Patents by Inventor Marc A. Bergendahl

Marc A. Bergendahl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10937810
    Abstract: Sub-fin removal techniques for SOI like isolation in finFET devices are provided. In one aspect, a method for forming a finFET device includes: etching partial fins in a substrate, wherein the partial fins include top portions of fins of the finFET device; forming a bi-layer spacer on the top portions of the fins; complete etching of the fins in the substrate to form bottom portions of the fins of the finFET device; depositing an insulator between the fins; recessing the insulator enough to expose a region of the fins not covered by the bi-layer spacer; removing the exposed region of the fins to create a gap between the top and bottom portions of the fins; filling the gap with additional insulator. A method for forming a finFET device is also provided where placement of the fin spacer occurs after (rather than before) insulator deposition. A finFET device is also provided.
    Type: Grant
    Filed: August 15, 2019
    Date of Patent: March 2, 2021
    Assignee: International Business Machines Corporation
    Inventors: Marc A. Bergendahl, Kangguo Cheng, Gauri Karve, Fee Li Lie, Eric R. Miller, John R. Sporre, Sean Teehan
  • Patent number: 10923401
    Abstract: Embodiments of the present invention are directed to techniques for providing a gate cut critical dimension (CD) shrink and active gate defect healing using selective deposition. The selective silicon on silicon deposition described herein effectively shrinks the gate cut CD to below lithographic limits and repairs any neighboring active gate damage resulting from a processing window misalignment by refilling the inadvertently removed sacrificial material. In a non-limiting embodiment of the invention, a sacrificial gate is formed over a shallow trench isolation region. A portion of the sacrificial gate is removed to expose a surface of the shallow trench isolation region. A semiconductor material is selectively deposited on exposed sidewalls of the sacrificial gate. A gate cut dielectric is formed on a portion of the shallow trench isolation between sidewalls of the semiconductor material.
    Type: Grant
    Filed: October 26, 2018
    Date of Patent: February 16, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Andrew Greene, Marc Bergendahl, Ekmini A. De Silva, Alex Joseph Varghese, Yann Mignot, Matthew T. Shoudy, Gangadhara Raja Muthinti, Dallas Lea
  • Patent number: 10903111
    Abstract: Semiconductor devices and methods for forming semiconductor devices include opening at least one contact via through a sacrificial material down to contacts. Sides of the at least one contact via are lined by selectively depositing a barrier on the sacrificial material, the barrier extending along sidewalls of the at least one contact via from a top surface of the sacrificial material down to a bottom surface of the sacrificial material proximal to the contacts such that the contacts remain exposed. A conductive material is deposited in the at least one contact via down to the contacts to form stacked contacts having the hard mask on sides thereof. The sacrificial material is removed.
    Type: Grant
    Filed: March 20, 2019
    Date of Patent: January 26, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Alex Joseph Varghese, Marc A. Bergendahl, Andrew M. Greene, Dallas Lea, Matthew T. Shoudy, Yann Mignot, Ekmini A. De Silva, Gangadhara Raja Muthinti
  • Publication number: 20210005749
    Abstract: Embodiments of the invention are directed to a method that includes forming a fin over a major surface of a substrate. The fin includes an active fin region having a top fin surface and a fin sidewall. The top fin surface is substantially parallel with respect to the major surface, and the fin sidewall is substantially perpendicular with respect to the major surface. A gate is formed over and around a central portion of the fin, the gate having a bottom gate region and a top gate region. The bottom gate region is substantially below the top fin surface and includes a bottom gate region sidewall that is substantially parallel with respect to the fin sidewall. The top gate region is substantially above the top fin surface and includes a top gate region sidewall that is at an angle with respect to the major surface.
    Type: Application
    Filed: July 1, 2019
    Publication date: January 7, 2021
    Inventors: Eric Miller, Gauri Karve, Marc A. Bergendahl, Fee Li Lie, Kangguo Cheng, Sean Teehan
  • Patent number: 10833190
    Abstract: Embodiments are directed to methods and resulting structures for a vertical field effect transistor (VFET) having a super long channel. A pair of semiconductor fins is formed on a substrate. A semiconductor pillar is formed between the semiconductor fins on the substrate. A region that extends under all of the semiconductor fins and under part of the semiconductor pillar is doped. A conductive gate is formed over a channel region of the semiconductor fins and the semiconductor pillar. A surface of the semiconductor pillar serves as an extended channel region when the gate is active.
