Patents by Inventor Markus Brunnbauer

Markus Brunnbauer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8247897
    Abstract: A blank and a semiconductor device are include a composite panel with semiconductor chips embedded in a plastic package molding compound. The blank includes a composite panel with semiconductor chips arranged in rows and columns in a plastic package molding compound with active upper sides of the semiconductor chips forming a coplanar surface area with the upper side of the composite panel. The blank further includes an orientation indicator impressed into the plastic package molding compound when the semiconductor chips are embedded within the molding compound.
    Type: Grant
    Filed: March 15, 2007
    Date of Patent: August 21, 2012
    Assignee: Intel Mobile Communications GmbH
    Inventors: Markus Brunnbauer, Edward Fuergut
  • Publication number: 20120208320
    Abstract: A system on chip comprising a RF shield is disclosed. In one embodiment, the system on chip includes a RF component disposed on a chip, first redistribution lines disposed above the system on chip, the first redistribution lines coupled to I/O connection nodes. The system on chip further includes second redistribution lines disposed above the RF component, the second redistribution lines coupled to ground potential nodes. The second redistribution lines include a first set of parallel metal lines coupled together by a second set of parallel metal lines.
    Type: Application
    Filed: April 26, 2012
    Publication date: August 16, 2012
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Hans-Joachim Barth, Thorsten Meyer, Markus Brunnbauer, Jenei Snezana
  • Publication number: 20120202319
    Abstract: An apparatus and method for producing an article by molding is disclosed. In one embodiment, the method includes a mold with an upper part, a lower part and at least one mold cavity, and has a vacuum clamping ring with a least one closable vent, which is arranged between the upper part and the lower part. The mold cavity is at least partially filled with a mold material. The vent is closed, and the mold cavity is filled with a thermoplastic or thermoset material.
    Type: Application
    Filed: April 17, 2012
    Publication date: August 9, 2012
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Markus Brunnbauer, Edward Fuergut, Daniel Porwol
  • Patent number: 8217504
    Abstract: A panel with a reconfigured wafer including semiconductor chips arranged in rows and columns on semiconductor device positions includes: at least one semiconductor chip having a front, a rear and edge sides provided per semiconductor device position. The reconfigured wafer includes: a front side that forms a coplanar area with the front sides of the at least one semiconductor chip and a plastic housing composition embedding the edge sides and the rear side of the at least one semiconductor chip. The reconfigured wafer includes, on a rear side of the wafer, structures configured to stabilize the panel. The structures are composed of the plastic housing composition and are formed as thickenings of the reconfigured wafer.
    Type: Grant
    Filed: March 12, 2008
    Date of Patent: July 10, 2012
    Assignee: Intel Mobile Communications GmbH
    Inventors: Thorsten Meyer, Markus Brunnbauer
  • Patent number: 8202763
    Abstract: A method for fabricating a device, a semiconductor chip package, and a semiconductor chip assembly is disclosed. One embodiment includes applying at least one semiconductor chip on a first form element. At least one element is applied on a second form element. A material is applied on the at least one semiconductor chip and on the at least one element.
    Type: Grant
    Filed: October 7, 2010
    Date of Patent: June 19, 2012
    Assignee: Infineon Technologies AG
    Inventors: Thorsten Meyer, Markus Brunnbauer, Jens Pohl
  • Patent number: 8188585
    Abstract: An electronic device or devices and method for producing a device is disclosed. One embodiment provides an integrated component, a first package body and a contact device. The contact device penetrates the package body.
    Type: Grant
    Filed: August 10, 2007
    Date of Patent: May 29, 2012
    Assignee: Infineon Technologies AG
    Inventors: Markus Brunnbauer, Harry Hedler, Thorsten Meyer
  • Patent number: 8178953
    Abstract: A system on chip comprising a RF shield is disclosed. In one embodiment, the system on chip includes a RF component disposed on a chip, first redistribution lines disposed above the system on chip, the first redistribution lines coupled to I/O connection nodes. The system on chip further includes second redistribution lines disposed above the RF component, the second redistribution lines coupled to ground potential nodes. The second redistribution lines include a first set of parallel metal lines coupled together by a second set of parallel metal lines.
