Abstract: Capacitor arrays and methods of operating a digital to analog converter are described. In an embodiment, a capacitor array includes a unit capacitor (Cu) structure characterized by a unit capacitance value, a plurality of different super-unit capacitor structures, and a plurality of different sub-unit capacitor structures, each different sub-unit capacitor structure having a different capacitance defined by a division of the unit capacitance value.

Abstract: Capacitor structures with pitch-matched capacitor unit cells are described. In an embodiment, the capacitor unit cells are formed by interdigitated finger electrodes. The finger electrodes may be pitch-matched in multiple metal layers within a capacitor unit cell, and the finger electrodes may be pitch-matched among an array of capacitor unit cells. Additionally, border unit cells may be pitch-matched with the capacitor unit cells.

Abstract: Capacitor structures with pitch-matched capacitor unit cells are described. In an embodiment, the capacitor unit cells are formed by interdigitated finger electrodes. The finger electrodes may be pitch-matched in multiple metal layers within a capacitor unit cell, and the finger electrodes may be pitch-matched among an array of capacitor unit cells. Additionally, border unit cells may be pitch-matched with the capacitor unit cells.

Abstract: In various embodiments, at least one analog-to-digital converter (ADC) channel circuit may be used to convert an analog input signal into an output digital signal. A comparator threshold adjustment circuit may pseudorandomly modify at least one comparator threshold. A postprocessing circuit may identify, based on outputs of the ADC channel circuits, an ADC coefficient and may modify an output digital signal based on the ADC coefficient. As a result, the ADC channel circuits may more accurately convert the analog input signal into an output digital signal, as compared to a system that uses ADC channel circuits but does not include a postprocessing circuit. Further, a similar result may be obtained, as compared to a system that uses a higher gain amplifier, a higher speed amplifier, or both, but does not modify the one or more outputs.

Abstract: A method and apparatus for high-speed clipping and recovery in an amplifier circuit is disclosed. In one embodiment, a circuit includes an amplifier configured to amplify an incoming signal. The amplifier includes inverting and non-inverting inputs, and is configured to provide a differential output. An output limiting circuit is coupled across the differential output, and is configured to limit an amplitude of an output signal provided on the differential output responsive to an input signal exceeding a first amplitude threshold. An input limiting circuit is coupled between the inverting input and the non-inverting input of the amplifier. Responsive to the input signal exceeding a second amplitude threshold (greater than the first), the input limiting circuit is configured to limit the amplitude of the output signal.

Abstract: An apparatus includes a series of analog-to-digital converter (ADC) stages and a comparison circuit coupled to a first ADC stage. The first ADC stage may be configured to compare an input signal to one or more conversion thresholds to generate a result. The first ADC stage may also be configured to generate an output signal based on a value of the result. In response to an assertion of a reset signal, the first ADC stage may be configured to set a level of the output signal voltage to a particular voltage. The comparison circuit may be configured to assert the reset signal in response to a determination that the input signal voltage exceeds an operating range defined by an upper overload threshold voltage and a lower overload threshold voltage.

Abstract: Acoustic touch detection (touch sensing) system architectures and methods can be used to detect an object touching a surface. Position of an object touching a surface can be determined using time-of-flight (TOF) bounding box techniques, or acoustic image reconstruction techniques, for example. Acoustic touch sensing can utilize transducers, such as piezoelectric transducers, to transmit ultrasonic waves along a surface and/or through the thickness of an electronic device. Location of the object can be determined, for example, based on the amount of time elapsing between the transmission of the wave and the detection of the reflected wave. An object in contact with the surface can interact with the transmitted wave causing attenuation, redirection and/or reflection of at least a portion of the transmitted wave. Portions of the transmitted wave energy after interaction with the object can be measured to determine the touch location of the object on the surface of the device.

Abstract: A capacitive device is disclosed, including a first conductor formed on a lower metal layer and coupled to a first terminal. A second conductor is formed on an upper metal layer and a plurality of wires is partitioned into groups, each group including one wire from a respective metal layer. First and second wires of each group are coupled to a second terminal. A third wire of each group, adjacent to the first wire, is coupled to the first conductor. A fourth wire of each group, adjacent to the second wire, is coupled to the second conductor. Fifth wires of a first subset of the groups are coupled to the second conductor and fifth wires of a second subset of the groups are coupled to the first conductor. The fifth wire of each group is adjacent to the first wire and the second wire.

