Abstract: This invention is directed to provision of high-performance inertial sensor that can sustain SNR even in an environment where vibration disturbance exists. A vibration type inertial sensor comprises: two deadweights (2, 3); means (C1, C2, C3, C4, +vd, ?vd) for displacing the two dead weights in the anti-phase; two sets of electrodes (C5, C6, C7, C8) for detecting, as capacitance changes, the displacements of the two dead weights; and a C/V converting unit (53) for converting the capacitance changes of the electrodes to electric signals. In the vibration type inertial sensor, a set of electrodes (e.g., C5 and C8), which exhibit an increased electrostatic capacitance therebetween in the case where the two dead weights (2, 3) are displaced in the anti-phase, are electrically connected to each other, and a set of electrodes (e.g.

Abstract: A technique in which a false detection and a wrong diagnosis can be suppressed in a capacitance sensor represented by an acceleration sensor is provided. A first capacitative element and a second capacitative element, which configure a capacitance detection unit, and a third capacitative element and a fourth capacitative element, which configure a forced oscillation generation unit, are electrically separated from each other. That is, the diagnosis movable electrode that configures the third capacitative element and the fourth capacitative element is formed integrally with the movable part. On the other hand, the diagnosis fixed electrode and the diagnosis fixed electrode are electrically separated from the detection fixed electrode and the detection fixed electrode.

Abstract: An acceleration sensor and an angular velocity sensor are sealed in respective pressure atmospheres suitable therefor in the process of a series of bonding steps, thereby improving the detection sensibilities of the sensors. A movable member 111 of an acceleration sensor 11 and a vibrator 121 of an angular velocity sensor 12 are fabricated on the same sensor wafer 10 with a wall 16 interposed therebetween. A cap wafer 20 is formed in which gaps 21, 22 corresponding to the movable member 111 of the acceleration sensor 11 and the vibrator 121 of the angular velocity sensor 12 are provided. Bumps 23 are disposed near the gap 22 of the angular velocity sensor 12. The acceleration sensor 11 is sealed at atmospheric pressure. Then, the angular velocity sensor 12 is subjected to high temperature and a high-load and is vacuum-sealed. Thereafter, cutting with a diamond grindstone and mounting of circuit substrates and a wiring substrate are performed to form a combined sensor.

Abstract: An object of the present invention is to solve problems in that aluminum electrodes, aluminum wires, and I/O terminals are corroded by corrosive gasses when a pressure of a pressure medium containing corrosive matters such as exhaust gas is measured with a semiconductor sensor; and improve not only the corrosion resistance of the sensor chip but also the corrosion resistance of the portion particularly functioning as the pressure receiver. Each of the aluminum electrodes that is likely to be corroded portions is prevented from being corroded by forming a titanium-tungsten layer and gold layer on the aluminum electrode. The connecting wires are prevented from being corroded by corrosive matters by using gold wires. The I/O terminals are also prevented from being corroded by applying gold plating.

Abstract: There is provided a finger-vein authentication apparatus including a light source for illuminating one surface of both side-surfaces of a fingertip of a finger with light, and an image sensor for imaging the other surface of the fingertip, the light source and the image sensor being positioned at both sides of a nail of the fingertip with the nail sandwiched therebetween, wherein a fingertip guidance jig for supporting the fingertip and a finger-root guidance jig for supporting a finger-root of the finger are disposed between the light source and the image sensor, a light-shielding unit being disposed on the light-source side, the light-shielding unit being used for shielding the illumination light such that the illumination light will not travel to a ball side of the finger.

Abstract: An electronic device requires an electronic component to be mounted for the purpose of static shielding. The mounting of such an electronic component raises a problem of avoiding thermal stresses and cracks generated due to the difference between the coefficients of linear expansion of component materials. A positioning recess, a joining-substance thickness ensuring recess, a joining-substance thickness ensuring projection, etc. are formed in a combined manner in an electronic component mount portion of each of leads, whereby spreading of cracks generated in the joining substance can be suppressed and reliability can be improved. Filling a sealing material so as to seal and restrain the electronic component mounted in the electronic component mount portion without leaving voids contributes to further suppressing spreading of cracks generated in the joining substance and ensuring more improved reliability of the joining substance.

