Patents by Inventor Masaaki Asano
Masaaki Asano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11810820Abstract: A through electrode substrate includes a substrate provided with a through hole; a through electrode having a sidewall portion extending along a sidewall of the through hole, and a first portion positioned on a first surface of the substrate and connected to the sidewall portion; an inorganic film that at least partially covers the first portion of the through electrode from the first side and is provided with an opening positioned on the first portion; and a first wiring structure including at least a first wiring layer having an insulation layer that is positioned to the first side of the inorganic film and includes at least an organic layer provided with an opening communicating with the opening of the inorganic film, and an electroconductive layer connected to the first portion of the through electrode through the opening of the inorganic film and the opening of the insulation layer.Type: GrantFiled: May 24, 2022Date of Patent: November 7, 2023Assignee: DAI NIPPON PRINTING CO., LTD.Inventors: Shinji Maekawa, Hiroshi Kudo, Takamasa Takano, Hiroshi Mawatari, Masaaki Asano
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Publication number: 20220328353Abstract: A through electrode substrate includes a substrate provided with a through hole; a through electrode having a sidewall portion extending along a sidewall of the through hole, and a first portion positioned on a first surface of the substrate and connected to the sidewall portion; an inorganic film that at least partially covers the first portion of the through electrode from the first side and is provided with an opening positioned on the first portion; and a first wiring structure including at least a first wiring layer having an insulation layer that is positioned to the first side of the inorganic film and includes at least an organic layer provided with an opening communicating with the opening of the inorganic film, and an electroconductive layer connected to the first portion of the through electrode through the opening of the inorganic film and the opening of the insulation layer.Type: ApplicationFiled: May 24, 2022Publication date: October 13, 2022Applicant: DAI NIPPON PRINTING CO., LTD.Inventors: Shinji MAEKAWA, Hiroshi KUDO, Takamasa TAKANO, Hiroshi MAWATARI, Masaaki ASANO
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Patent number: 11373906Abstract: A method of manufacturing a through electrode substrate, the method includes: preparing a substrate including a first surface positioned on a first side, and a second surface positioned on a second side opposite to the first side, the substrate being provided with a through hole; forming a through electrode having a sidewall portion extending along a sidewall of the through hole, and a first portion positioned on the first surface of the substrate and connected to the sidewall portion; forming an organic film inside the through hole; forming an inorganic film at least partially covering the first portion of the through electrode from the first side; forming an insulation layer positioned to the first side of the inorganic film; and forming an electroconductive layer passing through the inorganic film and the insulation layer so as to be connected to the first portion of the through electrode.Type: GrantFiled: February 18, 2021Date of Patent: June 28, 2022Assignee: DAI NIPPON PRINTING CO., LTD.Inventors: Shinji Maekawa, Hiroshi Kudo, Takamasa Takano, Hiroshi Mawatari, Masaaki Asano
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Publication number: 20220028772Abstract: A through electrode substrate includes a substrate provided with a through hole, a through electrode positioned in the through hole, and a first wiring structure including at least a first wiring layer positioned on a first surface of the substrate, and a second wiring layer positioned on the first wiring layer. The first wiring layer and the second wiring layer respectively have an insulation layer and an electroconductive layer. A first insulation layer of the first wiring layer includes at least an organic layer. At least one wiring layer of the first wiring structure includes an inorganic layer having insulation properties, the inorganic layer being positioned to a first side of the organic layer of the first insulation layer of the first wiring layer.Type: ApplicationFiled: October 8, 2021Publication date: January 27, 2022Applicant: DAI NIPPON PRINTING CO., LTD.Inventors: Shinji MAEKAWA, Hiroshi KUDO, Takamasa TAKANO, Hiroshi MAWATARI, Masaaki ASANO
