Abstract: A device for holding a thermal cutoff device and a resistor in assembled relationship to each other in a housing and biasing the thermal cutoff device and the resistor into heat tansfer relationship with each other in the housing. Metal clips are attached to each housing half such that when the housing halves are mated, the clips are in opposing relationship to each other. Arcuate ends are formed on the clip such that when the opposing ones of the clips face each other in the housing, the arcuate ends substantially encircle one-half of the thermal cutoff device. Resilient fingers are formed on the other end of each of the clips such that when the opposing clips face each other, the resilient fingers grasp the resistor and pull it into engagement with the thermal cutout device for heat transfer relationship. The resilient fingers deflect sufficiently to allow resistors of different diameter to be used in the housing.

Abstract: A thermal cutoff of the type including an electrically conductive housing and an electrical lead having dielectric material sealingly interposed therebetween. Indicia is located on the lead such that when the dielectric material extends to or beyond the indicia, the distance between the housing and the lead along the dielectric material satisfies the minimum creepage distance required between two metal surfaces of opposite polarity.

Abstract: A thermal cutoff including a dielectric bushing having opposite ends and a hole therethrough. A wire lead received through the hole has an enlarged contact thereon adjacent one bushing end, and an enlarged deformation thereon adjacent the other bushing end. The contact and deformation prevent relative longitudinal movement between the bushing and lead.

Abstract: A thermal protector including a thermal cutoff and a device having a positive temperature coefficient of resistance, both mounted in a common housing and connected in series.