Abstract: An angular rate sensor includes a metallic core board having a core meal layer made of a metal plate and a wiring layer including a wiring structure, a semiconductor device for detecting an angular rate fixed on the core metal layer, and a cap fixed to the wiring layer. The semiconductor device for detecting an angular rate is disposed in a hollow chamber formed by the cap and the metallic core board. The metallic core board, the semiconductor device, and the cap are molded with resin. Consequently, the angular rate sensor has a packaging structure in which electromagnetic noise resistance and moisture resistance are improved while stress applied to the semiconductor device for detecting an angular rate is reduced.

Abstract: A movable device of acceleration sensors and a vibration device of a gyroscope are formed on the same sensor wafer spaced apart from each other by a wall. A cap wafer having gaps corresponding to the movable mechanical components of the acceleration sensors and gyroscope is provided for the wafer and an adsorbent divided into a plurality of divisional portions is disposed in the gap for the gyroscope. After the sensor wafer and the cap wafer have been bonded together at a temperature of inactivation of the adsorbent and in an atmospheric pressure ambience of noble gas and activated gas, the adsorbent divisional portions are activated in sequence to adsorb the activated gas so as to adjust the pressure inside the gyroscope, thus manufacturing a combined sensor wafer.

Abstract: A technique in which a false detection and a wrong diagnosis can be suppressed in a capacitance sensor represented by an acceleration sensor is provided. A first capacitative element and a second capacitative element, which configure a capacitance detection unit, and a third capacitative element and a fourth capacitative element, which configure a forced oscillation generation unit, are electrically separated from each other. That is, the diagnosis movable electrode that configures the third capacitative element and the fourth capacitative element is formed integrally with the movable part. On the other hand, the diagnosis fixed electrode and the diagnosis fixed electrode are electrically separated from the detection fixed electrode and the detection fixed electrode.

Abstract: There is provided a physical sensor which ensures long-term reliability and can be miniaturized and increased in density, and a method of producing the same. A physical sensor includes a supporting substrate, an element substrate that includes a sensor element and is joined to the supporting substrate through an insulating layer, a glass cap that covers an area of the sensor element and is joined to the element substrate, and a built-in electrode that is electrically connected to the sensor element. The built-in electrode is formed in a through hole passing through the element substrate, the insulating layer and the supporting substrate. A portion of the glass cap that covers an area of the built-in electrode is anodically bonded to the element substrate.

Abstract: An object of the present invention is to solve problems in that aluminum electrodes, aluminum wires, and I/O terminals are corroded by corrosive gasses when a pressure of a pressure medium containing corrosive matters such as exhaust gas is measured with a semiconductor sensor; and improve not only the corrosion resistance of the sensor chip but also the corrosion resistance of the portion particularly functioning as the pressure receiver. Each of the aluminum electrodes that is likely to be corroded portions is prevented from being corroded by forming a titanium-tungsten layer and gold layer on the aluminum electrode. The connecting wires are prevented from being corroded by corrosive matters by using gold wires. The I/O terminals are also prevented from being corroded by applying gold plating.

Abstract: There is provided a finger-vein authentication apparatus including a light source for illuminating one surface of both side-surfaces of a fingertip of a finger with light, and an image sensor for imaging the other surface of the fingertip, the light source and the image sensor being positioned at both sides of a nail of the fingertip with the nail sandwiched therebetween, wherein a fingertip guidance jig for supporting the fingertip and a finger-root guidance jig for supporting a finger-root of the finger are disposed between the light source and the image sensor, a light-shielding unit being disposed on the light-source side, the light-shielding unit being used for shielding the illumination light such that the illumination light will not travel to a ball side of the finger.

Abstract: There is provided a physical sensor which ensures long-term reliability and can be miniaturized and increased in density, and a method of producing the same. A physical sensor includes a supporting substrate, an element substrate that includes a sensor element and is joined to the supporting substrate through an insulating layer, a glass cap that covers an area of the sensor element and is joined to the element substrate, and a built-in electrode that is electrically connected to the sensor element. The built-in electrode is formed in a through hole passing through the element substrate, the insulating layer and the supporting substrate. A portion of the glass cap that covers an area of the built-in electrode is anodically bonded to the element substrate.

