Patents by Inventor Marvin Kilgo

Marvin Kilgo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200376775
    Abstract: A system including: an optical light source; a reservoir configured to hold a liquid photosensitive medium that is adapted to change states upon exposure to a portion of light from the optical imaging system; and a control system configured to control the optical light source to expose specified portions of a surface the photosensitive medium contained in the reservoir to light from the light source. The control system may be further configured to control the optical light source to repeatedly expose the surface of the photosensitive medium contained in the reservoir to light from the light source to build layers of a desired object.
    Type: Application
    Filed: February 15, 2019
    Publication date: December 3, 2020
    Applicant: DDM SYSTEMS, INC.
    Inventors: Suman DAS, John HALLORAN, Marvin KILGO
  • Publication number: 20170232516
    Abstract: Aspects of the disclosed technology include an additive manufacturing method including: applying a mixture of metal powder and a carrier agent to a substrate; removing a portion of the carrier agent from the applied mixture; and fusing the metal powder remaining in the applied mixture to the substrate.
    Type: Application
    Filed: February 13, 2017
    Publication date: August 17, 2017
    Inventors: Suman Das, Marvin Kilgo
  • Publication number: 20060134831
    Abstract: Embodiments of the invention provide methods for packaging integrated circuits and/or other electronic components with electrochemically fabricated structures which include conductive interconnection elements. In some embodiments the electrochemically produced structures are fabricated on substrates that include conductive vias while in other embodiments, the substrates are solid blocks of conductive material, or conductive material containing passages that allow the flow of fluid to maintain desired thermal properties of the packaged electronic components.
    Type: Application
    Filed: August 19, 2005
    Publication date: June 22, 2006
    Inventors: Adam Cohen, Vacit Arat, Michael Lockard, Christopher Folk, Marvin Kilgo
  • Publication number: 20050202660
    Abstract: Electrochemical fabrication processes and apparatus for producing multi-layer structures include operations or means for providing enhanced monitoring of build operations or detection of the results of build operations, operations or means for build problem recognition, operations or means for evaluation of corrective action options, operations or means for making corrective action decisions, and operations or means for executing actions based on those decisions.
    Type: Application
    Filed: November 22, 2004
    Publication date: September 15, 2005
    Inventors: Adam Cohen, Michael Lockard, Dennis Smalley, Marvin Kilgo
  • Publication number: 20050053849
    Abstract: Embodiments of the invention are directed to the formation of beam-like structures using electrochemical fabrication techniques where the beam like structures have narrow regions and wider regions such that a beam of desired compliance is obtained. In some embodiments, narrower regions of the beam are thinner than a minimum feature size but are formable as a result of the thicker regions. In some embodiments the beam-like structures are formed from a plurality of adhered layers.
    Type: Application
    Filed: July 2, 2004
    Publication date: March 10, 2005
    Applicant: Microfabrica Inc.
    Inventors: Adam Cohen, Michael Lockard, Christopher Bang, Marvin Kilgo
  • Publication number: 20050023145
    Abstract: Numerous electrochemical fabrication methods and apparatus are provided for producing multi-layer structures (e.g. having meso-scale or micro-scale features) from a plurality of layers of deposited materials using adhered masks (e.g. formed from liquid photoresist or dry film), where two or more materials may be provided per layer where at least one of the materials is a structural material and one or more of any other materials may be a sacrificial material which will be removed after formation of the structure. Materials may comprise conductive materials that are electrodeposited or deposited in an electroless manner. In some embodiments special care is undertaken to ensure alignment between patterns formed on successive layers.
    Type: Application
    Filed: May 7, 2004
    Publication date: February 3, 2005
    Inventors: Adam Cohen, Jill Thomassian, Michael Lockard, Marvin Kilgo, Uri Frodis, Dennis Smalley