Patents by Inventor Masaharu FUJIYA

Masaharu FUJIYA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11005445
    Abstract: An electronic component including a pad electrode provided on a wiring electrode and a Au bump provided on the pad electrode, wherein the uppermost layer of the wiring electrode is a first Ti layer, the uppermost layer of the pad electrode is a Au layer, and the thickness of the first Ti layer in at least a portion on which the Au bump is superposed in plan view is greater than the thickness of at least a portion of the first Ti layer in a portion on which the Au bump is not superposed in plan view.
    Type: Grant
    Filed: December 12, 2019
    Date of Patent: May 11, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Ryuta Yamada, Yasuyuki Toyota, Masaharu Fujiya, Toru Takeshita, Masaaki Shimada
  • Patent number: 10862450
    Abstract: An elastic wave device includes a substrate, an elastic wave element, and an exterior resin layer. The substrate includes an outer electrode on one main surface thereof and a first mounting electrode on another main surface thereof. The elastic wave element includes a piezoelectric substrate, a transmission functional electrode, a reception functional electrode, and ground terminals on one main surface of the piezoelectric substrate, and the ground terminals are connected to the first mounting electrode. High-thermal-conductivity conductor layers are provided on another main surface of the piezoelectric substrate, conductor vias penetrate between both main surfaces of the piezoelectric substrate, and the high-thermal-conductivity conductor layers and the ground terminals are connected to each other by the conductor vias.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: December 8, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Masaharu Fujiya, Kazushi Watanabe
  • Patent number: 10847472
    Abstract: An elastic wave device includes a substrate, an IDT electrode, a wire, an electrically insulating film, and an identification marking. The substrate has piezoelectricity. The IDT electrode is provided on the substrate and includes a pair of comb-shaped electrodes facing each other. The wire is provided on the substrate and connected to the IDT electrode. The electrically insulating film is provided at least on the IDT electrode and the wire. The identification marking is defined by an uneven portion of a surface of the electrically insulating film. The identification marking does not to overlap the IDT electrode in plan view of the substrate.
    Type: Grant
    Filed: April 15, 2019
    Date of Patent: November 24, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Masaharu Fujiya, Takahiro Norichi, Tatsuya Ikeshima
  • Publication number: 20200204152
    Abstract: An electronic component including a pad electrode provided on a wiring electrode and a Au bump provided on the pad electrode, wherein the uppermost layer of the wiring electrode is a first Ti layer, the uppermost layer of the pad electrode is a Au layer, and the thickness of the first Ti layer in at least a portion on which the Au bump is superposed in plan view is greater than the thickness of at least a portion of the first Ti layer in a portion on which the Au bump is not superposed in plan view.
    Type: Application
    Filed: December 12, 2019
    Publication date: June 25, 2020
    Inventors: Ryuta YAMADA, Yasuyuki TOYOTA, Masaharu FUJIYA, Toru TAKESHITA, Masaaki SHIMADA
  • Publication number: 20190333863
    Abstract: An elastic wave device includes a substrate, an IDT electrode, a wire, an electrically insulating film, and an identification marking. The substrate has piezoelectricity. The IDT electrode is provided on the substrate and includes a pair of comb-shaped electrodes facing each other. The wire is provided on the substrate and connected to the IDT electrode. The electrically insulating film is provided at least on the IDT electrode and the wire. The identification marking is defined by an uneven portion of a surface of the electrically insulating film. The identification marking does not to overlap the IDT electrode in plan view of the substrate.
    Type: Application
    Filed: April 15, 2019
    Publication date: October 31, 2019
    Inventors: Masaharu FUJIYA, Takahiro NORICHI, Tatsuya IKESHIMA
  • Publication number: 20190140615
    Abstract: An elastic wave device includes a substrate, an elastic wave element, and an exterior resin layer. The substrate includes an outer electrode on one main surface thereof and a first mounting electrode on another main surface thereof. The elastic wave element includes a piezoelectric substrate, a transmission functional electrode, a reception functional electrode, and ground terminals on one main surface of the piezoelectric substrate, and the ground terminals are connected to the first mounting electrode. High-thermal-conductivity conductor layers are provided on another main surface of the piezoelectric substrate, conductor vias penetrate between both main surfaces of the piezoelectric substrate, and the high-thermal-conductivity conductor layers and the ground terminals are connected to each other by the conductor vias.
    Type: Application
    Filed: December 28, 2018
    Publication date: May 9, 2019
    Inventors: Masaharu FUJIYA, Kazushi WATANABE