Abstract: The resist composition according to the present invention is a resist composition comprising a solid component comprising a resist base material, and a solvent. In the resist composition according to the present invention, the resist composition contains 1 to 80% by mass of the solid component and 20 to 99% by mass of the solvent, the resist base material comprises a compound (ctt form) represented by a predetermined formula (1) and a compound represented by a predetermined formula (3), the proportion of the compound (ctt form) represented by the predetermined formula (1) to the resist base material is from 65 to 99% by mass, and the mass ratio of the compound represented by the predetermined formula (3) to the compound (ctt form) represented by the predetermined formula (1) is from 0.01 to 0.53.

Abstract: The resist composition according to the present invention is a resist composition comprising a solid component comprising a resist base material, and a solvent. In the resist composition according to the present invention, the resist composition contains 1 to 80% by mass of the solid component and 20 to 99% by mass of the solvent, the resist base material comprises a compound (ctt form) represented by a predetermined formula (1) and a compound represented by a predetermined formula (3), the proportion of the compound (ctt form) represented by the predetermined formula (1) to the resist base material is from 65 to 99% by mass, and the mass ratio of the compound represented by the predetermined formula (3) to the compound (ctt form) represented by the predetermined formula (1) is from 0.01 to 0.53.

Abstract: A resist composition of the present invention is a resist composition containing a resist base material and a solvent. The resist base material contains a specific stereoisomer. A content of the specific stereoisomer in the resist base material is 50 to 100% by mass.

Abstract: The resist composition according to the present invention is a resist composition comprising a solid component comprising a resist base material, and a solvent. In the resist composition according to the present invention, the resist composition contains 1 to 80% by mass of the solid component and 20 to 99% by mass of the solvent, the resist base material comprises a compound (ctt form) represented by a predetermined formula (1) and a compound represented by a predetermined formula (3), the proportion of the compound (ctt form) represented by the predetermined formula (1) to the resist base material is from 65 to 99% by mass, and the mass ratio of the compound represented by the predetermined formula (3) to the compound (ctt form) represented by the predetermined formula (1) is from 0.01 to 0.53.

Abstract: A resist composition of the present invention is a resist composition containing a resist base material and a solvent. The resist base material contains a specific stereoisomer. A content of the specific stereoisomer in the resist base material is 50 to 100% by mass.

Abstract: Disclosed are: a cyclic compound which has high solubility in a safe solvent, is highly sensitive, enables the formation of a resist pattern having a good shape, and rarely causes resist pattern collapse; a process for producing the cyclic compound; a radiation-sensitive composition containing the cyclic compound; and a resist pattern formation method using the composition. Specifically disclosed are: a cyclic compound having a specific structure; a process for producing the cyclic compound; a radiation-sensitive composition containing the compound; and a resist pattern formation method using the composition.

Abstract: Disclosed are: a cyclic compound which has high solubility in a safe solvent, is highly sensitive, enables the formation of a resist pattern having a good shape, and rarely causes resist pattern collapse; a process for producing the cyclic compound; a radiation-sensitive composition containing the cyclic compound; and a resist pattern formation method using the composition. Specifically disclosed are: a cyclic compound having a specific structure; a process for producing the cyclic compound; a radiation-sensitive composition containing the compound; and a resist pattern formation method using the composition.

Abstract: A composition containing 3,3?-thiobis(propane-1,2-dithiol) and one or more enic compounds which composition is photocurable and can give a cured product having a high refractive index and adequate hardness.

Abstract: A composition containing 3,3?-thiobis(propane-1,2-dithiol) and one or more enic compounds which composition is photocurable and can give a cured product having a high refractive index and adequate hardness.

Abstract: A composition containing 3,3?-thiobis(propane-1,2-dithiol) and one or more enic compounds which composition is photocurable and can give a cured product having a high refractive index and adequate hardness.

Abstract: A composition containing 3,3′-thiobis(propane-1,2-dithiol) and one or more enic compounds which composition is photocurable and can give a cured product having a high refractive index and adequate hardness.

Abstract: A process for producing a resin having a large refractive index which comprises curing an episulfide compound having one or more epithio structures represented by formula (1) in one molecule by polymerization in the presence of a polymerization catalyst and 0.001 to 3.0 parts by weight of a phenol derivative per 100 parts by weight of the episulfide compound. (R1 represents a hydrocarbon group having 1 to 10 carbon atoms, R2, R3 and R4 each represents hydrogen atom or a hydrocarbon group having 1 to 10 carbon atoms, Y represents S, O, Se or Te and m and n each represents 0 or 1).

Abstract: A process for the production of a film having a refractive index distribution, comprising producing a film by using an organic solvent solution containing as essential components a thermoplastic resin, a photopolymerizable monomer and a photopolymerization initiator, exposing the film to light and developing the film,

Abstract: A process for tinting a resin for optical materials, the resin containing sulfur, includes dipping the resin for optical materials into a liquid containing an inorganic acid and/or an organic acid and thereafter tinting the resin. Where the organic acid is included in the liquid, the organic acid is a mixture of a first compound (I) having sulfo group and a second compound (II) having phenolic hydroxyl group but not having sulfo group, with a ratio (I)/(II) of the first compound to the second compound, in an amount by weight, being 0.01 to 2.0.