Patents by Inventor Masaaki Ogitsu

Masaaki Ogitsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7625262
    Abstract: A material for purification of a semiconductor polishing slurry that without changing of pH value, is capable of efficiently purifying a polishing slurry to thereby not only prevent metal contamination of a polished object as effectively as possible but also achieve recycling of a polishing slurry without any problem; a relevant module for purification of a semiconductor polishing slurry; and a process for purifying a semiconductor polishing slurry with the use thereof. In particular, a material for purification of a semiconductor polishing slurry characterized in that it comprises a fibrous substrate having a functional group capable of forming a metal chelate or such a functional group together with hydroxyl fixed onto at least the surface thereof. This material for purification of a semiconductor polishing slurry is, for example, used in such a manner that it is inserted in a container fitted with polishing slurry inflow port and outflow port while ensuring passage of polishing slurry flow.
    Type: Grant
    Filed: March 18, 2004
    Date of Patent: December 1, 2009
    Assignee: Nomura Micro Science Co., Ltd.
    Inventors: Mitsugu Abe, Nobuyoshi Nambu, Osamu Ito, Masaaki Ogitsu, Kazuo Inomata
  • Publication number: 20060205325
    Abstract: A material for purification of a semiconductor polishing slurry that without changing of pH value, is capable of efficiently purifying a polishing slurry to thereby not only prevent metal contamination of a polished object as effectively as possible but also achieve recycling of a polishing slurry without any problem; a relevant module for purification of a semiconductor polishing slurry; and a process for purifying a semiconductor polishing slurry with the use thereof. In particular, a material for purification of a semiconductor polishing slurry characterized in that it comprises a fibrous substrate having a functional group capable of forming a metal chelate or such a functional group together with hydroxyl fixed onto at least the surface thereof. This material for purification of a semiconductor polishing slurry is, for example, used in such a manner that it is inserted in a container fitted with polishing slurry inflow port and outflow port while ensuring passage of polishing slurry flow.
    Type: Application
    Filed: March 18, 2004
    Publication date: September 14, 2006
    Applicant: Nomura Micro Science Co., Ltd.
    Inventors: Mitsugu Abe, Nobuyoshi Nambu, Osamu Ito, Masaaki Ogitsu, Kazuo Inomata
  • Patent number: 6413151
    Abstract: A polishing table 11 in the CMP apparatus 10 has a diameter smaller than the diameter of a polishing pad 12. The polishing pad 12 is disposed on the polishing table so as to cover the entire top surface of the polishing table 11. A space 13 is formed between outside of the outer peripheral surface of the polishing table 11 and under the outer peripheral bottom surface portion of the polishing pad 12 projecting outside from the edge of the polishing table 11. A trough 14 with an opening 14a on top thereof as a device for withdrawing the used slurry is disposed around the outer peripheral surface of the polishing table 11 so as to be located a part thereof in the space 13.
    Type: Grant
    Filed: December 6, 2000
    Date of Patent: July 2, 2002
    Assignee: LSI Logic Corporation
    Inventors: Hiroshi Mizuno, Masaaki Ogitsu, Takuya Nagamine, Toru Kikuchi
  • Publication number: 20010003700
    Abstract: A polishing table 11 in the CMP apparatus 10 has a diameter smaller than the diameter of a polishing pad 12. The polishing pad 12 is disposed on the polishing table so as to cover the entire top surface of the polishing table 11. A space 13 is formed between outside of the outer peripheral surface of the polishing table 11 and under the outer peripheral bottom surface portion of the polishing pad 12 projecting outside from the edge of the polishing table 11. A trough 14 with an opening 14a on top thereof as a device for withdrawing the used slurry is disposed around the outer peripheral surface of the polishing table 11 so as to be located a part thereof in the space 13.
    Type: Application
    Filed: December 6, 2000
    Publication date: June 14, 2001
    Applicant: LSI Logic Corporation
    Inventors: Hiroshi Mizuno, Masaaki Ogitsu, Takuya Nagamine, Toru Kikuchi