Abstract: A flex circuit board provides islands of electrically isolated material surrounding openings in the flex circuit board to preserve fluid integrity of passageways passing through an electrically insulating layer of the flex circuit board. The electrically isolated islands surround exits of the passageways through the electrically insulating material and extend the passageways through an electrically conductive layer of the flex circuit board. Consequently, fluid passing through the passageways and electrically isolated islands in the flex circuit board is not subjected to electrical current.

Abstract: A flex circuit board provides islands of electrically isolated material surrounding openings in the flex circuit board to preserve fluid integrity of passageways passing through an electrically insulating layer of the flex circuit board. The electrically isolated islands surround exits of the passageways through the electrically insulating material and extend the passageways through an electrically conductive layer of the flex circuit board. Consequently, fluid passing through the passageways and electrically isolated islands in the flex circuit board is not subjected to electrical current.

Abstract: An adhesive compound can include an uncured epoxy film having a curing temperature between about 80° C. and about 300° C. The uncured epoxy film can include a cresol novolac resin and a bisphenol A epoxy resin. The uncured epoxy film can have a thickness between about 0.1 mil and about 5 mil.

Abstract: An ink jet printhead includes a nozzle plate including a nozzle, a recess in the nozzle plate, and a compliant layer that covers the recess and forms a sealed pocket that may be filled with air or another gas during use of the printhead. During actuation of a piezoelectric element during the ejection of ink from the nozzle, the sealed pocket attenuates an acoustic energy generated by the piezoelectric element, thereby reducing crosstalk to adjacent nozzles by the acoustic energy.

Abstract: An electrostatic actuator for a printhead. The electrostatic actuator may include a substrate. A dielectric layer may be disposed on the substrate. An electrode layer may be disposed on the dielectric layer. A first standoff layer may be disposed at least partially on the electrode layer. A second standoff layer may be disposed at least partially on the electrode layer and at least partially on the first standoff layer. A portion of the second standoff layer disposed on the electrode layer may be removed to form one or more landing pads. A membrane may be disposed at least partially on the second standoff layer.

Abstract: The printhead can include a nonwebbed diaphragm layer, an aperture plate layer, and a first webbed layer and a second webbed layer interposed between the diaphragm layer and the aperture plate layer. The nonwebbed diaphragm layer can be configured to deflect and eject ink from the print head during printing. The aperture plate layer can include a plurality of nozzles from which ink is ejected during printing. Each of the first and second webbed layers can include a first surface having a first surface area and comprising a plurality of first openings, a second surface opposing the first surface and comprising a plurality of second openings, and a web comprising a portion of the first surface, a portion of the second surface and a plurality of holes extending between the plurality of first and second openings. The printhead can be formed, in part, of alternating webbed and adjacent nonwebbed layers.

Abstract: A method and structure for forming an ink jet printhead can include the use of a transfer pad to transfer an adhesive solution to an ink jet printhead substrate. The adhesive solution can be placed within a patterned recess of a cliché and then an upper surface of the adhesive solution can be gelled. A surface of the transfer pad contacts the gelled upper surface and transfers the adhesive solution to the ink jet printhead substrate. During the transfer, a lower surface of the adhesive solution gels. During contact with the ink jet printhead substrate, the gelled lower surface adheres to the ink jet printhead substrate while the gelled upper surface releases from the transfer pad.

Abstract: An ink jet printhead includes a nozzle plate including a nozzle, a recess in the nozzle plate, and a compliant layer that covers the recess and forms a sealed pocket that may be filled with air or another gas during use of the printhead. During actuation of a piezoelectric element during the ejection of ink from the nozzle, the sealed pocket attenuates an acoustic energy generated by the piezoelectric element, thereby reducing crosstalk to adjacent nozzles by the acoustic energy.

Abstract: A method for forming a printhead including one or more channels. The method can include depositing and selectively sintering a first layer of powder into a sintered layer that forms a first discrete cross-sectional region of a printhead structure for the printhead. A plurality of layers of powder can be sequentially deposited and selectively sintered into a plurality of sintered layers that form discrete cross-sectional regions of the printhead structure and form at least a portion of at least one or more channels. Each of the plurality of layers of powder is deposited directly onto at least one sintered layer. Each of the plurality of sintered layers is integrally bonded to at least one other sintered layer.

Abstract: A method for assembling a printhead such as an ink jet printhead can include the use of a laser to bond two or more printhead layers together. In an embodiment, a laser beam is directed through a transparent layer to an energy-absorbing layer, where the energy-absorbing layer is melted such that after removal of the laser beam the melted layer solidifies to adhere the energy-absorbing layer to the transparent layer. In another embodiment, heating the energy-absorbing layer melts the transparent layer to adhere the energy-absorbing layer to the transparent layer after removal of the laser beam. The laser transmission lamination process described can result in a fluid-tight seal which requires less processing time and materials over an adhesive-based process.

