Patents by Inventor MASAAKI WAKUI

MASAAKI WAKUI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210366748
    Abstract: According to one embodiment, a mold includes a substrate clamping surface, a cavity, a suction part, a vent, an intermediate cavity, and an opening/closing part. The substrate clamping surface contacts a surface of a processing substrate. The cavity is recessed from the substrate clamping surface. The suction part is recessed from the substrate clamping surface. The vent is provided on a path between the cavity and the suction part, communicates with the cavity, is recessed from the substrate clamping surface to a vent depth. The intermediate cavity is provided between the vent and the suction part on the path, communicates with the vent, and is recessed from the substrate clamping surface to an intermediate cavity depth deeper than the vent depth. The opening/closing part opens and closes the path and is provided between the intermediate cavity and the suction part on the path.
    Type: Application
    Filed: August 6, 2021
    Publication date: November 25, 2021
    Applicant: Toshiba Memory Corporation
    Inventors: Takeori MAEDA, Ryoji MATSUSHIMA, Makoto KAWAGUCHI, Masaaki WAKUI
  • Patent number: 11114322
    Abstract: According to one embodiment, a mold includes a substrate clamping surface, a cavity, a suction part, a vent, an intermediate cavity, and an opening/closing part. The substrate clamping surface contacts a surface of a processing substrate. The cavity is recessed from the substrate clamping surface. The suction part is recessed from the substrate clamping surface. The vent is provided on a path between the cavity and the suction part, communicates with the cavity, is recessed from the substrate clamping surface to a vent depth. The intermediate cavity is provided between the vent and the suction part on the path, communicates with the vent, and is recessed from the substrate clamping surface to an intermediate cavity depth deeper than the vent depth. The opening/closing part opens and closes the path and is provided between the intermediate cavity and the suction part on the path.
    Type: Grant
    Filed: March 10, 2017
    Date of Patent: September 7, 2021
    Assignee: Toshiba Memory Corporation
    Inventors: Takeori Maeda, Ryoji Matsushima, Makoto Kawaguchi, Masaaki Wakui
  • Publication number: 20170271186
    Abstract: According to one embodiment, a mold includes a substrate clamping surface, a cavity, a suction part, a vent, an intermediate cavity, and an opening/closing part. The substrate clamping surface contacts a surface of a processing substrate. The cavity is recessed from the substrate clamping surface. The suction part is recessed from the substrate clamping surface. The vent is provided on a path between the cavity and the suction part, communicates with the cavity, is recessed from the substrate clamping surface to a vent depth. The intermediate cavity is provided between the vent and the suction part on the path, communicates with the vent, and is recessed from the substrate clamping surface to an intermediate cavity depth deeper than the vent depth. The opening/closing part opens and closes the path and is provided between the intermediate cavity and the suction part on the path.
    Type: Application
    Filed: March 10, 2017
    Publication date: September 21, 2017
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: TAKEORI MAEDA, RYOJI MATSUSHIMA, MAKOTO KAWAGUCHI, MASAAKI WAKUI