Patents by Inventor Masafumi Ishii

Masafumi Ishii has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10519558
    Abstract: Copper sulfate which includes a Fe with a concentration of 0.08 ppm by mass or less.
    Type: Grant
    Filed: April 16, 2018
    Date of Patent: December 31, 2019
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Tomota Nagaura, Masafumi Ishii
  • Patent number: 10428936
    Abstract: A hydraulic control device that includes a source pressure generating valve that generates a source pressure; a solenoid valve that can supply the engagement pressure based on the source pressure; and a supply pressure switching valve that can be switched between a first state where the supply pressure switching valve can supply the engagement pressure to the second engagement element and a second state where the supply pressure switching valve can supply the source pressure to the second engagement element, the supply pressure switching valve being in the first state when the solenoid valve is operating normally, and being switched to the second state in case of abnormality in the solenoid valve.
    Type: Grant
    Filed: August 19, 2016
    Date of Patent: October 1, 2019
    Assignees: AISIN AW CO., LTD., TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Kenichi Tsuchida, Toshiaki Hayashi, Yuta Seriguchi, Masafumi Takasu, Yoichiro Kimura, Kenichi Ishii, Syuji Moriyama, Yoshinobu Soga, Hiromitsu Nitani, Takafumi Inagaki
  • Patent number: 10178775
    Abstract: Provided is a copper foil provided with a carrier which enables, in a laminate produced by laminating a copper foil provided with a carrier on a resin substrate, to peel the ultrathin copper layer from the carrier well. A copper foil provided with a carrier having, in order, a carrier, an intermediate layer, and an ultrathin copper layer, wherein, when the surface of the carrier opposite to the ultrathin copper layer is measured using a laser microscope based on JIS B0601-1994, the ten point average roughness Rz of the surface is 6.0 ?m or less.
    Type: Grant
    Filed: January 20, 2016
    Date of Patent: January 8, 2019
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Yoshiyuki Miyoshi, Michiya Kohiki, Masafumi Ishii
  • Publication number: 20180312989
    Abstract: Copper sulfate which includes a Fe with a concentration of 0.08 ppm by mass or less.
    Type: Application
    Filed: April 16, 2018
    Publication date: November 1, 2018
    Applicant: JX Nippon Mining & Metals Corporation
    Inventors: Tomota NAGAURA, Masafumi ISHII
  • Publication number: 20180282891
    Abstract: Copper sulfate which includes an Al with a concentration of 0.08 ppm by mass or less.
    Type: Application
    Filed: March 30, 2018
    Publication date: October 4, 2018
    Applicant: JX Nippon Mining & Metals Corporation
    Inventors: Tomota Nagaura, Masafumi Ishii
  • Publication number: 20180279482
    Abstract: A surface-treated copper foil is capable of imparting the profile shape of the substrate surface after removal of the copper foil, the profile shape maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. A resin substrate is provided with a profile shape of the surface maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. The surface-treated copper foil has a surface-treated layer formed on a copper foil, and the surface roughness Sz of the surface of the surface-treated layer is 2 to 6 ?m.
    Type: Application
    Filed: March 2, 2018
    Publication date: September 27, 2018
    Applicant: JX Nippon Mining & Metals Corporation
    Inventors: Masafumi ISHII, Misato HONDA, Nobuaki MIYAMOTO
  • Publication number: 20180264783
    Abstract: Such a metal foil is provided that a release layer is provided on a metal foil to enable physical release of a resin substrate, to which the metal foil is adhered, and thereby in the step of removing the metal foil from the resin substrate, the metal foil can be removed with good cost without damaging the surface profile of the metal foil transferred to the surface of the resin substrate, and also resins having different resin components can be adhered with good adhesion. A metal foil containing, on at least one surface of the metal foil, surface unevenness having a root mean square height Sq of from 0.25 to 1.6 ?m.
    Type: Application
    Filed: September 23, 2016
    Publication date: September 20, 2018
    Inventors: Terumasa Moriyama, Masafumi Ishii
  • Patent number: 9955583
    Abstract: The present invention provides a surface-treated copper foil capable of imparting the profile shape of the substrate surface after removal of the copper foil, the profile shape maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. The present invention also provides a resin substrate provided with a profile shape of the surface maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. The surface-treated copper foil of the present invention is a surface-treated copper foil having a surface-treated layer formed on a copper foil, and the surface roughness Sz of the surface of the surface-treated layer is 2 to 6 ?m.
