Patents by Inventor Masahiko Nakamura

Masahiko Nakamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11967577
    Abstract: Disclosed herein is a semiconductor device including a conductive member that has a main surface facing in a thickness direction, a semiconductor element that has a plurality of pads facing the main surface, a plurality of electrodes that are individually formed with respect to the plurality of pads and protrude from the plurality of pads toward the main surface, and a bonding layer for electrically bonding the main surface to the plurality of electrodes. The bonding layer includes a first region having conductivity and a second region having electrical insulation. The first region includes a metal portion. At least a part of the second region includes a resin portion.
    Type: Grant
    Filed: October 12, 2021
    Date of Patent: April 23, 2024
    Assignee: ROHM Co., LTD.
    Inventors: Yosui Futamura, Yuto Nishiyama, Masahiko Nakamura
  • Publication number: 20240108955
    Abstract: A fitting device for selecting a golf club suitable for a golfer comprises: an acquisition part that acquires measurement values obtained by measuring a golfer's swing motion of a first golf club with a measuring device; and a calculation part that calculates a swing index related to the swing motion based on the measurement values; a determination part that determines, based on the swing index, a second optimum characteristic index indicating characteristics of a shaft for a second golf club different from the first golf club; and a selection part that selects at least a shaft for the second golf club that matches the second optimum characteristic index.
    Type: Application
    Filed: September 29, 2023
    Publication date: April 4, 2024
    Applicant: Smitomo Rubber Industries, Ltd.
    Inventors: Kenta NANKE, Kousuke OKAZAKI, Yuto NAKAMURA, Masahiko UEDA
  • Publication number: 20240093432
    Abstract: A method for manufacturing a molded product of the present disclosure includes a deposition step of depositing a mixture including a fiber and starch in air, a humidification step of applying water to the mixture, and a molding step of heating and pressurizing the mixture applied with water to obtain a molded product. The starch has a gelatinized and then pulverized particle diameter d50 of 0.30 mm or more and 1.0 mm or less, which is the average particle diameter of the finely pulverized product determined by a prescribed measuring method.
    Type: Application
    Filed: September 13, 2023
    Publication date: March 21, 2024
    Inventors: Masahiko NAKAZAWA, Shigemi WAKABAYASHI, Takashi SHINOHARA, Takumi SAGO, Naoko OMAGARI, Masahide NAKAMURA
  • Patent number: 11788944
    Abstract: To provide a technique that enables the risk of contamination to be reduced. Provided is a microparticle measuring apparatus including at least: a relay unit that enables a flow path through which microparticles flow and a cleaning fluid storage unit to communicate with each other; a sheath fluid tube that causes the flow path and a sheath fluid storage unit to communicate with each other; and a cleaning fluid tube that causes the relay unit and the cleaning fluid storage unit to communicate with each other, in which the relay unit includes a first connector that can be connected to a joint portion on the sheath fluid storage unit side of the sheath fluid tube.
    Type: Grant
    Filed: March 12, 2019
    Date of Patent: October 17, 2023
    Assignee: SONY CORPORATION
    Inventors: Masahiro Saito, Shingo Mouri, Masahiko Nakamura, Hidetaka Okamoto
  • Publication number: 20230273108
    Abstract: To provide a technique capable of stably forming droplets. There is provided a microparticle sorting device and the like including: an imaging element configured to acquire an image of fluid and a droplet at a position where liquid discharged from an orifice that generates a stream of the fluid is converted into a droplet; and a processing unit configured to determine a harmonic superposition amplitude ratio, a harmonic phase difference, and a superimposed wave voltage on the basis of states of a satellite droplet and a break-off point in the image.
