Abstract: A multilayer substrate that includes a first ceramic layer that is a dense body, a second ceramic layer that has open pores, and a resin layer adjacent the second ceramic layer, wherein a material of the resin layer is present in the open pores of the second ceramic layer.

Abstract: A multilayer substrate that includes a first ceramic layer that is a dense body, a second ceramic layer that has open pores, and a resin layer adjacent the second ceramic layer, wherein a material of the resin layer is present in the open pores of the second ceramic layer.

Abstract: A composite substrate that is composed of a resin layer including an interlayer connection metal conductor and multiple ceramic layers that each include interlayer connection metal conductor, such that the resin layer is interposed between the ceramic layers, and the interlayer connection metal conductor in the resin layer is integrated with the interlayer connection metal conductors in the ceramic layers.

Abstract: A ceramic multilayer substrate that includes a ceramic insulator layer, which includes a first layer, a second layer, and a third layer and in which the first layer is interposed between the second layer and the third layer, an inner pattern conductor, an outer pattern conductor, and outer electrodes. The ceramic insulator layer is interposed between the inner pattern conductor and the outer pattern conductor. The sintering shrinkage start temperatures of the second layer alone and the third layer alone in a green sheet state are higher than or equal to the sintering shrinkage stop temperature of the first layer alone in a green sheet state. The thickness of the ceramic insulator layer is 5.0 ?m to 55.7 ?m. The ratio of the total of the thickness of the second layer and the thickness of the third layer to the thickness of the first layer is 0.25 to 1.11.

Abstract: A ceramic multilayer substrate that includes a ceramic insulator layer, which includes a first layer, a second layer, and a third layer and in which the first layer is interposed between the second layer and the third layer, an inner pattern conductor, an outer pattern conductor, and outer electrodes. The ceramic insulator layer is interposed between the inner pattern conductor and the outer pattern conductor. The sintering shrinkage start temperatures of the second layer alone and the third layer alone in a green sheet state are higher than or equal to the sintering shrinkage stop temperature of the first layer alone in a green sheet state. The thickness of the ceramic insulator layer is 5.0 ?m to 55.7 ?m. The ratio of the total of the thickness of the second layer and the thickness of the third layer to the thickness of the first layer is 0.25 to 1.11.

Abstract: A ceramic circuit board that includes a ceramic insulator layer, grounding pattern conductors, connection lands disposed on a first surface of the ceramic circuit board, and grounding electrodes disposed on a second surface of the ceramic circuit board and connected to the grounding pattern conductors. Each of the grounding pattern conductors contains a metal and an oxide and includes a pattern main portion disposed inside the ceramic circuit board and an extended portion in which a first end thereof is connected to the pattern main portion and a second end thereof is exposed at a side surface of the ceramic circuit board. The metal content of the extended portion is lower than the metal content of the pattern main portion.

Abstract: A composite substrate that is composed of a resin layer including an interlayer connection metal conductor and multiple ceramic layers that each include interlayer connection metal conductor, such that the resin layer is interposed between the ceramic layers, and the interlayer connection metal conductor in the resin layer is integrated with the interlayer connection metal conductors in the ceramic layers.

Abstract: A ceramic multilayer substrate that includes a ceramic insulator layer, which includes a first layer, a second layer, and a third layer and in which the first layer is interposed between the second layer and the third layer, an inner pattern conductor, an outer pattern conductor, and outer electrodes. The ceramic insulator layer is interposed between the inner pattern conductor and the outer pattern conductor. The sintering shrinkage start temperatures of the second layer alone and the third layer alone in a green sheet state are higher than or equal to the sintering shrinkage stop temperature of the first layer alone in a green sheet state. The thickness of the ceramic insulator layer is 5.0 ?m to 55.7 ?m. The ratio of the total of the thickness of the second layer and the thickness of the third layer to the thickness of the first layer is 0.25 to 1.11.

Abstract: A ceramic circuit board that includes a ceramic insulator layer, grounding pattern conductors, connection lands disposed on a first surface of the ceramic circuit board, and grounding electrodes disposed on a second surface of the ceramic circuit board and connected to the grounding pattern conductors. Each of the grounding pattern conductors contains a metal and an oxide and includes a pattern main portion disposed inside the ceramic circuit board and an extended portion in which a first end thereof is connected to the pattern main portion and a second end thereof is exposed at a side surface of the ceramic circuit board. The metal content of the extended portion is lower than the metal content of the pattern main portion.