Patents by Inventor Martin J. McKinley

Martin J. McKinley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5001038
    Abstract: Printed circuit patterns are photolithographically defined on a three dimensional "projection" surface (204) of a printed circuit substrate (202) using a projection image aligner and a photomask (210) having a planar image (210A). The geometry of the projection is restricted such that the slope of the projection surface, as measured at any point on the projection surface and relative to a reference plane which is parallel to the focal plane of the projection image aligner, is less than 90 degrees. A solution of photoresist includes a photoresist solvent, a fluorosurfactant and an aromatic hydrocarbon solvent, and is preferably sprayed over the projection surface. In one method of manufacture, the printed circuit substrate is moved from one position to another during the exposure of the photoresist layer (206). In another method, after a first portion of the projection surface is exposed by a first photomask (502), a second photomask (504) is substituted and the remainder of the projection surface exposed.
    Type: Grant
    Filed: November 16, 1987
    Date of Patent: March 19, 1991
    Assignee: Motorola, Inc.
    Inventors: Dale W. Dorinski, M. William Branan, Jr., Glenn F. Urbish, Anthony B. Suppelsa, Martin J. McKinley, Douglas W. Hendricks
  • Patent number: 4939792
    Abstract: A molded thermoplastic housing (100) includes base (102) and cover (104) members joined by a living hinge (106). The base member (102) includes a peripheral wall (108). Four solderable printed circuit patterns (112, 114, 116 and 118) are vacuum deposited onto the interior and exterior surfaces of both housing members. The printed circuit patterns on opposing surfaces of the base and cover members are joined by conductive through-holes (e.g., 120 and 122), while the printed circuit patterns on the interior surfaces of the base and cover members are joined by an interconnecting printed circuit pattern (124) which is vacuum deposited onto the living hinge. Mylar sheets (132) are adhered to the exterior surface of the housing to insulate the exterior printed circuit patterns. An antenna pattern (126) is also vacuum deposited onto an exterior surface of the housing.
    Type: Grant
    Filed: November 16, 1987
    Date of Patent: July 3, 1990
    Assignee: Motorola, Inc.
    Inventors: Glenn F. Urbish, John M. McKee, Martin J. McKinley, Anthony B. Suppelsa
  • Patent number: 4894663
    Abstract: The preferred housing includes an integrally molded thermoplastic base (102) and cover (104) assembly. The cover is joined to the base by a living hinge (106) and a peripheral wall (108) extends around the perimeter of the base. In one embodiment, the antenna is a wire loop (204), the wire being wound in an external circumferential groove (202A) in the peripheral wall or, alternatively, integrally molded into the peripheral wall. Other embodiments use printed circuit loop antenna patterns that are preferably vacuum deposited directly onto the thermoplastic base and/or cover. When the antenna pattern is disposed on both the cover and the base, a portion of the antenna (e.g., 1002K) is also disposed on the hinge to join the main portions of the antenna on the base and cover. In one embodiment of the printed circuit loop antenna, the plane of the loop lies parallel to the base and may include one or more turns or loops (e.g., 402C, E, G and J). In another embodiment, the loop includes a 90 degree bend (e.g.
    Type: Grant
    Filed: November 16, 1987
    Date of Patent: January 16, 1990
    Assignee: Motorola, Inc.
    Inventors: Glenn F. Urbish, Quirino Balzano, Dale W. Dorinski, Martin J. McKinley, Leng H. Ooi, John A. Stoutland, Anthony B. Suppelsa