Abstract: Disclosed is a method and system applicable to attaching a single or multiple optical fibers in sequence to a photonic integrated circuit enabling precise control of optical fibers and/or multiple types of optical fibers and/or at any pitch. The system and method provide optical alignment and in situ attachment of one or more optical fibers to a photonic integrated circuit chip using a photo-curable adhesive, wherein curing light is delivered to the adhesive by the optical fiber being attached.

Abstract: A photonic chip including a trench at the periphery of the photonic chip forming a recessed rim, wherein the recessed rim includes at least one geometric feature separating a plurality of waveguide locations, the at least one geometric feature suitable to prevent adhesive flow between the plurality of waveguide locations and method for preventing adhesive flow from interfering with bonding of optical fibers to the photonic chip is disclosed. A photonic chip including at least one optical fiber groove which includes an entrance portion and a non-entrance portion, wherein the entrance portion includes a flared opening having a greater clearance than the non-entrance portion and method for attaching an optical fiber to the photonic chip minimizing damage to at least one of the optical fiber and the photonic chip is disclosed.

Abstract: A photonic chip including a trench at the periphery of the photonic chip forming a recessed rim, wherein the recessed rim includes at least one geometric feature separating a plurality of waveguide locations, the at least one geometric feature suitable to prevent adhesive flow between the plurality of waveguide locations and method for preventing adhesive flow from interfering with bonding of optical fibers to the photonic chip is disclosed. A photonic chip including at least one optical fiber groove which includes an entrance portion and a non-entrance portion, wherein the entrance portion includes a flared opening having a greater clearance than the non-entrance portion and method for attaching an optical fiber to the photonic chip minimizing damage to at least one of the optical fiber and the photonic chip is disclosed.

Abstract: An inkjet printhead includes a printhead die including: a first nozzle array that is configured to be fed with ink by a first ink feed; and a second nozzle array that is configured to be fed with ink by a second ink feed; and a mounting substrate including: a surface to which the printhead die is attached; a first layer including a first ink channel having an opening disposed at the surface; a second layer including a second ink channel having an opening disposed at the surface; and a third layer disposed between the first layer and the second layer, wherein the printhead die is attached to the first layer, the second layer and the third layer, and wherein the first ink channel opening is fluidically connected to the first ink feed, and the second ink channel opening is fluidically connected to the second ink feed.

Abstract: A liquid ejector includes an electrically insulating support having a first surface and a second surface. An electrical trace begins on the first surface of the support and ends on the second surface of the support. An ejector die is positioned on the first surface of the support and electrically connected to the portion of the electrical trace located on the first surface of the support. A polymer material is molded on a portion of the ejector die and at least a portion of the first surface of the support. A portion of the electrical trace remains free of the polymer material.

Abstract: A method of assembling an inkjet printhead comprising providing a printhead chassis; providing a support surface; affixing a printhead die to a die location portion of the support surface; affixing a portion of an attachment surface of a flexible circuit to the support surface adjacent to the die location portion of the support surface; electrically connecting the printhead die to the flexible circuit; affixing a spacer member to a surface of the flexible circuit that is opposite the attachment surface; applying an encapsulating material in contact with the printhead die, the flexible circuit, and the spacer member; and curing the encapsulating material.

Abstract: A mounting assembly for a microelectronic device, the mounting assembly includes (a) a first member formed of a first material having a first coefficient of thermal expansion, the first member including i) a mounting surface for the microelectronic device; ii) a wall that adjoins the mounting surface and that is recessed from the mounting surface; and iii) an extension of the mounting surface that extends beyond an end of the wall; and (b) a second member formed of a plastic material having a second coefficient of thermal expansion that is larger than the first coefficient of thermal expansion, wherein a first portion of the second member is attached to the extension.

Abstract: An inkjet printhead includes a printhead die including: a first nozzle array that is configured to be fed with ink by a first ink feed; and a second nozzle array that is configured to be fed with ink by a second ink feed; and a mounting substrate including: a surface to which the printhead die is attached; a first layer including a first ink channel having an opening disposed at the surface; a second layer including a second ink channel having an opening disposed at the surface; and a third layer disposed between the first layer and the second layer, wherein the printhead die is attached to the first layer, the second layer and the third layer, and wherein the first ink channel opening is fluidically connected to the first ink feed, and the second ink channel opening is fluidically connected to the second ink feed.

Abstract: A method of fabricating a mounting substrate for an inkjet printhead, the method includes providing a plurality of layers of unfired ceramic, wherein a first layer and a second layer of the plurality of layers are each patterned to have unfired ceramic in one region and no unfired ceramic in a second region; stacking the plurality of layers in a predetermined order; and firing the stack of layers to make a co-fired ceramic substrate including a first ink channel corresponding to the first layer and a second ink channel corresponding to the second layer.

Abstract: A marking assembly includes a substrate and a marking device. The substrate includes a first portion made from a first material including a plurality of alignment features, and a second portion made from a second material affixed to the first portion of the substrate. The marking device is affixed to the second portion of the substrate and aligned to the alignment features of the first portion of the substrate.