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Patent number: 11153471Abstract: An image sensor module includes an interposer substrate having a first surface and a second surface opposite to the first surface, the interposer substrate being light-transmissive and having a plurality of through-holes; an image sensor located to face the first surface of the interposer substrate, the image sensor having a light receiving surface on a side of the interposer substrate, a plurality of photoelectric conversion elements being located at the light receiving surface, the image sensor being connected with an external circuit via electrodes provided in the plurality of through-holes; and a lens unit located to face the second surface of the interposer substrate.Type: GrantFiled: April 29, 2020Date of Patent: October 19, 2021Assignee: DAI NIPPON PRINTING Co., Ltd.Inventors: Yoshiaki Tsuruoka, Masaaki Asano, Shinji Maekawa
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Publication number: 20210175121Abstract: A method of manufacturing a through electrode substrate, the method includes: preparing a substrate including a first surface positioned on a first side, and a second surface positioned on a second side opposite to the first side, the substrate being provided with a through hole; forming a through electrode having a sidewall portion extending along a sidewall of the through hole, and a first portion positioned on the first surface of the substrate and connected to the sidewall portion; forming an organic film inside the through hole; forming an inorganic film at least partially covering the first portion of the through electrode from the first side; forming an insulation layer positioned to the first side of the inorganic film; and forming an electroconductive layer passing through the inorganic film and the insulation layer so as to be connected to the first portion of the through electrode.Type: ApplicationFiled: February 18, 2021Publication date: June 10, 2021Applicant: DAI NIPPON PRINTING CO., LTD.Inventors: Shinji MAEKAWA, Hiroshi KUDO, Takamasa TAKANO, Hiroshi MAWATARI, Masaaki ASANO
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Patent number: 10957592Abstract: A through electrode substrate includes: a substrate including first and second surfaces respectively on a first side and a second side opposite to the first, the substrate having a through hole; and a through electrode. The through electrode has a sidewall portion along the through hole sidewall, and a first portion the first surface and connected to the sidewall portion. The through electrode substrate includes: an organic film inside the through hole; an inorganic film that at least partially covers the through electrode first portion from the first side and has an opening on the first portion; and a first wiring layer having an insulation layer to the inorganic film first side and includes an organic layer with an opening communicating with the inorganic film opening, and an electroconductive layer connected to the through electrode first portion through the inorganic film opening and the insulation layer opening.Type: GrantFiled: August 21, 2017Date of Patent: March 23, 2021Assignee: DAI NIPPON PRINTING CO., LTD.Inventors: Shinji Maekawa, Hiroshi Kudo, Takamasa Takano, Hiroshi Mawatari, Masaaki Asano
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Publication number: 20200259980Abstract: An image sensor module includes an interposer substrate having a first surface and a second surface opposite to the first surface, the interposer substrate being light-transmissive and having a plurality of through-holes; an image sensor located to face the first surface of the interposer substrate, the image sensor having a light receiving surface on a side of the interposer substrate, a plurality of photoelectric conversion elements being located at the light receiving surface, the image sensor being connected with an external circuit via electrodes provided in the plurality of through-holes; and a lens unit located to face the second surface of the interposer substrate.Type: ApplicationFiled: April 29, 2020Publication date: August 13, 2020Inventors: Yoshiaki TSURUOKA, Masaaki ASANO, Shinji MAEKAWA
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Patent number: 10681256Abstract: An image sensor module includes an interposer substrate having a first surface and a second surface opposite to the first surface, the interposer substrate being light-transmissive and having a plurality of through-holes; an image sensor located to face the first surface of the interposer substrate, the image sensor having a light receiving surface on a side of the interposer substrate, a plurality of photoelectric conversion elements being located at the light receiving surface, the image sensor being connected with an external circuit via electrodes provided in the plurality of through-holes; and a lens unit located to face the second surface of the interposer substrate.Type: GrantFiled: February 9, 2018Date of Patent: June 9, 2020Assignee: DAI NIPPON PRINTING Co., Ltd.Inventors: Yoshiaki Tsuruoka, Masaaki Asano, Shinji Maekawa