    Type: Application
    Filed: June 16, 2021
    Publication date: August 31, 2023
    Inventors: SHIN MASUHARA, MASAHIKO NAKAMURA, MASAHIDE FURUKAWA
  • Patent number: 11718574
    Abstract: The present invention is a solvent composition including: a solvent including 1-chloro-2,3,3-trifluoro-1-propene; and at least one type of stabilizer selected from a group consisting of phenols, ethers, epoxides, amines, alcohols, and hydrocarbons, and is a solvent composition which is excellent in solubility of various organic substances and has no adverse effect on a global environment, and is excellent in stability, and this solvent composition can be used for a wide range of industrial uses such as cleaning, coating uses, and a heat transfer fluid.
    Type: Grant
    Filed: May 5, 2021
    Date of Patent: August 8, 2023
    Assignee: AGC Inc.
    Inventors: Hiroaki Mitsuoka, Toshio Miki, Masahiko Nakamura, Mari Ichinokawa, Hidekazu Okamoto, Atsushi Fujimori
  • Publication number: 20230094354
    Abstract: An electronic device which can suppress peeling off and damaging of the bonding material is provided. The electronic device includes an electronic component, a mounting portion, and a bonding material. The electronic component has an element front surface and an element back surface separated in the z-direction. The mounting portion has a mounting surface opposed to the element back surface on which the electronic component is mounted. The bonding material bonds the electronic component to the mounting portion. The bonding material includes a base portion and a fillet portion. The base portion is held between the electronic component and the mounting portion in the z-direction. The fillet portion is connected to the base portion and is formed outside the electronic component when seen in the z-direction. The electronic component includes two element lateral surface and ridges. The ridges are intersections of the two element lateral surface and extend in the z-direction.
    Type: Application
    Filed: January 18, 2021
    Publication date: March 30, 2023
    Inventors: Yosui FUTAMURA, Masahiko NAKAMURA
  • Publication number: 20230037700
    Abstract: A dielectric, including a halogenated olefin having from 2 to 4 carbon atoms, and having a water content of 6000 ppm or less in terms of mass.
    Type: Application
    Filed: October 3, 2022
    Publication date: February 9, 2023
    Applicant: AGC INC.
    Inventors: Hiroki HAYAMIZU, Tamaki CHINSOGA, Masato FUKUSHIMA, Masahiko NAKAMURA
  • Patent number: 11521917
    Abstract: A semiconductor device includes a chip that includes a mounting surface, a non-mounting surface, and a side wall connecting the mounting surface and the non-mounting surface and has an eaves portion protruding further outward than the mounting surface at the side wall and a metal layer that covers the mounting surface.
    Type: Grant
    Filed: May 21, 2020
    Date of Patent: December 6, 2022
    Assignee: ROHM CO., LTD.
    Inventors: Yosui Futamura, Masahiko Nakamura
  • Patent number: 11440862
    Abstract: There are provided a solvent composition which is excellent in solubility of various organic substances and excellent in detergency and a drying property, and has no adverse effect on a global environment and is excellent in stability; a cleaning method using the solvent composition; a method of forming a coating film; a heat transfer fluid including the solvent composition; and a heat cycle system using the heat transfer fluid. A solvent composition including 1-chloro-2,3,3-trifluoro-1-propene and 1-chloro-3,3-difluoro-1-propyne, a cleaning method of bringing the solvent composition and an article into contact with each other, a method of dissolving a nonvolatile organic compound in the solvent composition to produce a coating film-forming composition and evaporating the solvent composition after applying the coating film-forming composition on an article to be coated, to form a coating film, a heat transfer fluid including the solvent composition, and a heat cycle system using the heat transfer fluid.
    Type: Grant
    Filed: September 14, 2020
    Date of Patent: September 13, 2022
    Assignee: AGC Inc.
    Inventors: Masahiko Nakamura, Hiroaki Mitsuoka, Mari Ichinokawa, Atsushi Fujimori, Hidekazu Okamoto
  • Patent number: 11427521
    Abstract: A cleaning method may include: bringing an article to be cleaned into contact with a liquid-phase solvent composition including 1-chloro-2,3,3-trifluoro-1-propene and 1-chloro-2,2,3,3-tetrafluoropropane; and exposing the article to be cleaned to steam generated by evaporating the liquid-phase solvent composition. In the liquid-phase composition, a proportion of a content of 1-chloro-2,2,3,3-tetrafluoropropane to a total of a content of 1-chloro-2,3,3-trifluoro-1-propene and a content of 1-chloro-2,2,3,3-tetrafluoropropane may be 0.0001 to 1 mass %.
