Patents by Inventor Marc B. Cartier, Jr.

Marc B. Cartier, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210336363
    Abstract: A broadside coupled connector assembly has two sets of conductors, each separate planes. By providing the same path lengths, there is no skew between the conductors of the differential pair and the impedance of those conductors is identical. The conductor sets are formed by embedding the first set of conductors in an insulated housing having a top surface with channels. The second set of conductors is placed within the channels so that no air gaps form between the two sets of conductors. A second insulated housing is filled over the second set of conductors and into the channels to form a completed wafer. The ends of the conductors are received in a blade housing. Differential and ground pairs of blades have one end that extends through the bottom of the housing having a small footprint. An opposite end of the pairs of blades diverge to connect with the wafers.
    Type: Application
    Filed: February 17, 2021
    Publication date: October 28, 2021
    Inventors: Thomas S. Cohen, Huilin Ren, Marc B. Cartier, JR., Trent K. Do, Mark W. Gailus
  • Publication number: 20210315102
    Abstract: A printed circuit board includes a plurality of layers including conductive layers separated by dielectric layers; and at least one via configured for solder attachment to a connector lead of a surface mount connector, the at least one via including a conductive element that extends from an upper surface of the printed circuit board through one or more of the plurality of layers, the conductive element having a recess in a surface thereof. The recess is configured to receive a tip portion of the connector lead of the surface mount connector. The printed circuit board may have via patterns including signal vias and ground vias.
    Type: Application
    Filed: June 15, 2021
    Publication date: October 7, 2021
    Applicant: Amphenol Corporation
    Inventors: Marc B. Cartier, JR., Mark W. Gailus, Tom Pitten, Donald A. Girard, JR., Huilin Ren
  • Patent number: 11108180
    Abstract: Electrical connectors including superelastic components. The high elastic limit of superelastic materials compared to conventional connector materials may allow for designs which provide reliable connections and high frequency operation. Superelastic components also may enable connector designs with higher densities of connections. A connector can include one or more superelastic elongated members forming the mating contacts of the connector. The superelastic elongated members may deform within one or more conductive receptacles to generate a suitable contact force. The conductive receptacles may include a plurality of protrusions arranged to deflect the superelastic elongated members during mating. A superelastic component may also be provided in a receiving portion of a connector, and may form a portion of a conductive receptacle.
    Type: Grant
    Filed: July 20, 2020
    Date of Patent: August 31, 2021
    Assignee: Amphenol Corporation
    Inventors: Donald A. Girard, Tom Pitten, Mark W. Gailus, Marc B. Cartier, Jr., David Levine
  • Publication number: 20210257788
    Abstract: An electrical interconnect for passing high speed signals through an electronic system with a high density of signals and high signal integrity. The interconnect includes an electrical connector and a transition portion of a printed circuit board to which the connector is mounted. Signal conductors are connected to pads on the surface of the PCB using edge-to-pad mounting. The pads align with intermediate portions of the signal conductors such that transitions within the connector that could degrade signal integrity are avoided. The signal conductors may be positioned as individually shielded broadside coupled pairs extending in rows within the connector. Surface traces on the PCB connect the pads to signal vias aligned for vertical routing out of the connector footprint. Ground planes underlying the surface traces facilitate a transition from the signal paths in the connector to those in the PCB with low mode conversion avoiding resonances in the connector shields.
    Type: Application
    Filed: January 27, 2021
    Publication date: August 19, 2021
    Applicant: Amphenol Corporation
    Inventors: Marc B. Cartier, JR., John Robert Dunham, Mark W. Gailus, David Levine, Allan Astbury, Vysakh Sivarajan, Daniel B. Provencher, Eric Leo
  • Publication number: 20210234290
    Abstract: An electrical interconnect for passing high speed signals through an electronic system with a high density of signals and high signal integrity. The interconnect includes an electrical connector and a transition portion of a printed circuit board to which the connector is mounted. Signal conductors are connected to pads on the surface of the PCB using edge-to-pad mounting. The pads align with intermediate portions of the signal conductors such that transitions within the connector that could degrade signal integrity are avoided. The signal conductors may be positioned as individually shielded broadside coupled pairs extending in rows within the connector. Surface traces on the PCB connect the pads to signal vias aligned for vertical routing out of the connector footprint. Ground planes underlying the surface traces facilitate a transition from the signal paths in the connector to those in the PCB with low mode conversion avoiding resonances in the connector shields.