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Publication number: 20190287853Abstract: A through electrode substrate includes: a substrate including first and second surfaces respectively on a first side and a second side opposite to the first, the substrate having a through hole; and a through electrode. The through electrode has a sidewall portion along the through hole sidewall, and a first portion the first surface and connected to the sidewall portion. The through electrode substrate includes: an organic film inside the through hole; an inorganic film that at least partially covers the through electrode first portion from the first side and has an opening on the first portion; and a first wiring layer having an insulation layer to the inorganic film first side and includes an organic layer with an opening communicating with the inorganic film opening, and an electroconductive layer connected to the through electrode first portion through the inorganic film opening and the insulation layer opening.Type: ApplicationFiled: August 21, 2017Publication date: September 19, 2019Applicant: DAI NIPPON PRINTING CO., LTD.Inventors: Shinji MAEKAWA, Hiroshi KUDO, Takamasa TAKANO, Hiroshi MAWATARI, Masaaki ASANO
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Publication number: 20190259696Abstract: A through electrode substrate includes a substrate provided with a through hole, a through electrode positioned in the through hole, and a first wiring structure including at least a first wiring layer positioned on a first surface of the substrate, and a second wiring layer positioned on the first wiring layer. The first wiring layer and the second wiring layer respectively have an insulation layer and an electroconductive layer. A first insulation layer of the first wiring layer includes at least an organic layer. At least one wiring layer of the first wiring structure includes an inorganic layer having insulation properties, the inorganic layer being positioned to a first side of the organic layer of the first insulation layer of the first wiring layer.Type: ApplicationFiled: August 4, 2017Publication date: August 22, 2019Applicant: DAI NIPPON PRINTING CO., LTD.Inventors: Shinji MAEKAWA, Hiroshi KUDO, Takamasa TAKANO, Hiroshi MAWATARI, Masaaki ASANO
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Publication number: 20180205858Abstract: An image sensor module includes an interposer substrate having a first surface and a second surface opposite to the first surface, the interposer substrate being light-transmissive and having a plurality of through-holes; an image sensor located to face the first surface of the interposer substrate, the image sensor having a light receiving surface on a side of the interposer substrate, a plurality of photoelectric conversion elements being located at the light receiving surface, the image sensor being connected with an external circuit via electrodes provided in the plurality of through-holes; and a lens unit located to face the second surface of the interposer substrate.Type: ApplicationFiled: February 9, 2018Publication date: July 19, 2018Inventors: Yoshiaki TSURUOKA, Masaaki ASANO, Shinji MAEKAWA
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Patent number: 10008442Abstract: A through-electrode substrate includes a base including a first surface and a second surface mutually opposing each other, and a through-electrode arranged in a through-hole passing through the second surface from the first surface of the base, wherein the through-electrode includes an first end surface of the first surface side and an second end surface of the second surface side exposed from the base in the first surface and the second surface, and a periphery edge of one or both of the first end surface of the first surface side and the second end surface of the second surface side is covered by a part of the base.Type: GrantFiled: February 2, 2017Date of Patent: June 26, 2018Assignee: DAI NIPPON PRINTING Co., Ltd.Inventor: Masaaki Asano
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Patent number: 9924596Abstract: The structural body related to the present disclosure includes a substrate having insulation properties arranged with a first surface and a second surface opposing the first surface, a through hole passing through the first surface and the second surface of the substrate, and a through electrode including a conductive material arranged within the through hole, the through electrode conducting the first surface and the second surface of the substrate and including a projection part exposed from the second surface to the outside of the through hole, wherein at least a part of the through hole is gradually increasing in size approaching the second surface in a thickness direction of the substrate, and forming a depression part keeping a gap between the through hole and the through electrode.Type: GrantFiled: August 15, 2017Date of Patent: March 20, 2018Assignee: DAI NIPPON PRINTING CO., LTD.Inventors: Masaaki Asano, Hiroshi Mawatari, Takafumi Okamura
