Abstract: The disclosure relates to a halogen lamp replacement, in particular for car headlights, having a carrier plate which is covered on both main surfaces by structured electrically conductive layers, to which at least one respective light-emitting component, in particular at least one respective light-emitting-diode chip, is attached, the carrier plate being designed to dissipate heat generated by the light-emitting components to a heat sink formed by a coupling structure.

Abstract: A semiconductor device includes an active region and a trapping region positioned peripherally with respect to the active region, the trapping region presenting trapping apertures permitting the passage of particles, the trapping apertures being in fluid communication with at least one trapping chamber for trapping the particles. A method for manufacturing the semiconductor devices from one semiconductor wafer presents semiconductor device regions to be singulated along a dicing portion line.

Abstract: The invention relates to a method, an arrangement and an array, in which a structured contact layer and an elastic carrier layer arranged on a first side of the structured contact layer and connected to the structure contact layer by means of a bonded connection is produced, and in which at least one optoelectronic semiconductor component is arranged on the structured contact layer, on a second side of the structured contact layer, opposing the first side, and is electrically and mechanically connected to the structured contact layer, an elastic conversion layer in an irradiation region being applied to the structured contact layer and the elastic carrier layer in such a way that at least the optoelectronic semiconductor component is embedded in the conversion layer, at least in sections, and a connection region of the structure contact layer remains uncovered.

Abstract: A method of separating an electronic chip from a wafer is disclosed. In one aspect, the method comprises forming at least one trench in a back side of the wafer around at least part of the electronic chip to be separated, forming a back side metallization covering at least part of the back side and at least part of the at least one trench and attaching an adhesive layer of a tape to at least part of the back side metallization. The electronic chip is separated by removing material from a front side of the wafer along a separation path which includes part of the at least one trench in such a way that, during separating, the adhesive layer fills at least part of the at least one trench above a level of the back side metallization on the back side.

Abstract: The invention relates to a component comprising a first part, a second part, a housing body, and a first electrode, wherein the housing body encloses the first electrode in lateral directions at least in some regions. The first electrode has a front face and a rear face facing away from the front face, and the front and rear faces are free of a cover produced by a material of the housing body at least in some regions. The first part is arranged on the front face, and the second part is arranged on the rear face, and both the first and second parts are connected to the first electrode in an electrically conductive manner. The first electrode is designed to be continuous and is arranged between the first part and the second part in the vertical direction. Also described is a method for producing the component.

Abstract: The optoelectronic device including a radiation emitting semiconductor chip emitting electromagnetic radiation of a first wavelength range from a radiation exit surface, and a conversion element converting electromagnetic radiation of the first wavelength range into electromagnetic radiation of a second wavelength range at least partially and emitting electromagnetic radiation from a light coupling-out surface, wherein the light coupling-out surface of the conversion element is smaller than the radiation exit surface of the semiconductor chip.

Abstract: The application relates to a method and a system for determining the position of a fitted formwork, including: emitting a locating signal from the fitted formwork; receiving the emitted locating signal using a receiver at at least one reference point; determining a distance between the fitted formwork and the at least one reference point on the basis of the locating signal received; determining a fitting position, compatible with the distance determined, of the fitted formwork on at least one existing formwork; and storing the fitting position determined as the position of the fitted formwork.

Abstract: A method of manufacturing optoelectronic components includes providing a plurality of optoelectronic semiconductor chips embedded in a carrier layer, wherein a conversion layer is applied to the optoelectronic semiconductor chips and the carrier layer, creating markings in and/or on the conversion layer, and severing the carrier layer to obtain optoelectronic devices, the optoelectronic devices each having at least one of the markings, wherein the at least one marking is at least one recess in the conversion layer.

Abstract: An optoelectronic semiconductor component is specified having a semiconductor body comprising an active region provided for generating electromagnetic radiation, wherein the semiconductor body comprises a main surface which runs parallel to a main extension plane of the semiconductor body. Furthermore, the optoelectronic semiconductor component comprises a contact region, which is arranged on a side of the main surface facing away from the active region and is provided for making electrical contact with the semiconductor body, and a reflection layer, which is arranged on the side of the main surface facing away from the active region and reflects the electromagnetic radiation generated in the active region at least partially back in the direction of the active region. Further, a part of the main surface forms a radiation output coupling surface which is at least partially laterally limited by the reflection layer.

Abstract: A light-emitting device and a method for manufacturing a light emitting device are disclosed. In an embodiment a light-emitting device includes a light-emitting semiconductor chip having a light-outcoupling surface and an optical element arranged on the light-outcoupling surface, wherein the light-emitting semiconductor chip is laterally surrounded by a frame element in a form-locking manner, wherein the optical element is mounted on the frame element, wherein the frame element projects beyond the light-outcoupling surface in a vertical direction such that a gas-filled gap is present at least in a partial region between the light-outcoupling surface and the optical element, and wherein the frame element has a channel connecting the gap to an atmosphere surrounding the light-emitting device.