    Type: Application
    Filed: January 27, 2021
    Publication date: July 29, 2021
    Applicant: Amphenol Corporation
    Inventors: John Robert Dunham, Marc B. Cartier, JR., Mark W. Gailus, David Levine, Allan Astbury, Vysakh Sivarajan, Daniel B. Provencher, Eric Leo
  • Patent number: 11070006
    Abstract: A modular electrical connector facilitates low loss connections to components on a printed circuit board. A portion is of the connector is formed of one or more first type units with conductive elements designed to be attached to a printed circuit board. Signals passing through those units may be routed to components on the printed circuit board through traces in the board. One or more second type units may be integrated with the connector. Those units may be designed for attachment to a cable, which may provide signal paths to a location on the printed circuit board near relatively distant components.
    Type: Grant
    Filed: August 3, 2018
    Date of Patent: July 20, 2021
    Assignee: Amphenol Corporation
    Inventors: Mark W. Gailus, Allan Astbury, David Manter, Marc B. Cartier, Jr., Vysakh Sivarajan, John Robert Dunham
  • Publication number: 20210218198
    Abstract: An electrical connector module with openings in an insulative support selectively positioned to limit dielectric loss in a signal. The connector may include a first and second conductor including first and second sides between first and second edges. An insulative support holds the first conductor adjacent the second conductor and may have at least five pedestal portions, wherein the first pedestal portion contacts the first side of the first conductor, the second pedestal portion contacts the second side of the first conductor, the third pedestal portion contacts the first side of the second conductor, the fourth pedestal portion contacts the second side of the second conductor, and at least a portion of the fifth pedestal portion is disposed between two edges of the first and second conductors. The pedestal portions may have widths less than the widths of the first and second sides of the first and second conductors.
    Type: Application
    Filed: March 29, 2021
    Publication date: July 15, 2021
    Applicant: Amphenol Corporation
    Inventors: Marc B. Cartier, JR., John Robert Dunham, Vysakh Sivarajan, Mark W. Gailus, David Levine, Michael Joseph Snyder
  • Patent number: 11057995
    Abstract: A printed circuit board includes a plurality of layers including conductive layers separated by dielectric layers; and at least one via configured for solder attachment to a connector lead of a surface mount connector, the at least one via including a conductive element that extends from an upper surface of the printed circuit board through one or more of the plurality of layers, the conductive element having a recess in a surface thereof. The recess is configured to receive a tip portion of the connector lead of the surface mount connector. The printed circuit board may have via patterns including signal vias and ground vias.
    Type: Grant
    Filed: June 10, 2019
    Date of Patent: July 6, 2021
    Assignee: Amphenol Corporation
    Inventors: Marc B. Cartier, Jr., Mark W. Gailus, Tom Pitten, Donald A. Girard, Jr., Huilin Ren
  • Publication number: 20210194182
    Abstract: A cable termination that provides low signal distortion even at high frequencies. Conductive elements of the cable are fused to edges of signal conductors in a cable connector or other component terminating the cable. For terminating a differential pair, the conductive elements of the cable may be terminated to opposing edges of a pair of signal conductors in the cable termination. The conductive elements may be shaped such that the spacing between signal paths passing through the conductive elements of the cable and into the signal conductors of the cable termination is uniform.
    Type: Application
    Filed: March 8, 2021
    Publication date: June 24, 2021
    Applicant: Amphenol Corporation
    Inventors: Mark W. Gailus, Allan Astbury, David Manter, Marc B. Cartier, JR., Vysakh Sivarajan, John Robert Dunham
  • Publication number: 20210175670
    Abstract: A modular electrical connector with separately shielded signal conductor pairs. The connector may be assembled from modules, each containing a pair of signal conductors with surrounding partially or fully conductive material. Modules of different sizes may be assembled into wafers, which are then assembled into a connector. Wafers may include lossy material. In some embodiments, shielding members of two mating connectors may each have compliant members along their distal portions, such that, the shielding members engage at points of contact at multiple locations, some of which are adjacent the mating edge of each of the mating shielding members.