Abstract: An electronic device requires an electronic component to be mounted for the purpose of static shielding. The mounting of such an electronic component raises a problem of avoiding thermal stresses and cracks generated due to the difference between the coefficients of linear expansion of component materials. A positioning recess, a joining-substance thickness ensuring recess, a joining-substance thickness ensuring projection, etc. are formed in a combined manner in an electronic component mount portion of each of leads, whereby spreading of cracks generated in the joining substance can be suppressed and reliability can be improved. Filling a sealing material so as to seal and restrain the electronic component mounted in the electronic component mount portion without leaving voids contributes to further suppressing spreading of cracks generated in the joining substance and ensuring more improved reliability of the joining substance.

Abstract: An electronic device requires an electronic component to be mounted for the purpose of static shielding. The mounting of such an electronic component raises a problem of avoiding thermal stresses and cracks generated due to the difference between the coefficients of linear expansion of component materials. A positioning recess, a joining-substance thickness ensuring recess, a joining-substance thickness ensuring projection, etc. are formed in a combined manner in an electronic component mount portion of each of leads, whereby spreading of cracks generated in the joining substance can be suppressed and reliability can be improved. Filling a sealing material so as to seal and restrain the electronic component mounted in the electronic component mount portion without leaving voids contributes to further suppressing spreading of cracks generated in the joining substance and ensuring more improved reliability of the joining substance.

Abstract: An outer case connector portion, a gauge housing case, and the like for use with a pressure sensor, for example, are generally made of a thermoplastic or thermosetting resin. However, the resin physically causes curing shrinkage. Especially when a metal is insert molded with a resin, curing shrinkage of the resin generates a gap at the interface between the resin and the metal. By filling an anaerobic, high-permeability adhesive in the gap, hermetic sealing can be ensured and reliability can be enhanced. Inexpensive hermetic sealing and enhanced reliability are realized.

Abstract: A sensor structure using vibrating sensor elements which can detect an angular rate and accelerations in two axes at the same time is provided. 2 sets of vibration units which vibrate in out-of-phase mode (tunning-fork vibration) and include four vibrating sensor elements of the approximately same shape supported on a substrate in a vibratile state are provided and the vibrating sensor elements are disposed so that vibration axes of the vibration units cross each other at right angles. Each of the vibrating sensor elements includes a pair of detection units and adjustment units for adjusting a vibration frequency. The vibrating sensor elements constitute a combined sensor having supporting structure for supporting the vibrating sensor elements independently so that the vibrating sensor elements do not interfere with each other.

Abstract: An outer case connector portion, a gauge housing case, and the like for use with a pressure sensor, for example, are generally made of a thermoplastic or thermosetting resin. However, the resin physically causes curing shrinkage. Especially, when a metal is insert molded with a resin, curing shrinkage of the resin generates a gap at the interface between the resin and the metal. By filling an anaerobic, high-permeability adhesive in the gap, hermetic sealing can be ensured and reliability can be enhanced. Inexpensive hermetic sealing and enhanced reliability are realized.

Abstract: An electronic device requires an electronic component to be mounted for the purpose of static shielding. The mounting of such an electronic component raises a problem of avoiding thermal stresses and cracks generated due to the difference between the coefficients of linear expansion of component materials. A positioning recess, a joining-substance thickness ensuring recess, a joining-substance thickness ensuring projection, etc. are formed in a combined manner in an electronic component mount portion of each of leads, whereby spreading of cracks generated in the joining substance can be suppressed and reliability can be improved. Filling a sealing material so as to seal and restrain the electronic component mounted in the electronic component mount portion without leaving voids contributes to further suppressing spreading of cracks generated in the joining substance and ensuring more improved reliability of the joining substance.

Abstract: The present invention provides a pressure detector capable of easily responding to changes in specification. The pressure detector has a sensor unit for detecting pressure and electronic parts for reducing electrical disturbance which are electrically joined to an exposed part of lead material of an opening of an external case. Thermoset resin is injected and set in the opening to obtain fixed members. An external electronic part for compensating for transient voltage resistance and electromagnetic failure resistance of a single one-chip semiconductor sensor can be mounted, and cost can be reduced by miniaturization, light weight, and reduction in man-hours required for assembly.