Abstract: A sensing element for an inductive position measuring device includes an excitation track, a receiving track, a substrate made of a metallic material, and a shield layer structure. The shield layer structure includes a first layer that has a dielectric property and a second layer that is electrically conductive. The shield layer structure is arranged between the substrate and the receiving track and/or between the substrate and the excitation track.

Abstract: A soldering aid for connecting a cable to a printed circuit board includes an electrically insulating body having a first, second and third recesses, and an electrically conductive contact structure coupled thereto. The contact structure is partially embedded in the body to be connected to a cable core therein, and partially protrudes from the body to be connected the printed circuit board. The first recess is conically tapered to receive an end portion of the cable and has first and second sections for non-stripped and stripped portions of the cable end portion, respectively. An end of the second recess adjoins the second section of the first recess to enable optical verification of formation of a connection between the cable core and the contact structure. The third recess is configured to receive and transfer solder to the second section of the first recess to thereby form the connection.

Abstract: A soldering aid for connecting a cable to a printed circuit board includes an electrically insulating body having a first, second and third recesses, and an electrically conductive contact structure coupled thereto. The contact structure is partially embedded in the body to be connected to a cable core therein, and partially protrudes from the body to be connected the printed circuit board. The first recess is conically tapered to receive an end portion of the cable and has first and second sections for non-stripped and stripped portions of the cable end portion, respectively. An end of the second recess adjoins the second section of the first recess to enable optical verification of formation of a connection between the cable core and the contact structure. The third recess is configured to receive and transfer solder to the second section of the first recess to thereby form the connection.

Abstract: A sensor unit for measuring the position of a component that is movable relative to the sensor unit includes a metal body, which has a first opening. An electronic component is arranged in the first opening such that a gap is provided between the electronic component and the metal body, the gap being filled with an electrically insulating molding compound. In addition, an electrically insulating first layer is applied on the electronic component and on the molding compound. The electronic component is electrically contacted with a circuit trace, and the circuit trace is routed through the first layer in a first section and extends on the first layer in a second section.

Abstract: A sensor unit for measuring the position of a component that is movable relative to the sensor unit includes a metal body, which has a first opening. An electronic component is arranged in the first opening such that a gap is provided between the electronic component and the metal body, the gap being filled with an electrically insulating molding compound. In addition, an electrically insulating first layer is applied on the electronic component and on the molding compound. The electronic component is electrically contacted with a circuit trace, and the circuit trace is routed through the first layer in a first section and extends on the first layer in a second section.