    Type: Application
    Filed: November 23, 2020
    Publication date: June 10, 2021
    Applicant: Amphenol Corporation
    Inventors: Marc B. Cartier, JR., John Robert Dunham, Mark W. Gailus, Donald A. Girard, JR., David Manter, Tom Pitten, Vysakh Sivarajan, Michael Joseph Snyder
  • Publication number: 20210119371
    Abstract: A modular electrical connector with modular components suitable for assembly into a right angle connector may also be used in forming an orthogonal connector or connector in other desired configurations. The connector modules may be configured through the user of extender modules. Those connector modules may be held together as a right angle connector with a front housing portion, which, in some embodiments, may be shaped differently depending on whether the connector modules are used to form a right angle connector or an orthogonal connector. When designed to form an orthogonal connector, the extender modules may interlock into subarrays, which may be held to other connector components through the use of an extender shell. The mating contact portions on the extender modules may be such that a right angle connector, similarly made with connector modules, may directly mate with the orthogonal connector.
    Type: Application
    Filed: December 28, 2020
    Publication date: April 22, 2021
    Applicant: Amphenol Corporation
    Inventors: Allan Astbury, John Robert Dunham, Marc B. Cartier, JR., Mark W. Gailus, Daniel B. Provencher
  • Patent number: 10965065
    Abstract: An electrical connector module with openings in an insulative support selectively positioned to limit dielectric loss in a signal. The connector may include a first and second conductor including first and second sides between first and second edges. An insulative support holds the first conductor adjacent the second conductor and may have at least five pedestal portions, wherein the first pedestal portion contacts the first side of the first conductor, the second pedestal portion contacts the second side of the first conductor, the third pedestal portion contacts the first side of the second conductor, the fourth pedestal portion contacts the second side of the second conductor, and at least a portion of the fifth pedestal portion is disposed between two edges of the first and second conductors. The pedestal portions may have widths less than the widths of the first and second sides of the first and second conductors.
    Type: Grant
    Filed: March 2, 2020
    Date of Patent: March 30, 2021
    Assignee: Amphenol Corporation
    Inventors: Marc B. Cartier, Jr., John Robert Dunham, Vysakh Sivarajan, Mark W. Gailus, David Levine, Michael Joseph Snyder
  • Publication number: 20210091496
    Abstract: Connector assemblies for making connections to a subassembly, such as a processor card, may include signal contact tips formed of a material different than that of an associated cable conductor. The signal contact tips may be formed of a super elastic material, such as nickel titanium. The connector assembly may include ground contact tips that similarly make a pressure contact to the electrical component may be electrically connected to a shield of the cable shield Housing modules that interlock or interface with a support member may be employed to manufacture connectors with any desired quantity of signal and ground contact tips in any suitable number of columns and rows. Each module may terminate a cable and provide pressure mount connections between signal conductors and the shield of the cable and conductive pads on the subassembly, and conductive or lossy grounded structures around the conductive elements carrying signals through the module.
    Type: Application
    Filed: September 17, 2020
    Publication date: March 25, 2021
    Applicant: Amphenol Corporation
    Inventors: Marc B. Cartier, JR., Donald A. Girard, JR., Eric Leo
  • Patent number: 10958007
    Abstract: A broadside coupled connector assembly has two sets of conductors, each separate planes. By providing the same path lengths, there is no skew between the conductors of the differential pair and the impedance of those conductors is identical. The conductor sets are formed by embedding the first set of conductors in an insulated housing having a top surface with channels. The second set of conductors is placed within the channels so that no air gaps form between the two sets of conductors. A second insulated housing is filled over the second set of conductors and into the channels to form a completed wafer. The ends of the conductors are received in a blade housing. Differential and ground pairs of blades have one end that extends through the bottom of the housing having a small footprint. An opposite end of the pairs of blades diverge to connect with the wafers.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: March 23, 2021
    Assignee: Amphenol Corporation
    Inventors: Thomas S. Cohen, Huilin Ren, Marc B. Cartier, Jr., Trent K. Do, Mark W. Gailus
  • Publication number: 20210083434
    Abstract: A modular electrical connector with separately shielded signal conductor pairs. In some embodiments, the connector is may be assembled from modules, each containing a pair of signal conductors with surrounding partially or fully conductive material. In some embodiments, the modules may have projecting portions, of conductive and/or dielectric material, that are shaped and positioned to reduce changes in impedance along the signal paths as a function of separation of conductive elements, when the connectors are separated by less than the functional mating range.