    Type: Grant
    Filed: July 19, 2019
    Date of Patent: November 10, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Marc A. Bergendahl, Kangguo Cheng, Gauri Karve, Fee Li Lie, Eric R. Miller, John R. Sporre, Sean Teehan
  • Publication number: 20200302352
    Abstract: A method includes monitoring with at least one monitoring tool one or more activities associated with an enterprise. The method further includes analyzing data input from the at least one monitoring tool of the one or more activities, and determining, based on analytics performed on the data input and an implemented policy, when the one or more activities qualifies as an incident. A remedial response responsive to the incident is initiated. The monitoring, analyzing, determining and initiating steps are performed by at least one processing device including a processor operatively coupled to a memory.
    Type: Application
    Filed: March 22, 2019
    Publication date: September 24, 2020
    Inventors: Alex Richard Hubbard, Spyridon Skordas, Marc A. Bergendahl, Cody John Murray, Gauri Karve, Lawrence A. Clevenger
  • Publication number: 20200303246
    Abstract: Semiconductor devices and methods for forming semiconductor devices include opening at least one contact via through a sacrificial material down to contacts. Sides of the at least one contact via are lined by selectively depositing a barrier on the sacrificial material, the barrier extending along sidewalls of the at least one contact via from a top surface of the sacrificial material down to a bottom surface of the sacrificial material proximal to the contacts such that the contacts remain exposed. A conductive material is deposited in the at least one contact via down to the contacts to form stacked contacts having the hard mask on sides thereof. The sacrificial material is removed.
    Type: Application
    Filed: March 20, 2019
    Publication date: September 24, 2020
    Inventors: Alex Joseph Varghese, Marc A. Bergendahl, Andrew M. Greene, Dallas Lea, Matthew T. Shoudy, Yann Mignot, Ekmini A. De Silva, Gangadhara Raja Muthinti
  • Patent number: 10770653
    Abstract: A method is presented for reducing dielectric gouging during etching processes of a magnetoresistive random access memory (MRAM) structure including an MRAM region and a non-MRAM region. The method includes forming protective layers in the MRAM region to preserve integrity of underlying dielectric layers, forming a bottom electrode in direct contact with the protective layers, and constructing an MRAM pillar over the bottom electrode, wherein the MRAM pillar includes a magnetic tunnel junction (MTJ) stack and a top electrode.
    Type: Grant
    Filed: July 18, 2019
    Date of Patent: September 8, 2020
    Assignee: International Business Machines Corporation
    Inventors: Christopher J. Penny, Marc A. Bergendahl, Michael Rizzolo, Christopher J. Waskiewicz
  • Publication number: 20200266284
    Abstract: A method and structures are used to fabricate a nanosheet semiconductor device. Nanosheet fins including nanosheet stacks including alternating silicon (Si) layers and silicon germanium (SiGe) layers are formed on a substrate and etched to define a first end and a second end along a first axis between which each nanosheet fin extends parallel to every other nanosheet fin. The SiGe layers are undercut in the nanosheet stacks at the first end and the second end to form divots, and a dielectric is deposited in the divots. The SiGe layers between the Si layers are removed before forming source and drain regions of the nanosheet semiconductor device such that there are gaps between the Si layers of each nanosheet stack, and the dielectric anchors the Si layers. The gaps are filled with an oxide that is removed after removing the dummy gate and prior to forming the replacement gate.
    Type: Application
    Filed: February 21, 2020
    Publication date: August 20, 2020
    Applicant: Tessera, Inc.
    Inventors: Marc A. Bergendahl, Kangguo Cheng, Fee Li Lie, Eric R. Miller, John R. Sporre, Sean Teehan
  • Publication number: 20200235094
    Abstract: A method of forming a semiconductor device that includes forming a trench adjacent to a gate structure to expose a contact surface of one of a source region and a drain region. A sacrificial spacer may be formed on a sidewall of the trench and on a sidewall of the gate structure. A metal contact may then be formed in the trench to at least one of the source region and the drain region. The metal contact has a base width that is less than an upper surface width of the metal contact. The sacrificial spacer may be removed, and a substantially conformal dielectric material layer can be formed on sidewalls of the metal contact and the gate structure. Portions of the conformally dielectric material layer contact one another at a pinch off region to form an air gap between the metal contact and the gate structure.
    Type: Application
    Filed: March 30, 2020
    Publication date: July 23, 2020
    Applicant: TESSERA, INC.