Abstract: An inkjet printhead comprising a printhead die including an array of nozzles and a plurality of bond pads disposed on a first surface; a support surface for the printhead die; a flexible circuit disposed adjacent the printhead die, the flexible circuit including: a first surface; a flexible base layer including an attachment surface opposite the first surface; and a plurality of leads and corresponding contact pads disposed on the flexible base layer; a plurality of electrical interconnections connecting the bond pads of the printhead die to the plurality of contact pads of the flexible circuit; a spacer member affixed to the first surface of the flexible circuit; and an encapsulating material in contact with the first surface of the printhead die, the plurality of bond pads of the printhead die, the plurality of contact pads of the flexible circuit, and the spacer member.

Abstract: A method of assembling an inkjet printhead comprising providing a printhead chassis; providing a support surface; affixing a printhead die to a die location portion of the support surface; affixing a portion of an attachment surface of a flexible circuit to the support surface adjacent to the die location portion of the support surface; electrically connecting the printhead die to the flexible circuit; affixing a spacer member to a surface of the flexible circuit that is opposite the attachment surface; applying an encapsulating material in contact with the printhead die, the flexible circuit, and the spacer member; and curing the encapsulating material.

Abstract: The present invention relates to a fluid ejection assembly that includes an injection-molded mounting substrate that is formed by a two-shot injection molding process, wherein a housing portion of the mounting substrate is formed by a first shot molding, and a die-attach portion of the mounting substrate is formed within the housing portion by a second shot molding. The die-attach portion is made of a material having a low coefficient of thermal expansion along a direction that is parallel to a fluid passageway in the die attach portion.

Abstract: A mounting assembly for a microelectronic device, the mounting assembly includes (a) a first member formed of a first material having a first coefficient of thermal expansion, the first member including i) a mounting surface for the microelectronic device; ii) a wall that adjoins the mounting surface and that is recessed from the mounting surface; and iii) an extension of the mounting surface that extends beyond an end of the wall; and (b) a second member formed of a plastic material having a second coefficient of thermal expansion that is larger than the first coefficient of thermal expansion, wherein a first portion of the second member is attached to the extension.

Abstract: The present invention relates to a fluid ejection assembly that includes an injection-molded mounting substrate that is formed by a two-shot injection molding process, wherein a housing portion of the mounting substrate is formed by a first shot molding, and a die-attach portion of the mounting substrate is formed within the housing portion by a second shot molding. The die-attach portion is made of a material having a low coefficient of thermal expansion along a direction that is parallel to a fluid passageway in the die attach portion.

Abstract: A liquid ejector includes an electrically insulating support having a first surface and a second surface. An electrical trace begins on the first surface of the support and ends on the second surface of the support. An ejector die is positioned on the first surface of the support and electrically connected to the portion of the electrical trace located on the first surface of the support. A polymer material is molded on a portion of the ejector die and at least a portion of the first surface of the support. A portion of the electrical trace remains free of the polymer material.

Abstract: A fluid-ejecting device with simplified connectivity is disclosed herein. According to an embodiment of the present invention, a common lead is provided such that a plurality of electrical contacts on a fluid-ejecting chip are connected to the common lead, which is located on a single-layer-flex circuit. Because a common lead is provided at an edge of the single-layer-flex circuit adjacent the fluid-ejecting chip, fewer signals need to be routed through the single-layer-flex circuit to such edge, thereby reducing the complexity of such circuit. Further, bond sites at the edge of the single-layer-flex circuit adjacent the fluid-ejecting device are arranged in a manner that minimizes the required length of wire bonds for connecting such contacts to the contacts on the fluid-ejecting chip.

Abstract: A fluid flow path, a microfluidic device including the fluid flow path, and methods of forming the same are described. The fluid flow path can include an inlet and at least one outlet, and is defined by a first substrate and a second substrate, each having one or more fluid via extending therethrough, and an adhesive sealant between the first substrate and the second substrate, wherein the adhesive sealant surrounds at least one via of each substrate such that fluid flows through the vias and an area bounded by the adhesive sealant between the substrates. The adhesive sealant can be a bismaleimide-containing compound.

Abstract: A printhead includes a printhead die and an interconnect substrate. The printhead die includes a surface. The interconnect substrate includes electrical circuitry and a surface. The electrical circuitry is in electrical communication with the printhead die through a plurality of electrical connections. An encapsulant structure is positioned to encapsulate the plurality of electrical connections, and includes a barrier portion and a filler portion. The barrier portion includes a first wall and a second wall. The first wall is in contact with the surface of the printhead die and the second wall is in contact with the surface of the interconnect substrate. The filler portion is in contact with the plurality of electrical connections and positioned between the first wall of the barrier portion and the second wall of the barrier portion.

Abstract: A marking assembly includes a substrate and a marking device. The substrate includes a first portion made from a first material including a plurality of alignment features, and a second portion made from a second material affixed to the first portion of the substrate. The marking device is affixed to the second portion of the substrate and aligned to the alignment features of the first portion of the substrate.