Abstract: A photosensor device includes a substrate, a graphene layer provided on the substrate, a pair of electrodes electrically connected to the graphene layer, and a passivation layer formed of a resin and configured to cover the graphene layer. The graphene layer has holes which are periodically arranged, and the passivation layer is provided with openings that communicate with the holes. The side surfaces of the holes and the inner walls of the openings are continuously covered with an insulating thin film.

Abstract: A photosensor device includes a substrate, a graphene layer provided on the substrate, a pair of electrodes electrically connected to the graphene layer, and a passivation layer formed of a resin and configured to cover the graphene layer. The graphene layer has holes which are periodically arranged, and the passivation layer is provided with openings that communicate with the holes. The side surfaces of the holes and the inner walls of the openings are continuously covered with an insulating thin film.

Abstract: A heat dissipation material includes a plurality of linearly-structured objects of carbon atoms configured to include a first terminal part and a second terminal part; a first diamond-like carbon layer configured to cover the first terminal part of each of the plurality of linearly-structured objects; and a filler layer configured to be permeated between the plurality of linearly-structured objects.

Abstract: A heat dissipating structure includes a heat source; a heat dissipating part disposed to oppose to the heat source; a concave portion formed in at least one of opposing surfaces of the heat source and the heat dissipating part; and a heat conducting structure comprising a filler layer of thermoplastic material disposed between the heat source and the heat dissipating part and contacting with the opposing surfaces of the heat source and the heat dissipating part, and an assembly of carbon nanotubes that are distributed in the thermoplastic material, oriented perpendicularly to the surfaces of the filler layer, contacting, at both ends, with the opposing surfaces of the heat source and the heat dissipating part, and limited its distribution in the opposing surfaces by the concave portion.

Abstract: A heat dissipation material includes a plurality of linearly-structured objects of carbon atoms configured to include a first terminal part and a second terminal part; a first diamond-like carbon layer configured to cover the first terminal part of each of the plurality of linearly-structured objects; and a filler layer configured to be permeated between the plurality of linearly-structured objects.

Abstract: A heat dissipation material includes a plurality of linearly-structured objects of carbon atoms configured to include a first terminal part and a second terminal part; a first diamond-like carbon layer configured to cover the first terminal part of each of the plurality of linearly-structured objects; and a filler layer configured to be permeated between the plurality of linearly-structured objects.

Abstract: A sheet-like structure has a plurality of linear carbon chains extending in a first direction, a phase change material in which tip ends of the linear carbon chains are embedded, and a plurality of aggregates formed at root ends of the linear carbon chains and not covered with the phase change material, the aggregates being distributed in a second direction perpendicular to the first direction with less localization than the tip ends.

Abstract: An electronic device includes: a semiconductor device; a heat-conductive resin, disposed above the semiconductor device, including a heat conductor and a resin; a linear carbon piece, disposed above the heat-conductive resin, to be thermally in contact with the heat conductor; and a heat spreader, disposed above the linear carbon piece, including a depressed portion having the heat-conductive resin.

Abstract: A sheet structure has: a bundle structure including a plurality of linear structures made of carbon which are oriented in a predetermined direction; a covering layer covering the plurality of linear structures made of carbon; and a filling layer provided between the plurality of linear structures made of carbon covered with the covering layer. The thickness of the covering layer is not uniform in a direction crossing the predetermined direction.

Abstract: A method of manufacturing an electronic component includes disposing a heat radiation material including a plurality of linear structures of carbon atoms and a filling layer of a thermoplastic resin provided among the plurality of linear structures above a first substrate, disposing a blotting paper above the heat radiation material, making a heat treatment at a temperature higher than a melting temperature of the thermoplastic resin and absorbing the thermoplastic resin above the plurality of linear structures with the absorption paper, removing the blotting paper, and adhering the heat radiation material to the first substrate by cooling to solidify the thermoplastic resin.

Abstract: A heat dissipation material includes a plurality of linearly-structured objects of carbon atoms configured to include a first terminal part and a second terminal part; a first diamond-like carbon layer configured to cover the first terminal part of each of the plurality of linearly-structured objects; and a filler layer configured to be permeated between the plurality of linearly-structured objects.

