Patents by Inventor Mary B. Rothwell

Mary B. Rothwell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10304004
    Abstract: A technique relates to an assembly for a quantum computing device. A quantum bus plane includes a first set of recesses. A readout plane includes a second set of recesses. A block is positioned to hold the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses. A plurality of qubit chips are included where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.
    Type: Grant
    Filed: January 15, 2018
    Date of Patent: May 28, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Jerry M. Chow, Jay M. Gambetta, Mary B. Rothwell, James R. Rozen
  • Patent number: 10304005
    Abstract: A technique relates to an assembly for a quantum computing device. A quantum bus plane includes a first set of recesses. A readout plane includes a second set of recesses. A block is positioned to hold the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses. A plurality of qubit chips are included where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.
    Type: Grant
    Filed: April 6, 2018
    Date of Patent: May 28, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Jerry M. Chow, Jay M. Gambetta, Mary B. Rothwell, James R. Rozen
  • Patent number: 10289960
    Abstract: A technique relates to an assembly for a quantum computing device. A quantum bus plane includes a first set of recesses. A readout plane includes a second set of recesses. A block is positioned to hold the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses. A plurality of qubit chips are included where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.
    Type: Grant
    Filed: January 15, 2018
    Date of Patent: May 14, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Jerry M. Chow, Jay M. Gambetta, Mary B. Rothwell, James R. Rozen
  • Publication number: 20190131509
    Abstract: A device has a first stack of thin films, the first stack of thin films having a first opposing surface and a first connection surface, wherein the first connection surface contacts a first superconducting region; a second stack of thin films, the second stack of thin films having a second opposing surface and a second connection surface, wherein the second connection surface contacts a second superconducting region; and a superconducting bump bond electrically connecting the first and second opposing surfaces, the superconducting bump bond maintaining a low ohmic electrical contact between the first and second opposing surfaces at temperatures below 100 degrees Kelvin, wherein at least one of the first or second superconducting regions comprise material with a melting point of at least 700 degrees Celsius.
    Type: Application
    Filed: December 27, 2018
    Publication date: May 2, 2019
    Inventors: David W. Abraham, John M. Cotte, Mary B. Rothwell
  • Publication number: 20190109273
    Abstract: A method for adjusting a qubit includes measuring a qubit characteristic of a qubit device and computing a modification to correct the qubit characteristic. A geometry of a shunt capacitor is adjusted using a laser direct write process. The qubit characteristic is verified.
    Type: Application
    Filed: December 10, 2018
    Publication date: April 11, 2019
    Inventors: David W. Abraham, Jay M. Gambetta, Mary B. Rothwell
  • Publication number: 20190103541
    Abstract: A technique relates to a device. First thin films are characterized by having a first opposing surface and a first connection surface in which the first connection surface is in physical contact with a first superconducting region. Second thin films are characterized by having a second opposing surface and a second connection surface in which the first and second opposing surfaces are opposite one another. The second connection surface is in physical contact with a second superconducting region. A solder material electrically connects the first and second opposing surfaces, and the solder material is characterized by maintaining a low ohmic electrical contact between the first and second opposing surfaces at temperatures below 100 degrees Kelvin. The first and second superconducting regions are formed of materials that have a melting point of at least 700 degrees Celsius.
    Type: Application
    Filed: September 29, 2017
    Publication date: April 4, 2019
    Inventors: David W. Abraham, John M. Cotte, Mary B. Rothwell
  • Patent number: 10169714
    Abstract: A technique relates to an assembly for a quantum computing device. A quantum bus plane includes a first set of recesses. A readout plane includes a second set of recesses. A block is positioned to hold the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses. A plurality of qubit chips are included where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.
    Type: Grant
    Filed: November 9, 2016
    Date of Patent: January 1, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Jerry M. Chow, Jay M. Gambetta, Mary B. Rothwell, James R. Rozen
  • Patent number: 10170680
    Abstract: A method for adjusting a qubit includes measuring a qubit characteristic of a qubit device and computing a modification to correct the qubit characteristic. A geometry of a shunt capacitor is adjusted using a laser direct write process. The qubit characteristic is verified.
    Type: Grant
    Filed: September 16, 2015
    Date of Patent: January 1, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: David W. Abraham, Jay M. Gambetta, Mary B. Rothwell
  • Publication number: 20180232655
    Abstract: A technique relates to an assembly for a quantum computing device. A quantum bus plane includes a first set of recesses. A readout plane includes a second set of recesses. A block is positioned to hold the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses. A plurality of qubit chips are included where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.
    Type: Application
    Filed: April 6, 2018
    Publication date: August 16, 2018
    Inventors: Jerry M. CHOW, Jay M. GAMBETTA, Mary B. ROTHWELL, James R. ROZEN
  • Publication number: 20180137429
    Abstract: A technique relates to an assembly for a quantum computing device. A quantum bus plane includes a first set of recesses. A readout plane includes a second set of recesses. A block is positioned to hold the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses. A plurality of qubit chips are included where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.
