Patents by Inventor Mark Hamilton Broman
Mark Hamilton Broman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10460992Abstract: High-frequency thin film chip attenuators can include a substrate having a first side and a second side, a first portion coupled to the first side of the substrate, and a second portion coupled to the second side of the substrate. The first portion can include a ground section, an input contact section, and an output contact section. The second portion can include a ground section, an input section, an output section, and a plurality of resistive sections providing electrical communication between the input section, the output section, and the ground section. The resistive sections can be arranged in an attenuation configuration to attenuate a signal received at the input section and output via the output section. A plurality of through-holes extending through the substrate can provide electrical communication between sections on the first side of the substrate and associated sections on the second side of the substrate.Type: GrantFiled: November 6, 2018Date of Patent: October 29, 2019Assignee: THIN FILM TECHNOLOGY CORPORATIONInventors: Michael James Howieson, Mitchell Andrew Hansen, Mark Hamilton Broman
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Publication number: 20190214303Abstract: High-frequency thin film chip attenuators can include a substrate having a first side and a second side, a first portion coupled to the first side of the substrate, and a second portion coupled to the second side of the substrate. The first portion can include a ground section, an input contact section, and an output contact section. The second portion can include a ground section, an input section, an output section, and a plurality of resistive sections providing electrical communication between the input section, the output section, and the ground section. The resistive sections can be arranged in an attenuation configuration to attenuate a signal received at the input section and output via the output section. A plurality of through-holes extending through the substrate can provide electrical communication between sections on the first side of the substrate and associated sections on the second side of the substrate.Type: ApplicationFiled: November 6, 2018Publication date: July 11, 2019Inventors: Michael James Howieson, Mitchell Andrew Hansen, Mark Hamilton Broman
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Patent number: 10153208Abstract: High-frequency thin film chip attenuators can include a substrate having a first side and a second side, a first portion coupled to the first side of the substrate, and a second portion coupled to the second side of the substrate. The first portion can include a ground section, an input contact section, and an output contact section. The second portion can include a ground section, an input section, an output section, and a plurality of resistive sections providing electrical communication between the input section, the output section, and the ground section. The resistive sections can be arranged in an attenuation configuration to attenuate a signal received at the input section and output via the output section. A plurality of through-holes extending through the substrate can provide electrical communication between sections on the first side of the substrate and associated sections on the second side of the substrate.Type: GrantFiled: January 9, 2018Date of Patent: December 11, 2018Assignee: THIN FILM TECHNOLOGY CORPORATIONInventors: Michael James Howieson, Mitchell Andrew Hansen, Mark Hamilton Broman
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Patent number: 7200010Abstract: A thin film circuit module constructed for serial coupling to circuit conductors at printed and transmission line circuits. In one form of equalizer construction, thin film circuit elements are deposited on a supporting substrate and wherein a capacitor plate is defined a circuit resistor. Two connector applications serially couple the equalizer modules to trace conductors of a motherboard connector block and to cylindrical core conductors of a coaxial connector. Other hybrid equalizer constructions provide modules constructed of thin film resistors and pick-and-placed capacitors mounted piggyback to an equalizer module substrate.Type: GrantFiled: September 24, 2003Date of Patent: April 3, 2007Assignee: Thin Film Technology Corp.Inventors: Mark Hamilton Broman, Mike Howieson, Tsuguhiko Takamura, Mark Brooks, Yasutsugu Okamoto, Brent Huibregtse
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Patent number: 6819569Abstract: A thin film circuit module for terminating circuit conductors at printed and transmission line circuits. In one form of equalizer construction, thin film circuit elements are deposited on a supporting substrate and wherein one of the capacitor plates defines a circuit resistor. The equalizer modules are serially coupled to trace conductors of a connector block. Another hybrid equalizer construction includes thin film resistors and pick-and-placed capacitors.Type: GrantFiled: December 6, 2002Date of Patent: November 16, 2004Assignee: Thin Film Technology Corp.Inventors: Mark Hamilton Broman, Mike Howieson, Brent Randel Huibregtse, Tsuguhiko Takamura
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Publication number: 20040110421Abstract: A thin film circuit module constructed for serial coupling to circuit conductors at printed and transmission line circuits. In one form of equalizer construction, thin film circuit elements are deposited on a supporting substrate and wherein a capacitor plate is defined a circuit resistor. Two connector applications serially couple the equalizer modules to trace conductors of a motherboard connector block and to cylindrical core conductors of a coaxial connector. Other hybrid equalizer constructions provide modules constructed of thin film resistors and pick-and-placed capacitors mounted piggyback to an equalizer module substrate.Type: ApplicationFiled: September 24, 2003Publication date: June 10, 2004Applicant: Thin Film Technology CorporationInventors: Mark Hamilton Broman, Mike Howieson, Tsuguhiko Takamura, Mark Brooks, Yasutsugu Okamoto, Brent Huibregtse
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Patent number: 6329890Abstract: Modular thin film, distributed, lumped element band-pass filters. The filter circuitry is configured on a number of ceramic substrates. The component defining depositions are arranged to overlap and couple to one another with connecting vias. Alternative band-pass filter and delay line circuits are disclosed that provide desirable delay characteristics. Bordering ground conductors and covering ground planes shield lumped impedance resonator and overlapping capacitor elements and/or provide a hermetic seal between the layers. The assemblies are configured to accommodate a range of frequencies and permit pre-fabrication with subsequent laser trimming, assembly and packaging.Type: GrantFiled: September 29, 2000Date of Patent: December 11, 2001Assignee: Thin Film Technology Corp.Inventors: Mark Brooks, Mark Hamilton Broman
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Patent number: 6127906Abstract: A modular thin film, distributed, lumped element band-pass filter. The filter circuitry is configured on a number of ceramic substrates. The component defining depositions are arranged to overlap and couple to one another with connecting vias. Alternative 800 MHz and 1.9 GHz band-pass filter circuits are disclosed. Bordering ground conductors and covering ground planes shield lumped impedance resonator and overlapping capacitor elements. The layers are configured to accommodate a range of frequencies and permit pre-fabrication with subsequent laser trimming, assembly and packaging.Type: GrantFiled: February 25, 1999Date of Patent: October 3, 2000Assignee: Thin Film Technology Corp.Inventors: Mark Brooks, Mark Hamilton Broman
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Patent number: 5815050Abstract: A thin film differential delay line configured in a strip line assembly on ceramic substrates for PECL logic applications. A number of alternative layered constructions are disclosed. Each assembly provides complementary serpentine conductors constructed in symmetrical arrangements, i.e. side-by-side, over-under and mirrored. Bordering ground conductors at the signal layer and adjacent ground planes layers shield the delay line conductors. Termination pads having plated through vias facilitate electrical couplings between the layers.Type: GrantFiled: December 27, 1996Date of Patent: September 29, 1998Assignee: Thin Film Technology Corp.Inventors: Mark Brooks, Mark Hamilton Broman, Michael Howieson