Abstract: The present disclosure describes techniques for altering the epoxy wettability of a surface of a MEMS device. Particularly applicable to flip-chip bonding arrangements in which a top surface of a MEMS device is adhered to a package substrate. A barrier region is provided on a top surface of the MEMs device, laterally outside a region which forms, or overlies, the backplate and/or the cavity in the transducer substrate. The barrier region comprises a plurality of discontinuities, e.g. dimples, which inhibit the flow of epoxy.

Abstract: Micro-electro-mechanical system (MEMS) devices are disclosed, including a MEMS device comprising a semiconductor die including integrated circuitry, a structure mounted on the semiconductor die and covering at least a portion of the circuitry, the structure defining a space between the structure and the at least a portion of the circuitry, and a transducer including a membrane, the transducer located outside of the space.

Abstract: MEMS devices comprise a filter configured and arranged to inhibit the entry of particles into at least a region of the interior of the substrate cavity from a region underlying the substrate.

Abstract: The present disclosure describes techniques for altering the epoxy wettability of a surface of a MEMS device. Particularly applicable to flip-chip bonding arrangements in which a top surface of a MEMS device is adhered to a package substrate. A barrier region is provided on a top surface of the MEMs device, laterally outside a region which forms, or overlies, the backplate and/or the cavity in the transducer substrate. The barrier region comprises a plurality of discontinuities, e.g. dimples, which inhibit the flow of epoxy.

Abstract: The application describes MEMS transducers having a patterned membrane electrode which incorporates a plurality of openings or voids. A conductive element is provided on the surface of the underlying membrane within the opening.

Abstract: The application describes MEMS devices and associated methods of fabrication. The MEMS devices comprise a filter configured and arranged to inhibit the entry of particles into at least a region of the interior of the substrate cavity from a region underlying the substrate.

Abstract: The application relates to MEMS microphone transducers having a vent structure provided in the membrane layer and an opening formed at the vent structure for tuning the frequency response of the microphone.

Abstract: Micro-electro-mechanical system (MEMS) devices are disclosed, including a MEMS device comprising a semiconductor die including integrated circuitry, a structure mounted on the semiconductor die and covering at least a portion of the circuitry, the structure defining a space between the structure and the at least a portion of the circuitry, and a transducer including a membrane, the transducer located outside of the space.

Abstract: A wafer for use in fabricating a plurality of individual transducer devices comprises a bracing structure for partitioning the wafer into a plurality of regions, and a plurality of transducer devices fabricated in one or more of the plurality of regions.

Abstract: This application relates to MEMS transducer having a membrane layer (101) and at least one variable vent structure (301). The variable vent structure has a vent hole for venting fluid so as to reduce a pressure differential across the membrane layer and a moveable vent cover (302a, 302b) which, at an equilibrium position, at least partly blocks the vent hole. The vent cover is moveable from its equilibrium position in response to a pressure differential across the vent cover so as to vary the size of a flow path through the vent hole. In various embodiments the vent cover comprises at least a first flap section (302a) and a second flap section (302b), the first flap section being hingedly coupled to the side of the vent hole and the second flap section being hingedly coupled to the first flap section so as to be moveable with respect to the first flap section.

Abstract: This application relates to MEMS transducer having a membrane layer (101) and at least one variable vent structure (301). The variable vent structure has a vent hole for venting fluid so as to reduce a pressure differential across the membrane layer and a moveable vent cover (302a, 302b) which, at an equilibrium position, at least partly blocks the vent hole. The vent cover is moveable from its equilibrium position in response to a pressure differential across the vent cover so as to vary the size of a flow path through the vent hole. In various embodiments the vent cover comprises at least a first flap section (302a) and a second flap section (302b), the first flap section being hingedly coupled to the side of the vent hole and the second flap section being hingedly coupled to the first flap section so as to be moveable with respect to the first flap section.

Abstract: The application relates to a MEMS transducer comprising first and second conductive elements which defines a first capacitor of the transducer, and a third conductive element. The third conductive element is configured to be at a potential different to the potential of the second conductive element. The third conductive element is provided in a fringing field region of the first capacitor.

Abstract: The application describes MEMS transducers having a patterned membrane electrode which incorporates a plurality of openings or voids. A conductive element is provided on the surface of the underlying membrane within the opening.

Abstract: This application relates to MEMS transducer having a membrane layer (101) and at least one variable vent structure (301). The variable vent structure has a vent hole for venting fluid so as to reduce a pressure differential across the membrane layer and a moveable vent cover (302a, 302b) which, at an equilibrium position, at least partly blocks the vent hole. The vent cover is moveable from its equilibrium position in response to a pressure differential across the vent cover so as to vary the size of a flow path through the vent hole. In various embodiments the vent cover comprises at least a first flap section (302a) and a second flap section (302b), the first flap section being hingedly coupled to the side of the vent hole and the second flap section being hingedly coupled to the first flap section so as to be moveable with respect to the first flap section.

Abstract: The application relates to MEMS microphone transducers having a vent structure provided in the membrane layer and an opening formed at the vent structure for tuning the frequency response of the microphone.

Abstract: The application describes MEMS transducers and associated methods of fabrication. The MEMS transducer has a flexible membrane with a vent structure comprising a moveable portion which opens in response to a differential pressure across the membrane to provide a flow path through the membrane. At least one edge of the moveable portion comprises one or more protrusions and/or recesses in the plane of the moveable portion.

Abstract: The applications describes lid designs for transducer packaging. The lid comprising at least one side wall which extends between a foot of the lid and an upper surface of the lid. One or more grooves are provided in a surface of the side wall which serve to resist the flow of molten solder on the surface of the lid.

Abstract: The application describes a lid for a transducer package, wherein an interior surface of the lid is provided with a plurality of dimples. The dimples are provided in a ceiling surface of the lid or in a side-wall surface of the lid. The dimples may be arranged to form a regular array. The dimples serve to create a turbulent boundary layer to decouple the interior surface of lid from airflow arising inside the package chamber, thus alleviating noise.

Abstract: The application describes MEMS transducers and associated methods of fabrication. The MEMS transducer has a flexible membrane with a vent structure comprising a moveable portion which opens in response to a differential pressure across the membrane to provide a flow path through the membrane. At least one edge of the moveable portion comprises one or more protrusions and/or recesses in the plane of the moveable portion.

Abstract: The application describes MEMS transducer structures comprising a membrane structure having a flexible membrane layer and at least one electrode layer. The electrode layer is spaced from the flexible membrane layer such that at least one air volume extends between the material of the electrode layer and the membrane layer. The electrode layer is supported relative to the flexible membrane by means of a support structure which extends between the first electrode layer and the flexible membrane layer.