Abstract: An optoelectronic component includes a housing including a first cavity bounded by a first wall, wherein a circumferentially extending first step is formed at an inner side of the first wall, the first step circumferentially extends around the first cavity obliquely with respect to a bottom of the first cavity, a first optoelectronic semiconductor chip is arranged at the bottom of the first cavity, the first optoelectronic semiconductor chip is embedded into a first potting material arranged in the first cavity and extending from the bottom of the first cavity as far as the first step, and a first potting surface of the first potting material is formed at the first step.

Abstract: In an embodiment a portable electronic device includes a sensor device including at least one light emitter, at least one light detector, a housing in which the at least one light emitter and the at least one light detector are arranged and at least one channel forming a passageway through the housing, wherein the at least one light emitter and the at least one light detector are arranged such that light emitted from the at least one light emitter passes through the at least one channel and is thereafter detected by the at least one light detector.

Abstract: A light-emitting component includes a light-emitting element and a housing with a cavity. The housing includes a housing material that absorbs at least 80 percent of light in the visible range. The cavity is formed by a limiting wall, formed by a housing surface, and a plane of the element. The light-emitting element arranged within the cavity of the housing and positioned above the element plane includes an emission side located opposite to the element plane. The cavity is at least partially filled with a transparent material composed of a first material and a second material, wherein the first material at least partially covers the limiting wall, and the second material at least partially covers the emission side. A boundary surface is formed between the first material and the second material. A first refractive index of the first material is smaller than a second refractive index of the second material.

Abstract: The invention relates to a method, an arrangement and an array, in which a structured contact layer and an elastic carrier layer arranged on a first side of the structured contact layer and connected to the structure contact layer by means of a bonded connection is produced, and in which at least one optoelectronic semiconductor component is arranged on the structured contact layer, on a second side of the structured contact layer, opposing the first side, and is electrically and mechanically connected to the structured contact layer, an elastic conversion layer in an irradiation region being applied to the structured contact layer and the elastic carrier layer in such a way that at least the optoelectronic semiconductor component is embedded in the conversion layer, at least in sections, and a connection region of the structure contact layer remains uncovered.

Abstract: A method of producing side-emitting components includes providing a plurality of semiconductor chips on an auxiliary carrier, wherein the semiconductor chips on the auxiliary carrier are spaced apart from each other and each have a side surface provided with a transparent protective layer; covering the semiconductor chips with a radiation-reflecting molding compound so that in a plan view of the auxiliary carrier, the semiconductor chips are completely covered by the molding compound; and singulating the molding compound and the semiconductor chips into a plurality of components so that the components each include a semiconductor chip, wherein the components are singulated at the associated transparent protective layer, as a result of which the components each have a radiation exit surface exposed by the molding compound and formed by a surface of the remaining or exposed transparent protective layer.

Abstract: A method of producing optoelectronic components includes providing a carrier; arranging optoelectronic semiconductor chips on the carrier; forming a conversion layer for radiation conversion on the carrier, wherein the optoelectronic semiconductor chips are surrounded by the conversion layer; and carrying out a singulation process to form separate optoelectronic components, wherein at least the conversion layer is severed.

Abstract: The invention relates to a component comprising a first part, a second part, a housing body, and a first electrode, wherein the housing body encloses the first electrode in lateral directions at least in some regions. The first electrode has a front face and a rear face facing away from the front face, and the front and rear faces are free of a cover produced by a material of the housing body at least in some regions. The first part is arranged on the front face, and the second part is arranged on the rear face, and both the first and second parts are connected to the first electrode in an electrically conductive manner. The first electrode is designed to be continuous and is arranged between the first part and the second part in the vertical direction. Also described is a method for producing the component.

Abstract: A method produces a plurality of conversion elements including: A) providing a first carrier; B) applying a first element to the first carrier using a first application technique, the first element including a conversion material, the first application technique being different from compression molding; C) applying a second element to the first carrier by a second application technique, the second element including quantum dots, the quantum dots being introduced into a matrix material and being different from the conversion material, the second application technique being molding or compression molding; D) hardening of the matrix material; E) optionally, rearranging the arrangement produced according to step D) to a second carrier; and F) separating so that a plurality of conversion elements are generated.

Abstract: An optoelectronic component has at least one lead frame section, wherein an optoelectronic element is arranged on the lead frame section, a mold material is applied at least on a first face of the lead frame section and adhesively connected to the lead frame section by the first face, the lead frame section consists of a predetermined material, a part of the first face of the lead frame section is provided with a coating, a region of the first face is free of the coating, and the mold material connects to the material of the lead frame section in the free region.

Abstract: A method of producing a carrier substrate for an optoelectronic semiconductor component includes: providing a leadframe including a first electrically conductive contact section and a second electrically conductive contact section, and injection molding a housing including a housing frame embedding the leadframe by an injection-molding material free of epoxy such that the leadframe embedded in the housing frame of the injection-molded housing forms a carrier substrate for an optoelectronic semiconductor component.