Abstract: In an embodiment, multiple MDAC stages are coupled in parallel to form an MDAC having the desired gain and capacitor size. Each stage may include capacitors and an OTA that are much smaller than the corresponding capacitors and OTA would be for a large single stage. Interconnect for each stage may be shorter than the single stage case, and thus the parasitic resistance and capacitance may be lower. Power consumption may be reduced, and performance of the amplifier may be increased, due to the reduced parasitic resistance and capacitance. The area occupied by the circuitry may be lower as well. Process variation within a given stage may be lower. The process variation between stages may induce noise in the output, but the parallel connection of the stages may serve to reduce the noise, in some embodiments.

Abstract: In an embodiment, multiple MDAC stages are coupled in parallel to form an MDAC having the desired gain and capacitor size. Each stage may include capacitors and an OTA that are much smaller than the corresponding capacitors and OTA would be for a large single stage. Interconnect for each stage may be shorter than the single stage case, and thus the parasitic resistance and capacitance may be lower. Power consumption may be reduced, and performance of the amplifier may be increased, due to the reduced parasitic resistance and capacitance. The area occupied by the circuitry may be lower as well. Process variation within a given stage may be lower. The process variation between stages may induce noise in the output, but the parallel connection of the stages may serve to reduce the noise, in some embodiments.

Abstract: A capacitive device is disclosed, including a first conductor formed on a lower metal layer and coupled to a first terminal. A second conductor is formed on an upper metal layer and a plurality of wires is partitioned into groups, each group including one wire from a respective metal layer. First and second wires of each group are coupled to a second terminal. A third wire of each group, adjacent to the first wire, is coupled to the first conductor. A fourth wire of each group, adjacent to the second wire, is coupled to the second conductor. Fifth wires of a first subset of the groups are coupled to the second conductor and fifth wires of a second subset of the groups are coupled to the first conductor. The fifth wire of each group is adjacent to the first wire and the second wire.

Abstract: A method and apparatus for combined linear, low-noise buffer and sampler for ADC (analog to digital converter) have been disclosed. In one implementation components contributing to sampling errors are included in a feedback path.

Abstract: An integrated circuit metal oxide metal (MOM) variable capacitor includes a first plate; one or more pairs of second plates positioned on both sides of the first plate; one or more pairs of control plates positioned on both sides of the first plate and positioned between the pairs of second plates; and a switch coupled to each control plate and a fixed potential.

Abstract: Systems and methods are disclosed for performing data conversion by matching current sources using a thin oxide device; and minimizing voltage stress on the thin oxide device during operation or power down.

Abstract: Systems and methods are disclosed for performing data conversion by matching current sources using a thin oxide device; and minimizing voltage stress on the thin oxide device during operation or power down.

Abstract: Systems and methods are disclosed for performing data conversion by matching current sources using a thin oxide device; and minimizing voltage stress on the thin oxide device during operation or power down.

Abstract: Systems and methods are disclosed for performing data conversion by matching current sources using a thin oxide device; and minimizing voltage stress on the thin oxide device during operation or power down.

Abstract: Systems and methods are disclosed to reduce pin count in an integrated circuit with digital and analog circuits on-chip by receiving power (VDD) input at a digital power input pad that provides electrostatic discharge (ESD) protection but substantially no current for on-chip analog circuits; filtering noise from the digital power input pad with a filter; and coupling a low noise analog power input pad internal to the integrated circuit to the filter and an analog circuit or a low noise singled ended radio frequency circuit without requiring an external analog power pin.

Abstract: An apparatus for calibrating gain of an radio frequency receiver (“Rx”) is disclosed to provide, among other things, a structure for performing in-situ gain calibration of an RF integrated circuit over time and/or over temperature without removing the RF integrated circuit from its operational configuration, especially when the gain of the RF integrated circuit is susceptible to variations in process, such as inherent with the CMOS process. In one embodiment, an exemplary apparatus includes a thermal noise generator configured to generate thermal noise as a calibrating signal into an input of an Rx path of an RF integrated circuit. The apparatus also includes a calibrator configured to first measure an output signal from an output of the Rx path, and then adjust a gain of the Rx path based on the thermal noise. In one embodiment, the thermal noise generator further includes a termination resistance and/or impedance.

Abstract: An integrated circuit is disclosed to bypass transients between first and second nodes. The circuit includes a first bypass capacitor implemented as a metal oxide semiconductor (MOS) transistor and coupled to a first node; and a switch coupled to the first bypass capacitor and the second node, the switch preventing leakage current from passing through the first bypass capacitor during power down.