    Type: Application
    Filed: January 15, 2018
    Publication date: May 17, 2018
    Inventors: Jerry M. CHOW, Jay M. GAMBETTA, Mary B. ROTHWELL, James R. ROZEN
  • Publication number: 20180137430
    Abstract: A technique relates to an assembly for a quantum computing device. A quantum bus plane includes a first set of recesses. A readout plane includes a second set of recesses. A block is positioned to hold the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses. A plurality of qubit chips are included where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.
    Type: Application
    Filed: January 15, 2018
    Publication date: May 17, 2018
    Inventors: Jerry M. CHOW, Jay M. GAMBETTA, Mary B. ROTHWELL, James R. ROZEN
  • Patent number: 9953269
    Abstract: A technique relates to an assembly for a quantum computing device. A quantum bus plane includes a first set of recesses. A readout plane includes a second set of recesses. A block is positioned to hold the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses. A plurality of qubit chips are included where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.
    Type: Grant
    Filed: June 7, 2016
    Date of Patent: April 24, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Jerry M. Chow, Jay M. Gambetta, Mary B. Rothwell, James R. Rozen
  • Publication number: 20170213143
    Abstract: A technique relates to an assembly for a quantum computing device. A quantum bus plane includes a first set of recesses. A readout plane includes a second set of recesses. A block is positioned to hold the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses. A plurality of qubit chips are included where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.
    Type: Application
    Filed: June 7, 2016
    Publication date: July 27, 2017
    Inventors: Jerry M. Chow, Jay M. Gambetta, Mary B. Rothwell, James R. Rozen
  • Publication number: 20170072504
    Abstract: A method for adjusting a qubit includes measuring a qubit characteristic of a qubit device and computing a modification to correct the qubit characteristic. A geometry of a shunt capacitor is adjusted using a laser direct write process. The qubit characteristic is verified.
    Type: Application
    Filed: September 16, 2015
    Publication date: March 16, 2017
    Inventors: David W. Abraham, Jay M. Gambetta, Mary B. Rothwell
  • Publication number: 20170061317
    Abstract: A technique relates to an assembly for a quantum computing device. A quantum bus plane includes a first set of recesses. A readout plane includes a second set of recesses. A block is positioned to hold the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses. A plurality of qubit chips are included where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.
    Type: Application
    Filed: November 9, 2016
    Publication date: March 2, 2017
    Inventors: Jerry M. Chow, Jay M. Gambetta, Mary B. Rothwell, James R. Rozen
  • Patent number: 9524470
    Abstract: A technique relates to an assembly for a quantum computing device. A quantum bus plane includes a first set of recesses. A readout plane includes a second set of recesses. A block is positioned to hold the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses. A plurality of qubit chips are included where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.
    Type: Grant
    Filed: June 12, 2015
    Date of Patent: December 20, 2016
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Jerry M. Chow, Jay M. Gambetta, Mary B. Rothwell, James R. Rozen
  • Publication number: 20160364653
    Abstract: A technique relates to an assembly for a quantum computing device. A quantum bus plane includes a first set of recesses. A readout plane includes a second set of recesses. A block is positioned to hold the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses. A plurality of qubit chips are included where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.
    Type: Application
    Filed: June 12, 2015
    Publication date: December 15, 2016
    Inventors: Jerry M. Chow, Jay M. Gambetta, Mary B. Rothwell, James R. Rozen
  • Patent number: 8518718
    Abstract: A method for forming a memory device includes forming a cavity having an inner surface with an undulating profile in a substrate, depositing a ferromagnetic material in the cavity, forming a reading element on the substrate proximate to a portion of the ferromagnetic material, and forming a writing element on the substrate proximate to a second portion of the ferromagnetic material.
    Type: Grant
    Filed: September 13, 2012
    Date of Patent: August 27, 2013
    Assignee: International Business Machines Corporation
    Inventors: Eric A. Joseph, Stuart S. P. Parkin, Mary B. Rothwell
  • Patent number: 8467221
    Abstract: A method for forming a memory device includes forming a cavity having an inner surface with an undulating profile in a substrate, depositing a ferromagnetic material in the cavity, forming a reading element on the substrate proximate to a portion of the ferromagnetic material, and forming a writing element on the substrate proximate to a second portion of the ferromagnetic material.
    Type: Grant
    Filed: July 9, 2010
    Date of Patent: June 18, 2013
    Assignee: International Business Machines Corporation
    Inventors: Eric A. Joseph, Stuart S. P. Parkin, Mary B. Rothwell
  • Publication number: 20130005053
    Abstract: A method for forming a memory device includes forming a cavity having an inner surface with an undulating profile in a substrate, depositing a ferromagnetic material in the cavity, forming a reading element on the substrate proximate to a portion of the ferromagnetic material, and forming a writing element on the substrate proximate to a second portion of the ferromagnetic material.
    Type: Application
    Filed: September 13, 2012
    Publication date: January 3, 2013
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Eric A. Joseph, Stuart S. P. Parkin, Mary B. Rothwell