Abstract: An optical fiber link card communication module, and process for fabricating the module, where the module provides a parallel electrical interface to the user, facilitates high speed serial transmission of data over an optical data link, and contains a plurality of converters for performing conversions between both electrical and optical signals. A preferred embodiment of the invention contemplates fabricating the optical communication module on a single multilayer card with all the transmitter electrical components being located on one side of the card, all receiver electrical components being located on the other side of the card, and the transmitter and receiver components being separated by shielding layers in the card. By using two transmitter/receiver pairs (with the transmitters and receivers being located on respective sides of the card) an embodiment of the invention provides for double full duplex communications.

Abstract: An optical fiber link card communication module, and process for fabricating the module, where the module provides a parallel electrical interface to the user, facilitates high speed serial transmission of data over an optical data link, and contains a plurality of converters for performing conversions between both electrical and optical signals. The module further includes edge mounted optical components having leads mounted on the surface of a card (as opposed to standard pin-in-hole type leads) to minimize lead capacitance and inductance from the optical components to the card electronics, on board card control means for the converters and safety shut down means on the same card as the electrical and optical components.