    Inventors: Marc A. Bergendahl, Kangguo Cheng, Fee Li Lie, Eric R. Miller, John R. Sporre, Sean Teehan
  • Patent number: 10692776
    Abstract: A semiconductor device includes etching fins into a bulk substrate in an active region, the bulk substrate including an intermediate layer formed over a base layer and a first semiconductor layer formed over the intermediate layer such that the fins extend through the first semiconductor layer into the intermediate layer to form tapered bottom portions of the fins within the intermediate layer and vertical fin sidewalls of a semiconductor portions of the fins within the first semiconductor layer. A second semiconductor layer is formed around the tapered bottom portions below the semiconductor portions of the fins such that the second semiconductor layer covers the tapered bottom portions to form a top surface proximal to the semiconductor portions of the fins that is substantially parallel to a bottom surface of the top surface of the base layer. A gate structure is formed around the fins.
    Type: Grant
    Filed: November 6, 2018
    Date of Patent: June 23, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Eric R. Miller, Marc Bergendahl, Kangguo Cheng, Yann Mignot
  • Patent number: 10665589
    Abstract: A method of forming a power rail to semiconductor devices comprising removing a portion of the gate structure forming a gate cut trench separating a first active region of fin structures from a second active region of fin structures. A conformal etch stop layer is formed in the gate cut trench. A fill material is formed on the conformal etch stop layer filling at least a portion of the gate cut trench. The fill material has a composition that is etched selectively to the conformal etch stop layer. A power rail is formed in the gate cut trench. The conformal etch stop layer obstructs lateral etching during forming the power rail to substantially eliminate power rail to gate structure shorting.
    Type: Grant
    Filed: August 3, 2018
    Date of Patent: May 26, 2020
    Assignee: Tessera, Inc.
    Inventors: Marc A. Bergendahl, Andrew M. Greene, Rajasekhar Venigalla
  • Publication number: 20200152628
    Abstract: A method of forming a power rail to semiconductor devices comprising removing a portion of the gate structure forming a gate cut trench separating a first active region of fin structures from a second active region of fin structures. A conformal etch stop layer is formed in the gate cut trench. A fill material is formed on the conformal etch stop layer filling at least a portion of the gate cut trench. The fill material has a composition that is etched selectively to the conformal etch stop layer. A power rail is formed in the gate cut trench. The conformal etch stop layer obstructs lateral etching during forming the power rail to substantially eliminate power rail to gate structure shorting.
    Type: Application
    Filed: January 9, 2020
    Publication date: May 14, 2020
    Inventors: Marc A. Bergendahl, Andrew M. Greene, Rajasekhar Venigalla
  • Publication number: 20200144131
    Abstract: A semiconductor device includes etching fins into a bulk substrate in an active region, the bulk substrate including an intermediate layer formed over a base layer and a first semiconductor layer formed over the intermediate layer such that the fins extend through the first semiconductor layer into the intermediate layer to form tapered bottom portions of the fins within the intermediate layer and vertical fin sidewalls of a semiconductor portions of the fins within the first semiconductor layer. A second semiconductor layer is formed around the tapered bottom portions below the semiconductor portions of the fins such that the second semiconductor layer covers the tapered bottom portions to form a top surface proximal to the semiconductor portions of the fins that is substantially parallel to a bottom surface of the top surface of the base layer. A gate structure is formed around the fins.
    Type: Application
    Filed: November 6, 2018
    Publication date: May 7, 2020
    Inventors: Eric R. Miller, Marc Bergendahl, Kangguo Cheng, Yann Mignot
  • Publication number: 20200135575
    Abstract: Embodiments of the present invention are directed to techniques for providing a gate cut critical dimension (CD) shrink and active gate defect healing using selective deposition. The selective silicon on silicon deposition described herein effectively shrinks the gate cut CD to below lithographic limits and repairs any neighboring active gate damage resulting from a processing window misalignment by refilling the inadvertently removed sacrificial material. In a non-limiting embodiment of the invention, a sacrificial gate is formed over a shallow trench isolation region. A portion of the sacrificial gate is removed to expose a surface of the shallow trench isolation region. A semiconductor material is selectively deposited on exposed sidewalls of the sacrificial gate. A gate cut dielectric is formed on a portion of the shallow trench isolation between sidewalls of the semiconductor material.