    Type: Grant
    Filed: March 4, 2021
    Date of Patent: August 30, 2022
    Assignee: AGC Inc.
    Inventors: Masahiko Nakamura, Hiroaki Mitsuoka, Mari Ichinokawa, Atsushi Fujimori, Hidekazu Okamoto
  • Patent number: 11401486
    Abstract: There is provided a solvent composition which is a stable solvent composition which is excellent in solubility of various organic substances, has a sufficient drying property, and has no adverse effect on a global environment, is stabilized not to decompose, and moreover suppresses metal corrosion under coexistence with metal, and which can be used without having an adverse effect on articles of various materials such as metal, plastic, and elastomer in a wide range of industrial uses such as cleaning and dilution coating uses. A solvent composition including: a solvent (A) including (D-1-chloro-3,3,3-trifluoro-1-propene; and a stabilizer (B) consisting of HCFC whose boiling point at normal pressure is not lower than 30° C. nor higher than 60° C.
    Type: Grant
    Filed: September 18, 2020
    Date of Patent: August 2, 2022
    Assignee: AGC Inc.
    Inventors: Masahiko Nakamura, Hidekazu Okamoto, Masaaki Tsuzaki, Hiroaki Mitsuoka, Satoko Itoh
  • Publication number: 20220202694
    Abstract: A gene expression promoter for skin beautification contains a fermented extract of aspergillus oryzae as an effective component. The gene expression promotor for skin beautification causes expression of at least one gene for skin beautification among BMP-2, TGFB1, CLDN7, HB-EGF, VEGF-A, LCE3D, and PPAR-D. The fermented extract of aspergillus oryzae is extracted using water after steamed rice as a raw material is fermented with aspergillus oryzae.
    Type: Application
    Filed: April 8, 2020
    Publication date: June 30, 2022
    Applicant: KOHSEI INDUSTRIAL CO., LTD.
    Inventors: Masahiko NAKAMURA, Daisuke MIYAI, Shouta KURIMOTO
  • Publication number: 20220153666
    Abstract: The present invention is a solvent composition including: a solvent including 1-chloro-2,3,3-trifluoro-1-propene; and at least one type of stabilizer selected from a group consisting of phenols, ethers, epoxides, amines, alcohols, and hydrocarbons, and is a solvent composition which is excellent in solubility of various organic substances and has no adverse effect on a global environment, and is excellent in stability, and this solvent composition can be used for a wide range of industrial uses such as cleaning, coating uses, and a heat transfer fluid.
    Type: Application
    Filed: May 5, 2021
    Publication date: May 19, 2022
    Applicant: AGC Inc.
    Inventors: Hiroaki MITSUOKA, Toshio MIKI, Masahiko NAKAMURA, Mari ICHINOKAWA, Hidekazu OKAMOTO, Atsushi FUJIMORI
  • Publication number: 20220115347
    Abstract: Disclosed herein is a semiconductor device including a conductive member that has a main surface facing in a thickness direction, a semiconductor element that has a plurality of pads facing the main surface, a plurality of electrodes that are individually formed with respect to the plurality of pads and protrude from the plurality of pads toward the main surface, and a bonding layer for electrically bonding the main surface to the plurality of electrodes. The bonding layer includes a first region having conductivity and a second region having electrical insulation. The first region includes a metal portion. At least a part of the second region includes a resin portion.
    Type: Application
    Filed: October 12, 2021
    Publication date: April 14, 2022
    Inventors: Yosui Futamura, Yuto Nishiyama, Masahiko Nakamura
  • Publication number: 20210292375
    Abstract: Described herein is a newly found outer membrane protein gene specific for Helicobacter suis and a gene product thereof. Also described herein is a method for determining infection of a subject with Helicobacter suis and a method for treatment using an antibody against the gene product.