    Type: Grant
    Filed: September 30, 2008
    Date of Patent: May 15, 2012
    Assignee: Infineon Technologies AG
    Inventors: Hans-Joachim Barth, Thorsten Meyer, Markus Brunnbauer, Snezana Jenei
  • Publication number: 20120104592
    Abstract: A semiconductor module having a semiconductor chip stack and a method for producing the same is disclosed. In one embodiment, a thermally conductive layer with anisotropically thermally conductive particles is arranged between the semiconductor chips. The anisotropically thermally conductive particles have a lower thermal conductivity in a direction vertically with respect to the layer or the film than in a direction of the layer or the film.
    Type: Application
    Filed: December 21, 2011
    Publication date: May 3, 2012
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Markus Brunnbauer, Markus Fink, Hans-Gerd Jetten
  • Patent number: 8158046
    Abstract: An apparatus and method for producing an article by molding is disclosed. In one embodiment, the apparatus includes a mold with an upper part, a lower part and at least one mold cavity, and has a vacuum clamping ring with a least one closable vent, which is arranged between the upper part and the lower part.
    Type: Grant
    Filed: April 10, 2007
    Date of Patent: April 17, 2012
    Assignee: Infineon Technologies AG
    Inventors: Markus Brunnbauer, Edward Fuergut, Daniel Porwol
  • Patent number: 8106497
    Abstract: A semiconductor module having a semiconductor chip stack and a method for producing the same is disclosed. In one embodiment, a thermally conductive layer with anisotropically thermally conductive particles is arranged between the semiconductor chips. The anisotropically thermally conductive particles have a lower thermal conductivity in a direction vertically with respect to the layer or the film than in a direction of the layer or the film.
    Type: Grant
    Filed: January 12, 2007
    Date of Patent: January 31, 2012
    Assignee: Infineon Technologies AG
    Inventors: Markus Brunnbauer, Markus Fink, Hans-Gerd Jetten
  • Patent number: 8093711
    Abstract: A semiconductor device includes a semiconductor chip having a through-connection extending between a first main face of the semiconductor chip and a second main face of the semiconductor chip opposite the first main face, encapsulation material at least partially encapsulating the semiconductor chip, and a first metal layer disposed over the encapsulation material and connected with the through-connection.
    Type: Grant
    Filed: February 2, 2009
    Date of Patent: January 10, 2012
    Assignee: Infineon Technologies AG
    Inventors: Frank Zudock, Thorsten Meyer, Markus Brunnbauer, Andreas Wolter
  • Patent number: 8080880
    Abstract: A semiconductor device and manufacturing method. One embodiment provides a device including a semiconductor chip. A first conductor line is placed over the semiconductor chip. An external contact pad is placed over the first conductor line. At least a portion of the first conductor line lies within a projection of the external contact pad on the semiconductor chip.
    Type: Grant
    Filed: March 20, 2009
    Date of Patent: December 20, 2011
    Assignee: Infineon Technologies AG
    Inventors: Markus Brunnbauer, Jens Pohl, Thorsten Meyer
  • Patent number: 8076784
    Abstract: Stacked semiconductor chips are disclosed. One embodiment provides a method including a first substrate having a first surface and an opposing second surface. The first substrate includes an array of first connection elements on the first surface of the first substrate. A second substrate has a first surface and an opposing second surface. The second substrate includes an array of second connection elements on the first surface of the second substrate. The first connection elements is attached to the second connection elements; and is thinning at least one of the first substrate and the second substrate after the attachment of the first connection elements to the second connection elements.