    Type: Application
    Filed: October 26, 2018
    Publication date: April 30, 2020
    Inventors: Andrew Greene, Marc Bergendahl, Ekmini A. De Silva, Alex Joseph Varghese, Yann MIGNOT, Matthew T. Shoudy, GANGADHARA RAJA MUTHINTI, DALLAS LEA
  • Publication number: 20200130983
    Abstract: Systems, computer-implemented methods, and computer program products that can facilitate elevator analytics and/or elevator optimization components are provided. According to an embodiment, a system can comprise a memory that stores computer executable components and a processor that executes the computer executable components stored in the memory. The computer executable components can comprise a prediction component that can predict a current destination of an elevator passenger based on historical elevator usage data of the elevator passenger. The computer executable components can further comprise an assignment component that can assign the elevator passenger to an elevator based on the current destination.
    Type: Application
    Filed: October 29, 2018
    Publication date: April 30, 2020
    Inventors: Gauri Karve, Tara Astigarraga, Eric Miller, Kangguo Cheng, Fee Li Lie, Sean Teehan, Marc Bergendahl
  • Patent number: 10615269
    Abstract: A method and structures are used to fabricate a nanosheet semiconductor device. Nanosheet fins including nanosheet stacks including alternating silicon (Si) layers and silicon germanium (SiGe) layers are formed on a substrate and etched to define a first end and a second end along a first axis between which each nanosheet fin extends parallel to every other nanosheet fin. The SiGe layers are undercut in the nanosheet stacks at the first end and the second end to form divots, and a dielectric is deposited in the divots. The SiGe layers between the Si layers are removed before forming source and drain regions of the nanosheet semiconductor device such that there are gaps between the Si layers of each nanosheet stack, and the dielectric anchors the Si layers. The gaps are filled with an oxide that is removed after removing the dummy gate and prior to forming the replacement gate.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: April 7, 2020
    Assignee: Terresa, Inc.
    Inventors: Marc A. Bergendahl, Kangguo Cheng, Fee Li Lie, Eric R. Miller, John R. Sporre, Sean Teehan
  • Patent number: 10607991
    Abstract: A method of forming a semiconductor device that includes forming a trench adjacent to a gate structure to expose a contact surface of one of a source region and a drain region. A sacrificial spacer may be formed on a sidewall of the trench and on a sidewall of the gate structure. A metal contact may then be formed in the trench to at least one of the source region and the drain region. The metal contact has a base width that is less than an upper surface width of the metal contact. The sacrificial spacer may be removed, and a substantially conformal dielectric material layer can be formed on sidewalls of the metal contact and the gate structure. Portions of the conformally dielectric material layer contact one another at a pinch off region to form an air gap between the metal contact and the gate structure.
    Type: Grant
    Filed: June 7, 2018
    Date of Patent: March 31, 2020
    Assignee: Tessera, Inc.
    Inventors: Marc A. Bergendahl, Kangguo Cheng, Fee Li Lie, Eric R. Miller, John R. Sporre, Sean Teehan
  • Publication number: 20200090998
    Abstract: According to embodiments of the present invention, a method of forming a self-aligned contact includes depositing an etch-stop liner on a surface of a gate cap and a contact region. A dielectric oxide layer is deposited onto the etch-stop layer. The dielectric oxide layer and the etch-stop liner are removed in a region above the contact region to form a removed region. A contact is deposited in the etched region.
    Type: Application
    Filed: November 20, 2019
    Publication date: March 19, 2020
    Inventors: Michael P. Belyansky, Marc Bergendahl, Victor W. C. Chan, JEFFREY C. SHEARER
  • Publication number: 20200081746
    Abstract: An example operation may include one or more of connecting, by a load leveler, to a blockchain network comprising a plurality of nodes and configured to store a common work item, computing, by the load leveler, loads across the plurality of the nodes that need to execute the common work item upon completion of current tasks, determining, by the load leveler, a network load impact based on execution of a common blockchain consensus checking process on the network nodes, executing, by the load leveler, a work assessment process based on the loads computed across the plurality of the nodes and on the determined network load impact of the blockchain network, and assigning, by the load leveler, new tasks to the nodes based on results of the execution of the work assessment process.
    Type: Application
    Filed: September 7, 2018
    Publication date: March 12, 2020
    Inventors: Jonathan Fry, Christopher J. Penny, Marc Bergendahl, Christopher J. Waskiewicz, Jean Wynne, James Demarest