile control.
    Type: Application
    Filed: August 16, 2006
    Publication date: June 21, 2007
    Inventors: G. Miller, Boguslaw Swedek, Manoocher Birang
  • Publication number: 20070135958
    Abstract: A chemical mechanical polishing apparatus and method can use an eddy current monitoring system and an optical monitoring system. Signals from the monitoring systems can be combined on an output line and extracted by a computer. A thickness of a polishing pad can be calculated. The eddy current monitoring system and optical monitoring system can measure substantially the same location on the substrate.
    Type: Application
    Filed: February 21, 2007
    Publication date: June 14, 2007
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Boguslaw Swedek, Manoocher Birang, Nils Johansson
  • Patent number: 7229340
    Abstract: A sensor for monitoring a conductive film in a substrate during chemical mechanical polishing generates an alternating magnetic field that impinges a substrate and induces eddy currents. The sensor can have a core, a first coil wound around a first portion of the core and a second coil wound around a second portion of the core. The sensor can be positioned on a side of the polishing surface opposite the substrate. The sensor can detect a phase difference between a drive signal and a measured signal.
    Type: Grant
    Filed: February 15, 2006
    Date of Patent: June 12, 2007
    Assignee: Applied Materials, Inc.
    Inventors: Hiroji Hanawa, Nils Johansson, Boguslaw Swedek, Manoocher Birang
  • Patent number: 7226514
    Abstract: An inventive vertical spin-dryer is provided. The inventive spin-dryer may have a shield system positioned to receive fluid displaced from a substrate vertically positioned within the spin-dryer. The shield system may have one or more shields positioned to at least partially reflect fluid therefrom as the fluid impacts the shield. The one or more shields are angled to encourage the flow of fluid therealong, and are preferably hydrophilic to prevent droplets from forming. Preferably the shield system has three shields positioned in a horizontally and vertically staggered manner so that fluid is transferred from a substrate facing surface of a first shield to the top or non-substrate-facing surface of an adjacent shield, etc. A pressure gradient may be applied across the interior of the spin-dryer to create an air flow which encourages fluid to travel along the shield system in a desired direction.
    Type: Grant
    Filed: December 4, 2002
    Date of Patent: June 5, 2007
    Assignee: Applied Materials, Inc.
    Inventors: Anwar Husain, Brian J. Brown, David G. Andeen, Svetlana Sherman, John M. White, Michael Sugarman, Makoto Inagawa, Manoocher Birang
  • Publication number: 20070111519
    Abstract: Embodiments of the invention provide methods for depositing a material onto a surface of a substrate by using one or more electroless, electrochemical plating, CVD and/or ALD processes. Embodiments of the invention provide a method for depositing a seed layer on a substrate with an electroless process and to subsequently fill interconnect features on the substrate with an ECP process on a single substrate processing platform. Other aspects provide a method for depositing a seed layer on a substrate, fill interconnect features on a substrate, or sequentially deposit both a seed layer and fill interconnect features on the substrate. One embodiment provides a method for forming a capping layer over substrate interconnects. Methods include the use of a vapor dryer for pre- and post-deposition cleaning of substrates as well as a brush box chamber for post-deposition cleaning.
    Type: Application
    Filed: June 30, 2006
    Publication date: May 17, 2007
    Inventors: Dmitry Lubomirsky, Arulkumar Shanmugasundram, Allen D'Ambra, Timothy Weidman, Michael Stewart, Eugene Rabinovich, Svetlana Sherman, Manoocher Birang, Yaxin Wang, Michael Yang, Bradley Hansen
  • Publication number: 20070099552
    Abstract: An article of manufacture and apparatus are provided for processing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive polishing surface. An electrode is disposed below the polishing surface having a dielectric material therebetween. A plurality of apertures may be formed in the polishing surface and the dielectric material to at least partially expose the electrode to the polishing surface. A membrane may be disposed between the electrode and the polishing surface that is permeable to ions and current to promote continuity between the electrode and the polishing surface.
