Abstract: In an embodiment an optoelectronic component includes an optoelectronic semiconductor chip, an optical element and a chip carrier, wherein the semiconductor chip is arranged on the chip carrier, wherein the optical element is arranged downstream of the semiconductor chip in a radiation direction and is attached to an optic carrier by an adhesive layer, wherein a potting forms a frame around the optical element, the optic carrier and the adhesive layer which extends from the optical element to the optic carrier, wherein the potting fixes the optical element in its position relative to the semiconductor chip, wherein the optic carrier and the chip carrier are one piece, and wherein the optic carrier at least partially surrounds the semiconductor chip laterally as seen in the radiation direction.

Abstract: A semiconductor laser device is specified comprising an edge emitting semiconductor laser diode, which emits laser light along a horizontal direction during operation, a reflector element, which deflects a first part of the laser light in a vertical direction, while a second part of the laser light continues to propagate in the horizontal direction, and a detector element, which is arranged at least partly in a beam path of the second part of the laser light. An optoelectronic beam deflection element for a semiconductor laser device is furthermore specified.

Abstract: A light-emitting component includes a light-emitting chip and a housing including a plastic body and a reflector, the reflector includes an electrically conductive layer, the light-emitting chip includes a top side and an underside, the underside of the light-emitting chip is arranged on the plastic body, an electrical terminal on the top side of the light-emitting chip electrically conductively connects to the reflector by a bond wire, the underside of the light-emitting chip and the reflector are electrically insulated from one another, a conduction region is provided within the plastic body, thermal conductivity of the conduction region is greater than thermal conductivity of the plastic body, the conduction region adjoins the underside of the light-emitting chip, and the conduction region extends from the side of the plastic body facing the light-emitting chip as far as the side of the plastic body facing away from the light-emitting chip.

Abstract: A measuring arrangement having an optical transmitter and an optical receiver are disclosed. In an embodiment a measuring arrangement includes an optical transmitter configured to transmit electromagnetic measuring radiation into a transmission space, an optical receiver configured to receive measuring radiation reflected by an object in a reception space and a covering configured to reduce reception of an interference radiation by the receiver, wherein the interference radiation is measuring radiation not reflected by the object.

Abstract: An optoelectronic component includes an optoelectronic semiconductor chip that emits electromagnetic radiation, arranged in a housing, wherein the housing has an outer wall face and an exit face transparent to the electromagnetic radiation, the exit face is set back relative to the outer wall face in a direction of an interior of the housing, the optoelectronic semiconductor chip is arranged such that radiation emitted by the optoelectronic semiconductor chip in an emission direction can emerge from the optoelectronic component through the exit face, and the outer wall face has separating marks and the exit face is free of separating marks.

Abstract: A measuring arrangement having an optical transmitter and an optical receiver are disclosed. In an embodiment a measuring arrangement includes an optical transmitter configured to transmit electromagnetic measuring radiation into a transmission space, an optical receiver configured to receive measuring radiation reflected by an object in a reception space and a covering configured to reduce reception of an interference radiation by the receiver, wherein the interference radiation is measuring radiation not reflected by the object.

Abstract: A laser component includes a housing that includes a base section including a top side and an underside, wherein a plurality of electrical soldering contact pads are configured at the underside of the base section, the electrical soldering contact pads enabling surface mounting of the laser component, a plurality of electrical chip contact pads are configured at the top side of the base section and electrically conductively connect to the soldering contact pads, the housing includes a cavity adjoining the top side of the base section, and a laser chip is arranged in the cavity and electrically conductively connects to at least some of the chip contact pads.

Abstract: An electrical circuit that drives a light-emitting component including a parallel circuit including a capacitor; and a switching element, wherein a first terminal for a voltage supply connects to a first contact of the capacitor and a second terminal for a voltage supply connects to a second contact of the capacitor, the switching element includes a first electrical switch including a first input for a first switching signal, a second electrical switch including a second input for a second switching signal, and third and fourth terminals, the third terminal and the fourth terminal form a component terminal for the light-emitting component, a first current path may be switched to be conducting by the first switch, the first current path includes the component terminal, a second current path may be switched to be conducting by the second switch, and the second current path is in parallel with the component terminal.

Abstract: An embodiment optoelectronic semiconductor device includes a housing having a leadframe with a first and second connection conductor. The housing further has a housing body surrounding the leadframe in one or more regions. The housing body extends in a vertical direction between a mounting side of the housing body and a front side of the housing body opposite the mounting side. The first connection conductor has a recess. A semiconductor chip configured to generate radiation is arranged within the housing, and the semiconductor chip is disposed in the recess and is affixed to the first connection conductor within the recess. A side face of the recess forms a reflector for reflecting the generated radiation. The first connection conductor protrudes from the housing body at the mounting side. The semiconductor chip is, in at least some regions, free of an encapsulation material adjoining the semiconductor chip.

Abstract: An optoelectronic component includes an optoelectronic semiconductor chip that emits electromagnetic radiation, arranged in a housing, wherein the housing has an outer wall face and an exit face transparent to the electromagnetic radiation, the exit face is set back relative to the outer wall face in a direction of an interior of the housing, the optoelectronic semiconductor chip is arranged such that radiation emitted by the optoelectronic semiconductor chip in an emission direction can emerge from the optoelectronic component through the exit face, and the outer wall face has separating marks and the exit face is free of separating marks.