    Type: Application
    Filed: May 22, 2019
    Publication date: September 23, 2021
    Inventors: Hidenori MATSUI, Masahiko NAKAMURA, Somay MURAYAMA, Tetsufumi TAKAHASHI, Emiko RIMBARA, Masato SUZUKI, Keigo SHIBAYAMA
  • Publication number: 20210276934
    Abstract: The present invention is a solvent composition including: a solvent including 1-chloro-2,3,3-trifluoro-1-propene; and at least one type of stabilizer selected from a group consisting of phenols, ethers, epoxides, amines, alcohols, and hydrocarbons, and is a solvent composition which is excellent in solubility of various organic substances and has no adverse effect on a global environment, and is excellent in stability, and this solvent composition can be used for a wide range of industrial uses such as cleaning, coating uses, and a heat transfer fluid.
    Type: Application
    Filed: May 5, 2021
    Publication date: September 9, 2021
    Applicant: AGC Inc.
    Inventors: Hiroaki MITSUOKA, Toshio MIKI, Masahiko NAKAMURA, Mari ICHINOKAWA, Hidekazu OKAMOTO, Atsushi FUJIMORI
  • Patent number: 11064144
    Abstract: The present technology relates to an imaging element, an imaging apparatus, and electronic equipment which are capable of accurately detecting phase difference. The imaging element includes a first light-receiving part that receives incident light entering through a first on-chip lens, a first phase detecting pixel which is placed between the first on-chip lens and the first light-receiving part and which has a shading film to limit an amount of light reaching the first light-receiving part, and a second phase detecting pixel which has a second light-receiving part to receive incident light entering through a second on-chip lens, with the second light-receiving part being divided into a plurality of light-receiving regions. The technique disclosed herein is applicable to imaging apparatuses having the autofocusing function.
    Type: Grant
    Filed: May 23, 2017
    Date of Patent: July 13, 2021
    Assignee: SONY CORPORATION
    Inventors: Masahiko Nakamura, Norihiko Akamatsu
  • Publication number: 20210188745
    Abstract: A cleaning method may include: bringing an article to be cleaned into contact with a liquid-phase solvent composition including 1-chloro-2,3,3-trifluoro-1-propene and 1-chloro-2,2,3,3-tetrafluoropropane; and exposing the article to be cleaned to steam generated by evaporating the liquid-phase solvent composition. In the liquid-phase composition, a proportion of a content of 1-chloro-2,2,3,3-tetrafluoropropane to a total of a content of 1-chloro-2,3,3-trifluoro-1-propene and a content of 1-chloro-2,2,3,3-tetrafluoropropane may be 0.0001 to 1 mass %.
    Type: Application
    Filed: March 4, 2021
    Publication date: June 24, 2021
    Applicant: AGC Inc.
    Inventors: Masahiko NAKAMURA, Hiroaki MITSUOKA, Mari ICHINOKAWA, Atsushi FUJIMORI, Hidekazu OKAMOTO
  • Patent number: 11034637
    Abstract: The present invention is a solvent composition including: a solvent including 1-chloro-2,3,3-trifluoro-1-propene; and at least one type of stabilizer selected from a group consisting of phenols, ethers, epoxides, amines, alcohols, and hydrocarbons, and is a solvent composition which is excellent in solubility of various organic substances and has no adverse effect on a global environment, and is excellent in stability, and this solvent composition can be used for a wide range of industrial uses such as cleaning, coating uses, and a heat transfer fluid.
    Type: Grant
    Filed: May 1, 2020
    Date of Patent: June 15, 2021
    Assignee: AGC Inc.
    Inventors: Hiroaki Mitsuoka, Toshio Miki, Masahiko Nakamura, Mari Ichinokawa, Hidekazu Okamoto, Atsushi Fujimori