    Type: Application
    Filed: October 31, 2006
    Publication date: May 3, 2007
    Inventors: Liang-Yuh Chen, Yuchun Wang, Yan Wang, Alain Duboust, Daniel Carl, Ralph Wadensweiler, Manoocher Birang, Paul Butterfield, Rashid Mavliev, Stan Tsai, You Wang, Jie Diao, Renhe Jia, Lakshmanan Karuppiah, Robert Ewald
  • Publication number: 20070077862
    Abstract: A method of forming a polishing pad with a polishing layer having a polishing surface and a back surface. A plurality of grooves are formed on the polishing surface, and an indentation is formed in the back surface of the polishing layer. A region on the polishing surface corresponding to the indentation in the back surface is free of grooves or has shallower grooves.
    Type: Application
    Filed: October 9, 2006
    Publication date: April 5, 2007
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Boguslaw Swedek, Manoocher Birang
  • Publication number: 20070068819
    Abstract: The present invention generally relates to apparatus and methods for plating conductive materials on a substrate. One embodiment of the present invention provides an apparatus for plating a conductive material on a substrate. The apparatus comprises a fluid basin configured to retain an electrolyte, a contact ring configured to support the substrate and contact the substrate electrically, and an anode assembly disposed in the fluid basin, wherein the anode assembly comprises a plurality of anode elements arranged in rows.
    Type: Application
    Filed: May 16, 2006
    Publication date: March 29, 2007
    Inventors: Saravjeet Singh, Manoocher Birang, Nicolay Kovarsky, Aron Rosenfeld
  • Patent number: 7195536
    Abstract: A chemical mechanical polishing apparatus and method can use an eddy current monitoring system and an optical monitoring system. Signals from the monitoring systems can be combined on an output line and extracted by a computer. A thickness of a polishing pad can be calculated. The eddy current monitoring system and optical monitoring system can measure substantially the same location on the substrate.
    Type: Grant
    Filed: August 31, 2005
    Date of Patent: March 27, 2007
    Assignee: Applied Materials, Inc.
    Inventors: Boguslaw A. Swedek, Manoocher Birang, Nils Johansson
  • Publication number: 20070066201
    Abstract: An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate. A plurality of perforations may be formed in the polishing article for flow of material therethrough. An electrode is also exposed to the polishing surface by at least a portion of the plurality of perforations. The article of manufacture may also include a polishing surface having a plurality of grooves, wherein a portion of the plurality of grooves intersect with a portion of the plurality of perforations.
    Type: Application
    Filed: November 2, 2006
    Publication date: March 22, 2007
    Inventors: Liang-Yuh Chen, Yuchun Wang, Yan Wang, Alain Duboust, Daniel Carl, Ralph Wadensweiler, Manoocher Birang, Paul Butterfield, Rashid Mavliev, Stan Tsai
  • Publication number: 20070021037
    Abstract: The polishing pad for a chemical mechanical polishing apparatus, and a method of making the same. The polishing pad has a covering layer with a polishing surface and a backing layer which is adjacent to the platen. A first opening in the covering layer with a first cross-sectional area and a second opening in the backing layer with a second, different cross-sectional area form an aperture through the polishing pad. A substantially transparent polyurethane plug is positioned in the aperture, and an adhesive material fixes the plug in the aperture.
    Type: Application
    Filed: September 15, 2006
    Publication date: January 25, 2007
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Manoocher Birang, Allan Gleason, William Guthrie
  • Publication number: 20070021043
    Abstract: A chemical mechanical polishing apparatus has a movable platen, a drive mechanism and a chucking mechanism. The drive mechanism is attached to the platen, is configured to support a generally linear polishing sheet with a portion of the polishing sheet extending over the platen, and is configured to incrementally advance the polishing sheet in a linear direction relative to the platen. The chucking mechanism is configured to intermittently secure the portion of the polishing sheet to the platen.
    Type: Application
    Filed: September 12, 2006
    Publication date: January 25, 2007
    Applicant: Applied Materials, Inc.
    Inventors: Manoocher Birang, Lawrence Rosenberg, Sasson Somekh, John White
  • Publication number: 20070015441
    Abstract: An apparatus and method of chemical mechanical polishing (CMP) of a wafer employing a device for determining, in-situ, during the CMP process, an endpoint where the process is to be terminated. This device includes a laser interferometer capable of generating a laser beam directed towards the wafer and detecting light reflected from the wafer, and a window disposed adjacent to a hole formed through a platen. The window provides a pathway for the laser beam during at least part of the time the wafer overlies the window.
