Abstract: Embodiments of the invention provide a system and method for chip to chip communications in electronic circuits. A router or switch receives data packets at input port ASICs. A routing table on the input port ASIC or on a routing ASIC is used to identify a destination port ASIC based upon header information in the data packet. The data packet is transmitted from the input port ASIC to the destination port ASIC using millimeter wave signals that are transmitted across a waveguide or a wireless interface.

Abstract: In some developing interconnect technologies, such as chip-to-chip optical interconnect or metal waveguide interconnects, misalignment can be a serious issue. Here, however, a interconnect that uses an on-chip directional antenna (which operates in the sub-millimeter range) to form a radio frequency (RF) interconnect through a dielectric waveguide is provided. This system allows for misalignment while providing the increased communication bandwidth.

Abstract: An apparatus is provided. There is a circuit assembly with a package substrate and an integrated circuit (IC). The package substrate has a microstrip line, and the IC is secured to the package substrate and is electrically coupled to the microstrip line. A circuit board is also secured to the package substrate. A dielectric waveguide is secured to the circuit board. The dielectric waveguide has a dielectric core that extends into a transition region located between the dielectric waveguide and the microstrip line, and the microstrip line is configured to form a communication link with the dielectric waveguide.

Abstract: An apparatus is provided. There is a circuit assembly with a package substrate and an integrated circuit (IC). The package substrate has a microstrip line, and the IC is secured to the package substrate and is electrically coupled to the microstrip line. A circuit board is also secured to the package substrate. A dielectric waveguide is secured to the circuit board. The dielectric waveguide has a dielectric core that extends into a transition region located between the dielectric waveguide and the microstrip line, and the microstrip line is configured to form a communication link with the dielectric waveguide.

Abstract: A sensor power management arrangement includes a signal processing circuit configured to receive signal from a sensor, to test the signal against at least one criterion, and to pass the signal for further processing in response to the signal passing the at least one criterion. In this way, only signals that are of a sufficient importance or significance will consume the maximum amount of processing energy and through processing by later processes or circuitry. Should a signal from a sensor not be strong enough or meet other criteria, power will not be wasted in preparing that signal for provision to the microcontroller or microprocessor. Additional flexibility in the sensor power management can be realized by adjusting the criteria against which the sensor signal is compared based on a status of the sensor apparatus.

Abstract: A sensor power management arrangement includes a signal processing circuit configured to receive signal from a sensor, to test the signal against at least one criterion, and to pass the signal for further processing in response to the signal passing the at least one criterion. In this way, only signals that are of a sufficient importance or significance will consume the maximum amount of processing energy and through processing by later processes or circuitry. Should a signal from a sensor not be strong enough or meet other criteria, power will not be wasted in preparing that signal for provision to the microcontroller or microprocessor. Additional flexibility in the sensor power management can be realized by adjusting the criteria against which the sensor signal is compared based on a status of the sensor apparatus.

Abstract: Accelerometers have a number of wide-ranging uses, and it is desirable to both increase their accuracy while decreasing size. Here, millimeter or sub-millimeter wavelength accelerometers are provided which has the advantage of having the high accuracy of an optical accelerometer, while being compact. Additionally, because millimeter or sub-millimeter wavelength signals are employed, cumbersome and awkward on-chip optical devices and bulky optical mediums can be avoided.

Abstract: In some developing interconnect technologies, such as chip-to-chip optical interconnect or metal waveguide interconnects, misalignment can be a serious issue. Here, however, a interconnect that uses an on-chip directional antenna (which operates in the sub-millimeter range) to form a radio frequency (RF) interconnect through a dielectric waveguide is provided. This system allows for misalignment while providing the increased communication bandwidth.

Abstract: In some developing interconnect technologies, such as chip-to-chip optical interconnect or metal waveguide interconnects, misalignment can be a serious issue. Here, however, a interconnect that uses an on-chip directional antenna (which operates in the sub-millimeter range) to form a radio frequency (RF) interconnect through a dielectric waveguide is provided. This system allows for misalignment while providing the increased communication bandwidth.

Abstract: In some developing interconnect technologies, such as chip-to-chip optical interconnect or metal waveguide interconnects, misalignment can be a serious issue. Here, however, a interconnect that uses an on-chip directional antenna (which operates in the sub-millimeter range) to form a radio frequency (RF) interconnect through a dielectric waveguide is provided. This system allows for misalignment while providing the increased communication bandwidth.