    Type: Grant
    Filed: October 14, 2010
    Date of Patent: December 13, 2011
    Assignee: Infineon Technologies AG
    Inventors: Markus Brunnbauer, Recai Sezi, Thorsten Meyer, Gottfried Beer
  • Patent number: 8072071
    Abstract: A semiconductor device includes a chip comprising a contact element, a structured dielectric layer over the chip, and a conductive element coupled to the contact element. The conductive element comprises a first portion embedded in the structured dielectric layer, a second portion at least partially spaced apart from the first portion and embedded in the structured dielectric layer, and a third portion contacting a top of the structured dielectric layer and extending at least vertically over the first portion and the second portion.
    Type: Grant
    Filed: February 19, 2009
    Date of Patent: December 6, 2011
    Assignee: Infineon Technologies AG
    Inventors: Rainer Steiner, Jens Pohl, Werner Robl, Markus Brunnbauer, Gottfried Beer
  • Patent number: 8071428
    Abstract: A semiconductor device and method. One embodiment provides an encapsulation plate defining a first main surface and a second main surface opposite to the first main surface. The encapsulation plate includes multiple semiconductor chips. An electrically conductive layer is applied to the first and second main surface of the encapsulation plate at the same time.
    Type: Grant
    Filed: February 18, 2009
    Date of Patent: December 6, 2011
    Assignee: Infineon Technologies AG
    Inventors: Jens Pohl, Markus Brunnbauer, Irmgard Escher-Poeppel, Thorsten Meyer
  • Publication number: 20110285030
    Abstract: A method for producing chip packages is disclosed. In one embodiment, a plurality of chips is provided. The chips each have first pads. Second connection pads are applied on the wafer, wherein each second pad is electrically connected to a first pad.
    Type: Application
    Filed: August 1, 2011
    Publication date: November 24, 2011
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Thorsten Meyer, Harry Hedler, Markus Brunnbauer
  • Patent number: 8063469
    Abstract: Structure and method for fabricating a system on chip with an on-chip RF shield including interconnect metallization is described. In one embodiment, the system on chip includes an RF circuitry disposed on a first portion of a top surface of a substrate, and a semiconductor circuitry disposed on a second portion of the top surface of the substrate. An interconnect RF barrier is disposed between the RF circuitry and the semiconductor circuitry, the interconnect RF barrier coupled to a ground potential node.
    Type: Grant
    Filed: September 30, 2008
    Date of Patent: November 22, 2011
    Assignee: Infineon Technologies AG
    Inventors: Hans-Joachim Barth, Heinrich Koerner, Thorsten Meyer, Markus Brunnbauer
  • Patent number: 8012807
    Abstract: A method for producing chip packages is disclosed. In one embodiment, a plurality of chips is provided. The chips each have first pads. Second connection pads are applied on the wafer, wherein each second pad is electrically connected to a first pad.
    Type: Grant
    Filed: July 12, 2007
    Date of Patent: September 6, 2011
    Assignee: Infineon Technologies AG
    Inventors: Thorsten Meyer, Harry Hedler, Markus Brunnbauer
  • Patent number: 7952188
    Abstract: A module is described having a semiconductor chip which has at least one contact pad. A first dielectric layer, which contains a fluorocarbon compound, as well as a first wiring layer are applied to the semiconductor chip.
    Type: Grant
    Filed: January 8, 2007
    Date of Patent: May 31, 2011
    Assignee: Infineon Technologies AG
    Inventors: Markus Brunnbauer, Joachim Mahler, Manfred Mengel
  • Patent number: 7943423
    Abstract: A method of manufacturing semiconductor device comprises placing multiple chips onto a carrier. An encapsulation material is applied to the multiple chips and the carrier for forming an encapsulation workpiece. The encapsulation workpiece having a first main face facing the carrier and a second main face opposite to the first main face. Further, marking elements are applied to the encapsulation workpiece relative to the multiple chips, the marking elements being detectable on the first main face and on the second main face.
    Type: Grant
    Filed: March 10, 2009
    Date of Patent: May 17, 2011
    Assignee: Infineon Technologies AG
    Inventors: Jens Pohl, Edward Fuergut, Markus Brunnbauer, Thorsten Meyer, Peter Strobel, Daniel Porwol, Ulrich Wachter