    Type: Grant
    Filed: July 23, 2014
    Date of Patent: April 24, 2018
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Masafumi Ishii, Misato Honda, Nobuaki Miyamoto
  • Publication number: 20160212857
    Abstract: Provided is a copper foil provided with a carrier which enables, in a laminate produced by laminating a copper foil provided with a carrier on a resin substrate, to peel the ultrathin copper layer from the carrier well. A copper foil provided with a carrier having, in order, a carrier, an intermediate layer, and an ultrathin copper layer, wherein, when the surface of the carrier opposite to the ultrathin copper layer is measured using a laser microscope based on JIS B0601-1994, the ten point average roughness Rz of the surface is 6.0 ?m or less.
    Type: Application
    Filed: January 20, 2016
    Publication date: July 21, 2016
    Inventors: YOSHIYUKI MIYOSHI, MICHIYA KOHIKI, MASAFUMI ISHII
  • Publication number: 20160183380
    Abstract: The present invention provides a surface-treated copper foil capable of imparting the profile shape of the substrate surface after removal of the copper foil, the profile shape maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. The present invention also provides a resin substrate provided with a profile shape of the surface maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. The surface-treated copper foil of the present invention is a surface-treated copper foil having a surface-treated layer formed on a copper foil, and the surface roughness Sz of the surface of the surface-treated layer is 2 to 6 ?m.
    Type: Application
    Filed: July 23, 2014
    Publication date: June 23, 2016
    Inventors: MASAFUMI ISHII, MISATO HONDA, NOBUAKI MIYAMOTO
  • Publication number: 20140346048
    Abstract: Present invention provides an electrolytic copper foil having a high normal tensile strength and a resistance to the lowering of the tensile strength after thermal treatment. An electrolytic copper foil having a normal tensile strength of 500-750 MPa and a tensile strength after heating at 400° C. for one hour of at least 350 MPa.
    Type: Application
    Filed: March 1, 2013
    Publication date: November 27, 2014
    Inventors: Michiya Kohiki, Masafumi Ishii
  • Publication number: 20140030591
    Abstract: The present invention provides an electrolytic copper foil which is excellent in the extension property and can endure the change in the expansion and contraction at the fine units while having high strength, and a method of producing the same. Specifically, the electrolytic copper foil for a negative electrode collector in a secondary battery, wherein in a nominal stress strain curve, a tensile strength is 45 to 70 kg/mm2, and a value of the tensile strength is greater than a value of a breaking stress, and an extension rate is 5% or more.
    Type: Application
    Filed: March 28, 2012
    Publication date: January 30, 2014
    Applicant: JX NIPPON MINING & METALS CORPORATION
    Inventors: Michiya Kohiki, Masafumi Ishii, Terumasa Moriyama, Yoichi Minagawa
  • Publication number: 20120262361
    Abstract: In a screen displayed on site in a data format of image data, if a portion of the screen is changed, from among the image data of the entire screen, only an image data subjected to the change is converted to a vector graphics and is transmitted to a remote site via a network. At the remote site, the transmitted vector graphics is reconverted to the image data and is displayed. Further, information necessary for searching an image data is transmitted in association with a vector graphics. This allows a search to be made only from a data which actually requires to be displayed at the remote site.
    Type: Application
    Filed: April 12, 2012
    Publication date: October 18, 2012
    Applicant: Hitachi, Ltd.
    Inventors: Katsuhide KITAGAWA, Junichi Suzuki, Yoshio Maruyama, Kazuo Furudate, Hiroshi Suzuki, Masafumi Ishii
  • Publication number: 20090025464
    Abstract: A surface-roughness/contour measuring apparatus (1) comprises: a stylus orientation changing part (9) by which a rotatable support part (62, 64, 71a, 71b) for supporting a cantilever (7) in such a manner as to be rotatable on a rotational axis extending in a direction perpendicular to the longitudinal direction of the cantilever (7) is rotated about the longitudinal direction of the cantilever (7), thereby changing the orientation of a stylus (11) provided at a forward end of the cantilever (7); and a balancing member (63) which balances the weight of the cantilever (7) about the rotational axis in order to eliminate the effect of the gravitational force acting on the cantilever (7) rotating with the rotation of the rotatable support part (62, 64, 71a, 71b).
    Type: Application
    Filed: May 29, 2006
    Publication date: January 29, 2009
    Inventor: Masafumi Ishii