Abstract: To date, bandwidth mismatch within time-interleaved (TI) analog-to-digital converters (ADCs) has been largely ignored because compensation for bandwidth mismatch is performed by digital post-processing, namely finite impulse response filters. However, the lag from digital post-processing is prohibitive in high speed systems, indicating a need for blind mismatch compensation. Even with blind bandwidth mismatch estimation, though, adjustment of the filter characteristics of track-and-hold (T/H) circuits within the TI ADCs can be difficult. Here, a T/H circuit architecture is provided that uses variations of the gate voltage of a sampling switch (which varies the “on” resistance of the sampling switch) to change the bandwidth of the T/H circuits so as to precisely match the bandwidths.

Abstract: Traditionally, pipelined continuous-time (CT) sigma-delta modulators (SDM) have been difficult to build due at least in part to the difficulties in calibrating the pipeline. Here, however, a pipelined CT SDM is provided that has an architecture that is conducing to being calibrated. Namely, the system includes a digital filter and other features that can be adjusted to account for input imbalance errors and well as quantization leakage noise.

Abstract: A track-and-hold circuit is provided. This track-and-hold circuit is adapted to track an analog input signal and hold a sampled voltage of the analog input signal at a sampling instant for processing by other circuitry, in response to a track signal that alternates with a hold signal. Preferably, the track-and-hold circuit includes a bi-directional current source that sources and sinks current through a first output node and a second output node, a unity gain amplifier that is coupled to first and second output nodes of the bi-directional current source and that receives the analog input signal, a resistor coupled to an output of the unity gain amplifier, and a capacitor coupled between the resistor and ground. Of interest, however, is the bi-directional current source, which includes a differential input circuit that is adapted to receive the track signal and the hold signal and that is coupled to the first and second output nodes and an RC network that is coupled to the differential input circuit.

Abstract: A method for calibrating a reflection compensator is provided. A delay is initially set to a predetermined minimum, and an input pulse is transmitted across a transmission line. A compensation current is then applied after the delay. The reflection from the transmission line is digitized to generate a measurement, and a determination is made as to whether the compensation current substantially compensates for the reflection. If the compensation current does not substantially compensate for the reflection, then the delay is adjusted, and the process is repeated until the compensation current substantially compensates for the reflection.

Abstract: For high speed amplifiers, the parasitic capacitances from the differential input pair introduce a zero that can affect performance. Here, a neutralization network has been provided that compensates for this zero by shifting its position. This is generally accomplished by using a pair of capacitors that are cross-coupled across the differential input pair of the amplifier.

Abstract: A method for controlling a light emitting diode (LED) is provided. Initially, the LED, which had been active, is deactivated, and a voltage for a current that corresponds to the persistence of the LED is generated. The voltage is then integrated so as to generate an integrated voltage, and the integrated voltage is compared to a threshold. When the integrated voltage is less than the threshold, the LED is then activated.

Abstract: A tunable depletion diode is provided. Within this depletion diode, there is a depletion mode transistor that is coupled to the anode terminal at its gate and the cathode terminal at its drain. A diode is coupled between the source of the depletion mode transistor and the anode terminal, and a variable capacitor is coupled between the source of the depletion mode transistor and the anode terminal, where the capacitance of the variable capacitor is controls the reverse recovery time of the tunable depletion diode.

Abstract: An apparatus is provided. There is a circuit assembly with a package substrate and an integrated circuit (IC). The package substrate has a microstrip line, and the IC is secured to the package substrate and is electrically coupled to the microstrip line. A circuit board is also secured to the package substrate. A dielectric waveguide is secured to the circuit board. The dielectric waveguide has a dielectric core that extends into a transition region located between the dielectric waveguide and the microstrip line, and the microstrip line is configured to form a communication link with the dielectric waveguide.

Abstract: An apparatus is provided. There is a circuit assembly with a package substrate and an integrated circuit (IC). The package substrate has a microstrip line, and the IC is secured to the package substrate and is electrically coupled to the microstrip line. A circuit board is also secured to the package substrate. A dielectric waveguide is secured to the circuit board. The dielectric waveguide has a dielectric core that extends into a transition region located between the dielectric waveguide and the microstrip line, and the microstrip line is configured to form a communication link with the dielectric waveguide.

Abstract: An apparatus is provided. There is a circuit assembly with a package substrate and an integrated circuit (IC). The package substrate has a microstrip line, and the IC is secured to the package substrate and is electrically coupled to the microstrip line. A circuit board is also secured to the package substrate. A dielectric waveguide is secured to the circuit board. The dielectric waveguide has a dielectric core that extends into a transition region located between the dielectric waveguide and the microstrip line, and the microstrip line is configured to form a communication link with the dielectric waveguide.