    Type: Application
    Filed: September 15, 2006
    Publication date: January 18, 2007
    Applicant: Applied Materials, Inc.
    Inventors: Manoocher Birang, Nils Johansson, Allan Gleason
  • Patent number: 7153185
    Abstract: A chemical mechanical polishing apparatus and method can use an eddy current monitoring system and an optical monitoring system. Signals from the monitoring systems can be combined on an output line and extracted by a computer. The eddy current monitoring system or the optical monitoring system can be used to determine the substrate edge. A focusing optic can be used to improve the accuracy of the optical monitoring system in detecting the edge of the substrate.
    Type: Grant
    Filed: August 18, 2004
    Date of Patent: December 26, 2006
    Assignee: Applied Materials, Inc.
    Inventors: Manoocher Birang, Jeffrey Drue David, Boguslaw A. Swedek
  • Publication number: 20060286904
    Abstract: A computer-implemented method for process control in chemical mechanical polishing in which an initial pre-polishing thickness of a substrate is measured at a metrology station, a parameter of an endpoint algorithm is determined from the initial thickness of the substrate, a substrates is polished at a polishing station, and polishing stops when an endpoint criterion is detected using the endpoint algorithm.
    Type: Application
    Filed: August 24, 2006
    Publication date: December 21, 2006
    Applicant: Applied Materials, Inc.
    Inventors: Boguslaw Swedek, Bret Adams, Sanjay Rajaram, David Chan, Manoocher Birang
  • Publication number: 20060266653
    Abstract: A method and apparatus for measuring differential voltages in an electrolyte of an electrochemical plating cell. Current densities are calculated from the measured differential voltages and correlated to thickness values of plated materials. A real time thickness profile may be generated from the thickness values.
    Type: Application
    Filed: May 25, 2005
    Publication date: November 30, 2006
    Inventors: Manoocher Birang, Nicolay Kovarsky, Bernardo Donoso
  • Patent number: 7137879
    Abstract: An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate and a mounting surface. A plurality of perforations may be formed in the polishing article for flow of material therethrough. In another aspect, a polishing article for polishing a substrate includes a body having a polishing surface and a conductive element disposed therein. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. The polishing surface may have one or more pockets formed therein. The conductive element may be disposed in each of the polishing pockets.
    Type: Grant
    Filed: March 30, 2006
    Date of Patent: November 21, 2006
    Assignee: Applied Materials, Inc.
    Inventors: Liang-Yuh Chen, Yuchun Wang, Yan Wang, Alain Duboust, Daniel A. Carl, Ralph Wadensweiler, Manoocher Birang, Paul D. Butterfield, Rashid Mavliev, Stan D. Tsai
  • Publication number: 20060246822
    Abstract: A system includes a measuring station for positioning an eddy current probe proximate to a substrate in a substrate holder. The probe can produce a time-varying magnetic field, in order to induce eddy currents in one or more conductive regions of a substrate either prior to or subsequent to polishing. The eddy current signals are detected, and may be used to update one or more polishing parameters for a chemical mechanical polishing system. The substrate holder may be located in a number places; for example, in a substrate transfer system, a factory interface module, a cleaner, or in a portion of the chemical mechanical polishing system away from the polishing stations. Additional probes may be used.
    Type: Application
    Filed: June 29, 2006
    Publication date: November 2, 2006
    Inventors: Boguslaw Swedek, Nils Johansson, Andreas Wiswesser, Manoocher Birang
  • Publication number: 20060243598
    Abstract: A method and apparatus for plating a metal onto a substrate. One embodiment of the invention provides an apparatus for electrochemically plating a substrate. The apparatus comprises a fluid basin configured to retain a plating solution therein, an anode assembly disposed in the fluid basin, a substrate support member configured to support the substrate and contact the substrate electrically, and an encased auxiliary electrode assembly disposed in the fluid basin. The encased auxiliary electrode assembly generally comprises an auxiliary electrode disposed in a protective tube.
    Type: Application
    Filed: February 24, 2006
    Publication date: November 2, 2006
    Inventors: Saravjeet Singh, Hooman Hafezi, Manoocher Birang, Aron Rosenfeld, Joseph Behnke