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Publication number: 20170347451Abstract: The structural body related to the present disclosure includes a substrate having insulation properties arranged with a first surface and a second surface opposing the first surface, a through hole passing through the first surface and the second surface of the substrate, and a through electrode including a conductive material arranged within the through hole, the through electrode conducting the first surface and the second surface of the substrate and including a projection part exposed from the second surface to the outside of the through hole, wherein at least a part of the through hole is gradually increasing in size approaching the second surface in a thickness direction of the substrate, and forming a depression part keeping a gap between the through hole and the through electrode.Type: ApplicationFiled: August 15, 2017Publication date: November 30, 2017Inventors: Masaaki Asano, Hiroshi Mawatari, Takafumi Okamura
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Patent number: 9769927Abstract: The structural body related to the present disclosure includes a substrate having insulation properties arranged with a first surface and a second surface opposing the first surface, a through hole passing through the first surface and the second surface of the substrate, and a through electrode including a conductive material arranged within the through hole, the through electrode conducting the first surface and the second surface of the substrate and including a projection part exposed from the second surface to the outside of the through hole, wherein at least a part of the through hole is gradually increasing in size approaching the second surface in a thickness direction of the substrate, and forming a depression part keeping a gap between the through hole and the through electrode.Type: GrantFiled: March 8, 2017Date of Patent: September 19, 2017Assignee: DAI NIPPON PRINTING CO., LTD.Inventors: Masaaki Asano, Hiroshi Mawatari, Takafumi Okamura
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Publication number: 20170181280Abstract: The structural body related to the present disclosure includes a substrate having insulation properties arranged with a first surface and a second surface opposing the first surface, a through hole passing through the first surface and the second surface of the substrate, and a through electrode including a conductive material arranged within the through hole, the through electrode conducting the first surface and the second surface of the substrate and including a projection part exposed from the second surface to the outside of the through hole, wherein at least a part of the through hole is gradually increasing in size approaching the second surface in a thickness direction of the substrate, and forming a depression part keeping a gap between the through hole and the through electrode.Type: ApplicationFiled: March 8, 2017Publication date: June 22, 2017Inventors: Masaaki ASANO, Hiroshi MAWATARI, Takafumi OKAMURA
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Publication number: 20170148719Abstract: A through-electrode substrate includes a base including a first surface and a second surface mutually opposing each other, and a through-electrode arranged in a through-hole passing through the second surface from the first surface of the base, wherein the through-electrode includes an first end surface of the first surface side and an second end surface of the second surface side exposed from the base in the first surface and the second surface, and a periphery edge of one or both of the first end surface of the first surface side and the second end surface of the second surface side is covered by a part of the base.Type: ApplicationFiled: February 2, 2017Publication date: May 25, 2017Inventor: Masaaki Asano
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Patent number: 8471573Abstract: A dynamic quantity sensor includes a first substrate, a fixed part arranged in the first substrate, a spiral shaped movable electrode arranged separated from the first substrate, one end of the spiral shaped movable electrode being supported by the fixed part, a fixed electrode positioned on the periphery of the movable electrode and arranged in a detection direction of a dynamic quantity, and a first terminal electrically connected to the fixed part and a second terminal electrically connected to the fixed electrode.Type: GrantFiled: April 13, 2012Date of Patent: June 25, 2013Assignee: Dai Nippon Printing Co., Ltd.Inventors: Masaaki Asano, Tsukasa Yonekawa
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Publication number: 20120235694Abstract: A dynamic quantity sensor includes a first substrate, a fixed part arranged in the first substrate, a spiral shaped movable electrode arranged separated from the first substrate, one end of the spiral shaped movable electrode being supported by the fixed part, a fixed electrode positioned on the periphery of the movable electrode and arranged in a detection direction of a dynamic quantity, and a first terminal electrically connected to the fixed part and a second terminal electrically connected to the fixed electrode.Type: ApplicationFiled: April 13, 2012Publication date: September 20, 2012Applicant: DAI Nippon Printing Co., Ltd.Inventors: Masaaki ASANO, Tsukasa YONEKAWA