    Type: Application
    Filed: November 30, 2020
    Publication date: March 18, 2021
    Applicant: Amphenol Corporation
    Inventors: Mark W. Gailus, John Robert Dunham, Marc B. Cartier, JR., Donald A. Girard, JR.
  • Publication number: 20210076486
    Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns including first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; ground vias extending through at least the attachment layers, the ground vias including ground conductors; and shadow vias located adjacent to each of the first and second signal vias, wherein the shadow vias are free of conductive material in the attachment layers. The printed circuit board may further include slot vias extending through the attachment layers and located between via patterns.
    Type: Application
    Filed: October 28, 2020
    Publication date: March 11, 2021
    Applicant: Amphenol Corporation
    Inventors: Mark W. Gailus, Marc B. Cartier, JR., Vysakh Sivarajan, David Levine
  • Patent number: 10944214
    Abstract: A cable termination that provides low signal distortion even at high frequencies. Conductive elements of the cable are fused to edges of signal conductors in a cable connector or other component terminating the cable. For terminating a differential pair, the conductive elements of the cable may be terminated to opposing edges of a pair of signal conductors in the cable termination. The conductive elements may be shaped such that the spacing between signal paths passing through the conductive elements of the cable and into the signal conductors of the cable termination is uniform.
    Type: Grant
    Filed: August 3, 2018
    Date of Patent: March 9, 2021
    Assignee: Amphenol Corporation
    Inventors: Mark W. Gailus, Allan Astbury, David Manter, Marc B. Cartier, Jr., Vysakh Sivarajan, John Robert Dunham
  • Patent number: 10879643
    Abstract: A modular electrical connector with modular components suitable for assembly into a right angle connector may also be used in forming an orthogonal connector or connector in other desired configurations. The connector modules may be configured through the user of extender modules. Those connector modules may be held together as a right angle connector with a front housing portion, which, in some embodiments, may be shaped differently depending on whether the connector modules are used to form a right angle connector or an orthogonal connector. When designed to form an orthogonal connector, the extender modules may interlock into subarrays, which may be held to other connector components through the use of an extender shell. The mating contact portions on the extender modules may be such that a right angle connector, similarly made with connector modules, may directly mate with the orthogonal connector.
    Type: Grant
    Filed: November 26, 2018
    Date of Patent: December 29, 2020
    Assignee: Amphenol Corporation
    Inventors: Allan Astbury, John Robert Dunham, Marc B. Cartier, Jr., Mark W. Gailus, Daniel B. Provencher
  • Patent number: 10855034
    Abstract: A modular electrical connector with separately shielded signal conductor pairs. In some embodiments, the connector is may be assembled from modules, each containing a pair of signal conductors with surrounding partially or fully conductive material. In some embodiments, the modules may have projecting portions, of conductive and/or dielectric material, that are shaped and positioned to reduce changes in impedance along the signal paths as a function of separation of conductive elements, when the connectors are separated by less than the functional mating range.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: December 1, 2020
    Assignee: Amphenol Corporation
    Inventors: Mark W. Gailus, John Robert Dunham, Marc B. Cartier, Jr., Donald A. Girard, Jr.
  • Patent number: D908633
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: January 26, 2021
    Assignee: Amphenol Corporation
    Inventors: Marc B. Cartier, Jr., Mark W. Gailus, David Levine, Vysakh Sivarajan, John Robert Dunham, John Pitten