Abstract: A method for assembling a printhead such as an ink jet printhead can include the use of an ultrasonic bonding process to bond two or more printhead layers together. In an embodiment, an ultrasonic frequency is directed to an interface between a first layer and a second layer to generate heat at the interface. In an embodiment, the heat melts at least one of the first layer and the second layer, and the layers are cooled to cure the melted layer. In another embodiment, the heat generated using the ultrasonic frequency cures an adhesive layer between the first layer and the second layer. The ultrasonic lamination process described can result in a fluid-tight seal which requires less processing time and materials over an adhesive-based process.

Abstract: A method for forming an ink jet printhead comprises processing an epoxy adhesive such that negative effects from physical contact with particular inks are reduced or eliminated. Conventional adhesives processed using conventional techniques are known to gain weight and squeeze out when exposed to certain inks such as ultraviolet inks, solid inks, and aqueous inks. An embodiment of the present teachings can include processing of a particular adhesive such that the resulting epoxy adhesive is suitable for printhead applications.

Abstract: A method for forming an ink jet printhead comprises processing an epoxy adhesive such that negative effects from physical contact with particular inks are reduced or eliminated. Conventional adhesives processed using conventional techniques are known to gain weight, swell, and/or oxidize when exposed to certain inks such as ultraviolet inks and pigmented inks. An embodiment of the present teachings can include processing of an adhesive including a processes a particular adhesive comprising a cresol novolac resin and a dicydiandiamide curing agent using a particular process, such that the resulting epoxy adhesive is suitable for printhead applications.

Abstract: A method and structure for an ink jet printhead, and a printer including the ink jet printhead. The printhead can include a polymer as a film spacer which separates an electrical interconnect such as a printed circuit board or a flexible circuit from a printhead diaphragm, such that the film spacer is interposed between the electrical interconnect and the diaphragm. In an embodiment, a piezoelectric actuator is free from contact with the film spacer. Embodiments of a process for forming the printhead may have reduced processing stages requiring fewer manufacturing tools than some other processes. Embodiments of the resulting printhead and printer may have fewer structural components than some other printheads and printers.

Abstract: An ink jet printhead including a substrate such as an ink reservoir or an interposer and a printing device. The printing device can be attached to the substrate with a first adhesive and with a second adhesive that is different than the first adhesive. The second adhesive can be applied to the printing device and to the substrate after attaching the printing device to the substrate with the first adhesive. The second adhesive can seal a gap from an ink channel in the substrate to a location between the printing device and the substrate.

Abstract: Disclosed is a process for preparing an ink jet printhead which comprises: (a) providing a diaphragm plate having a plurality of piezoelectric transducers bonded thereto with an adhesive; (b) placing an encapsulant thin film on the piezoelectric transducers; and (c) applying heat, pressure, or a combination thereof to the encapsulant thin film to a degree sufficient to cause the encapsulant to encapsulate the adhesive.

Abstract: A method and structure for forming an ink jet printhead can include the use of a transfer pad to transfer an adhesive solution to an ink jet printhead substrate. The adhesive solution can be placed within a patterned recess of a cliché and then an upper surface of the adhesive solution can be gelled. A surface of the transfer pad contacts the gelled upper surface and transfers the adhesive solution to the ink jet printhead substrate. During the transfer, a lower surface of the adhesive solution gels. During contact with the ink jet printhead substrate, the gelled lower surface adheres to the ink jet printhead substrate while the gelled upper surface releases from the transfer pad.

Abstract: Disclosed is a process for preparing an ink jet printhead which comprises: (a) providing a diaphragm plate having a plurality of piezoelectric transducers bonded thereto; (b) aligning an electrical circuit board having a fill joint with the piezoelectric transducers and temporarily attaching the electrical circuit board to the piezoelectric transducers, thereby creating a layered structure having interstitial spaces between the diaphragm plate, the piezoelectric transducers, and the electrical circuit board; (c) applying a thermoset polymer through the fill joint and allowing it to fill the interstitial spaces via capillary action; and (d) curing the thermoset polymer to form an interstitial polymer layer.

Abstract: A printhead and methods for forming the printhead are provided. The printhead includes an additively manufactured printhead structure having multiple sintered material layers that correspond to discrete cross-sectional regions of the printhead structure, where each of the sintered material layers is integrally bonded to at least one other sintered material layer. The printhead further includes a polymer layer attached to a surface of the printhead structure, and the printhead structure includes one or more channels for flowing ink through the printhead structure, the one or more channels forming openings on at least one surface of the printhead structure.

Abstract: A method for forming an ink jet print head can include attaching a plurality of piezoelectric elements to a diaphragm, dispensing an interstitial layer over the diaphragm, and forming a plurality of patterned conductive traces on the interstitial layer to physically and electrically contact the plurality of piezoelectric elements. The plurality of patterned traces can be formed using, for example, photolithography, a lift-off process, laser ablation, etc. Electrical communication between the plurality of patterned conductive traces and the plurality of piezoelectric elements can be established through surface contact between the two structures, without the requirement of a separate conductor.