Abstract: A laser component includes a housing that includes a base section including a top side and an underside, wherein a plurality of electrical soldering contact pads are configured at the underside of the base section, the electrical soldering contact pads enabling surface mounting of the laser component, a plurality of electrical chip contact pads are configured at the top side of the base section and electrically conductively connect to the soldering contact pads, the housing includes a cavity adjoining the top side of the base section, and a laser chip is arranged in the cavity and electrically conductively connects to at least some of the chip contact pads.

Abstract: A light-emitting component includes a light-emitting chip and a housing including a plastic body and a reflector, the reflector includes an electrically conductive layer, the light-emitting chip includes a top side and an underside, the underside of the light-emitting chip is arranged on the plastic body, an electrical terminal on the top side of the light-emitting chip electrically conductively connects to the reflector by a bond wire, the underside of the light-emitting chip and the reflector are electrically insulated from one another, a conduction region is provided within the plastic body, thermal conductivity of the conduction region is greater than thermal conductivity of the plastic body, the conduction region adjoins the underside of the light-emitting chip, and the conduction region extends from the side of the plastic body facing the light-emitting chip as far as the side of the plastic body facing away from the light-emitting chip.

Abstract: A housing for a semiconductor chip has a front side and a rear side opposite the front side, wherein the front side has a fastening area for the semiconductor chip; the rear side has a mounting area to mount the housing, wherein the mounting area runs obliquely to the fastening area; and the rear side has a resting area running parallel to the fastening area.

Abstract: An electronic device includes a printed circuit board having a cutout, wherein an optoelectronic component including a housing having an outer surface, the housing has a chip receptacle space at a top side, an optoelectronic semiconductor chip is arranged in the chip receptacle space, the housing has a first soldering contact surface and a second soldering contact surface, the first soldering contact surface and the second soldering contact surface face in the same spatial direction as the outer surface, and the first soldering contact surface and the second soldering contact surface are set back relative to the outer surface, is arranged in the cutout.

Abstract: A housing for a semiconductor chip has a front side and a rear side opposite the front side, wherein the front side has a fastening area for the semiconductor chip; the rear side has a mounting area to mount the housing, wherein the mounting area runs obliquely to the fastening area; and the rear side has a resting area running parallel to the fastening area.

Abstract: An embodiment optoelectronic semiconductor device includes a housing having a leadframe with a first and second connection conductor. The housing further has a housing body surrounding the leadframe in one or more regions. The housing body extends in a vertical direction between a mounting side of the housing body and a front side of the housing body opposite the mounting side. The first connection conductor has a recess. A semiconductor chip configured to generate radiation is arranged within the housing, and the semiconductor chip is disposed in the recess and is affixed to the first connection conductor within the recess. A side face of the recess forms a reflector for reflecting the generated radiation. The first connection conductor protrudes from the housing body at the mounting side. The semiconductor chip is, in at least some regions, free of an encapsulation material adjoining the semiconductor chip.

Abstract: A radiation-emitting component is specified, having a metallic carrier body (1), which comprises at least two connection locations (1a, 1b) for making electrical contact with the component, a laser diode chip (2), which is fixed to the metallic carrier body (1) and is electrically conductively connected to the at least two connection locations (1a, 1b), a housing (3), which surrounds the metallic carrier body (1) in places, wherein the housing (3) is formed with a plastic, the connection locations (1a, 1b) extend in each case at least in places along a bottom face (3a) and a side face (3b) of the housing (3), said side face running transversely with respect to the bottom face, and the component is surface-mountable by means of the connection locations (1a, 1b) in such a way that the bottom face (3a) or the side face (3b) forms a mounting face of the component.

Abstract: An optoelectronic semiconductor component includes a lead frame with two lead frame parts and an optoelectronic semiconductor chip. The semiconductor chip is fitted to a first of the lead frame parts. A radiation-transmissive potting body of the semiconductor component mechanically connects the lead frame parts to one another. The potting body is set up for beam shaping. The first lead frame part has a reflector trough with a base surface on which the semiconductor chip is mounted. The reflector trough has a lateral surface with three sections. When seen in a plan view of the base surface, the sections revolve around the base surface and follow one another in a direction away from the base surface. In the first section, closest to the base surface, the lateral surface is oriented perpendicular to the base surface.

Abstract: An optoelectronic device includes an optoelectronic component that receives or generates radiation, a frame having a cavity, the optoelectronic component being arranged in said cavity, a connection carrier to which the optoelectronic component is fixed, and a cover covering the cavity and forming a radiation passage area for the radiation, wherein a beam path from the optoelectronic component to the radiation passage area is free of an encapsulation material for the optoelectronic component.

Abstract: A method for producing a plurality of optoelectronic semiconductor components in combination is specified. A plurality of radiation-emitting and radiation-detecting semiconductor chips are applied on a carrier substrate. The semiconductor chips are potted with a respective potting compound. The potting compounds are subsequently severed by sawing between adjacent semiconductor chips. A common frame is subsequently applied to the carrier substrate The common frame has a plurality of chambers open toward the top. The frame is arranged in such a way that a respective semiconductor chip is arranged in a respective chamber of the frame. A semiconductor component produced in such a way and the use of the semiconductor component are furthermore specified.