Abstract: A sheet structure has: a bundle structure including a plurality of linear structures made of carbon which are oriented in a predetermined direction; a covering layer covering the plurality of linear structures made of carbon; and a filling layer provided between the plurality of linear structures made of carbon covered with the covering layer. The thickness of the covering layer is not uniform in a direction crossing the predetermined direction.

Abstract: According to an aspect of the embodiments, a sheet-shaped structure includes a bundle structure that includes a plurality of line-shaped structures of carbon atoms, a covering layer that covers the line-shaped structures in longitudinal directions of the line-shaped structures, respectively, and a filling layer that is disposed between the line-shaped structures covered with the covering layer.

Abstract: A method of manufacturing an electronic component includes disposing a heat radiation material including a plurality of linear structures of carbon atoms and a filling layer of a thermoplastic resin provided among the plurality of linear structures above a first substrate, disposing a blotting paper above the heat radiation material, making a heat treatment at a temperature higher than a melting temperature of the thermoplastic resin and absorbing the thermoplastic resin above the plurality of linear structures with the absorption paper, removing the blotting paper, and adhering the heat radiation material to the first substrate by cooling to solidify the thermoplastic resin.

Abstract: The invention provides an optical device which can lower the drive voltage which is used as one of the parameters for performance evaluation of the optical device. The optical device includes a substrate having first and second ridges, first and second grooves, a third groove, and first and second banks formed thereon, a Mach-Zehnder optical waveguide formed on the substrate, and an electrode set including first and second signal electrodes and a grounding electrode for controlling light which propagates in the optical wveguide. The grounding electrode extends to the first groove adjacent to the first bank and the second groove adjacent to the second bank. The optical device is applied, for example, to a transmission side apparatus for a long distance optical transmission system.

Abstract: The invention provides an optical device which can lower the drive voltage which is used as one of the parameters for performance evaluation of the optical device. The optical device includes a substrate having first and second ridges, first and second grooves, a third groove, and first and second banks formed thereon, a Mach-Zehnder optical waveguide formed on the substrate, and an electrode set including first and second signal electrodes and a grounding electrode for controlling light which propagates in the optical wveguide. The grounding electrode extends to the first groove adjacent to the first bank and the second groove adjacent to the second bank. The optical device is applied, for example, to a transmission side apparatus for a long distance optical transmission system.

Abstract: The invention provides an optical device which can lower the drive voltage which is used as one of the parameters for performance evaluation of the optical device. The optical device includes a substrate having first and second ridges, first and second grooves, a third groove, and first and second banks formed thereon, a Mach-Zehnder optical waveguide formed on the substrate, and an electrode set including first and second signal electrodes and a grounding electrode for controlling light which propagates in the optical waveguide. The grounding electrode extends to the first groove adjacent to the first bank and the second groove adjacent to the second bank. The optical device is applied, for example, to a transmission side apparatus for a long distance optical transmission system.

Abstract: The invention provides an optical device which can lower the drive voltage which is used as one of the parameters for performance evaluation of the optical device. The optical device includes a substrate having first and second ridges, first and second grooves, a third groove, and first and second banks formed thereon, a Mach-Zehnder optical waveguide formed on the substrate, and an electrode set including first and second signal electrodes and a grounding electrode for controlling light which propagates in the optical waveguide. The grounding electrode extends to the first groove adjacent to the first bank and the second groove adjacent to the second bank. The optical device is applied, for example, to a transmission side apparatus for a long distance optical transmission system.

Abstract: A photodetector module including a support substrate having a main surface, an optical waveguide mounted on the support substrate and having an end face for emerging a light beam along a first optical path, and a photodetector mounted on the support substrate so that the light beam emerged from the end face of the optical waveguide is incident on the photodetector, the photodetector having a photodetecting portion responding to the light beam incident on the photodetector. The photodetector module further includes a first inclined surface formed on a substrate of the photodetector for refracting the light beam along the first optical path to a second optical path, and a second inclined surface for totally reflecting the light beam along the second optical path to a third optical path substantially perpendicular to the photodetecting portion.

Abstract: A photoreception device includes an oblique surface on a semiconductor substrate for causing a deflection of an optical beam incident thereto and a photodetection region provided on a first side of the semiconductor substrate for detecting the deflected optical beam, the photodetection region including a first electrode, wherein the photoreception device further includes a second electrode for biasing the photodetection region an a second, opposite side of the semiconductor substrate.