Abstract: A conductive powder improving various performances as compared to conventional conductive powders is described. The conductive power includes conductive particles, each of which have a metal or alloy film formed on the surface of a core particle. The conductive particle has thereon protrusions protruding from the surface of the film. Each protrusion includes a particle chain including particles of the metal or alloy linked in a row. It is preferred that the metal or alloy is nickel or a nickel alloy. It is also preferred that the ratio of the total area of the exposed portions of the film to the projection area of the conductive particle is 60% or less.

Abstract: A conductive powder improving various performances as compared to conventional conductive powders is described. The conductive power includes conductive particles, each of which have a metal or alloy film formed on the surface of a core particle. The conductive particle has thereon protrusions protruding from the surface of the film. Each protrusion includes a particle chain including particles of the metal or alloy linked in a row. It is preferred that the metal or alloy is nickel or a nickel alloy. It is also preferred that the ratio of the total area of the exposed portions of the film to the projection area of the conductive particle is 60% or less.

Abstract: A conductive electroless plated powder includes core particles and a nickel film formed by an electroless plating process on the surface of each core particle, wherein crystal grain boundaries are not recognized in the cross section in the direction of the thickness of the nickel film when observed with a scanning electron microscope at a magnification of up to 100,000. A method for making such a conductive electroless plated powder is also disclosed.

Abstract: A conductive electroless plated powder includes core particles and a nickel film formed by an electroless plating process on the surface of each core particle, wherein crystal grain boundaries in the nickel film are primarily oriented in the direction of the thickness of the nickel film. An electroless gold plating film may be deposited on the nickel film as the top layer. The nickel film is formed by electroless plating using glycine or ethylenediamine as a complexing agent.

Abstract: A conductive electroless plated powder includes core particles and a nickel film formed by an electroless plating process on the surface of each core particle, wherein crystal grain boundaries are not recognized in the cross section in the direction of the thickness of the nickel film when observed with a scanning electron microscope at a magnification of up to 100,000. A method for making such a conductive electroless plated powder is also disclosed.

Abstract: A conductive electrolessly plated powder used, for example, for bonding a small electrode of an electronic device, its producing method, and a conductive material containing the plated powder. Conventionally, there has been known, as conductive powders, metallic powders such as of nickel, carbon powders, and conductive plating powders the resin core particles of which are coated with a metal, e.g., nickel. However, there has been no conductive electrolessly plated powders having a good conductivity with respect to connection between conductive patterns having an oxide coating thereon or between electrodes and no methods for producing such powders industrially. The conductive electrolessly plated powder of the present invention consists of resin spherical core particles the average size of which is 1 to 20 &mgr;m and each of which has a nickel or nickel alloy coating formed by electroless plating. The coating includes small projections of 0.