Patents by Inventor Masahiko Saeki

Masahiko Saeki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8099853
    Abstract: A method for manufacturing a boundary acoustic wave device prevents formation of discontinuous portions in a dielectric film without a significant decrease in the thickness of an IDT when the dielectric film is formed by deposition and without deterioration of electrical characteristics. The method includes the steps of forming an IDT on a piezoelectric substrate, forming a lower dielectric film so as to cover the IDT, conducting a planarizing step so as to smooth the rough surface of the lower dielectric film, and forming an upper dielectric film so as to cover the lower dielectric film of which the rough surface is smoothed.
    Type: Grant
    Filed: July 17, 2009
    Date of Patent: January 24, 2012
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Hajime Kando, Naohiro Nodake, Masahiko Saeki, Toshiyuki Fuyutsume
  • Publication number: 20110156531
    Abstract: An acoustic wave device includes a piezoelectric substrate and an IDT electrode disposed thereon. The IDT electrode includes a metal laminate. The metal laminate includes a first metal layer made of Al or an Al-based alloy, a second metal layer made of a metal or alloy different from that used in the first metal layer, a Cu layer, and a Ti layer. The Cu layer and the Ti layer are disposed between the first and second metal layers. The Cu layer is located on the first metal layer side.
    Type: Application
    Filed: December 21, 2010
    Publication date: June 30, 2011
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Daisuke TAMAZAKI, Motoji TSUDA, Hisashi YAMAZAKI, Masahiko SAEKI, Harunobu HORIKAWA
  • Publication number: 20090265904
    Abstract: A method for manufacturing a boundary acoustic wave device prevents formation of discontinuous portions in a dielectric film without a significant decrease in the thickness of an IDT when the dielectric film is formed by deposition and without deterioration of electrical characteristics. The method includes the steps of forming an IDT on a piezoelectric substrate, forming a lower dielectric film so as to cover the IDT, conducting a planarizing step so as to smooth the rough surface of the lower dielectric film, and forming an upper dielectric film so as to cover the lower dielectric film of which the rough surface is smoothed.
    Type: Application
    Filed: July 17, 2009
    Publication date: October 29, 2009
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Hajime KANDO, Naohiro NODAKE, Masahiko SAEKI, Toshiyuki FUYUTSUME
  • Patent number: 7554428
    Abstract: A boundary acoustic wave device includes a first medium, a second medium, and an IDT electrode disposed at an interface between the first medium and the second medium, the IDT electrode having an Au layer defining a main electrode layer, wherein a Ni layer is laminated so as to contact at least one surface of the Au layer, and a portion of Ni defining the Ni layer is diffused from the Ni layer side surface of the Au layer toward the inside of the Au layer.
    Type: Grant
    Filed: August 13, 2008
    Date of Patent: June 30, 2009
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Daisuke Yamamoto, Hajime Kando, Akihiro Teramoto, Toshiyuki Fuyutsume, Masahiko Saeki
  • Publication number: 20080290968
    Abstract: A boundary acoustic wave device includes a first medium, a second medium, and an IDT electrode disposed at an interface between the first medium and the second medium, the IDT electrode having an Au layer defining a main electrode layer, wherein a Ni layer is laminated so as to contact at least one surface of the Au layer, and a portion of Ni defining the Ni layer is diffused from the Ni layer side surface of the Au layer toward the inside of the Au layer.
    Type: Application
    Filed: August 13, 2008
    Publication date: November 27, 2008
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Daisuke YAMAMOTO, Hajime KANDO, Akihiro TERAMOTO, Toshiyuki FUYUTSUME, Masahiko SAEKI
  • Patent number: 7146695
    Abstract: A surface acoustic wave device has superior electrical power resistance that is obtained by improving stress migration resistance of electrodes. In order to form at least one electrode, for example, on a ? rotation Y-cut (?=36° to 42°) LiTaO3 piezoelectric substrate, an underlying electrode layer including Ti or Cr as a primary component is formed, and an Al electrode layer including Al as a primary component is then formed on this underlying electrode layer. The Al electrode layer is an oriented film grown by epitaxial growth and is also a polycrystalline thin film having a twin structure in which a diffraction pattern observed in an X-ray diffraction pole figure has a plurality of symmetry centers.
    Type: Grant
    Filed: September 30, 2004
    Date of Patent: December 12, 2006
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Osamu Nakagawara, Masahiko Saeki, Kazuhiro Inoue
  • Publication number: 20050057121
    Abstract: A surface acoustic wave device has superior electrical power resistance that is obtained by improving stress migration resistance of electrodes. In order to form at least one electrode, for example, on a ? rotation Y-cut (?=36° to 42°) LiTaO3 piezoelectric substrate, an underlying electrode layer including Ti or Cr as a primary component is formed, and an Al electrode layer including Al as a primary component is then formed on this underlying electrode layer. The Al electrode layer is an oriented film grown by epitaxial growth and is also a polycrystalline thin film having a twin structure in which a diffraction pattern observed in an X-ray diffraction pole figure has a plurality of symmetry centers.
    Type: Application
    Filed: September 30, 2004
    Publication date: March 17, 2005
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Osamu Nakagawara, Masahiko Saeki, Kazuhiro Inoue
  • Patent number: 6822371
    Abstract: A surface acoustic wave device has superior electrical power resistance that is obtained by improving stress migration resistance of electrodes. In order to form at least one electrode, for example, on a &thgr; rotation Y-cut (&thgr;=36° to 42°) LiTaO3 piezoelectric substrate, an underlying electrode layer including Ti or Cr as a primary component is formed, and an Al electrode layer including Al as a primary component is then formed on this underlying electrode layer. The Al electrode layer is an oriented film grown by epitaxial growth and is also a polycrystalline thin film having a twin structure in which a diffraction pattern observed in an X-ray diffraction pole figure has a plurality of symmetry centers.
    Type: Grant
    Filed: December 27, 2002
    Date of Patent: November 23, 2004
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Osamu Nakagawara, Masahiko Saeki, Kazuhiro Inoue
  • Patent number: 6630767
    Abstract: A surface acoustic wave device includes a piezoelectric substrate made of a LiNO3 or LiTaO3 single crystal, and an electrode having power endurance. After a damaged layer formed on a surface of the piezoelectric substrate is removed, an under-electrode layer including at least one of Ti and Cr as a main component is formed by a vacuum deposition process at a temperature of about 100° C. or less, and an Al electrode layer including Al or an Al main component is then formed on the under-electrode layer. The Al electrode layer has a twin crystal structure in which the Al crystal is oriented in a desired direction such that the (111) crystal plane of Al substantially coincides with the Z crystal direction of the piezoelectric substrate.
    Type: Grant
    Filed: July 11, 2001
    Date of Patent: October 7, 2003
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Kazuhiro Inoue, Masanobu Watanabe, Osamu Nakagawara, Masahiko Saeki
  • Publication number: 20030132684
    Abstract: A surface acoustic wave device has superior electrical power resistance that is obtained by improving stress migration resistance of electrodes. In order to form at least one electrode, for example, on a &thgr; rotation Y-cut (&thgr;=36° to 42°) LiTaO3 piezoelectric substrate, an underlying electrode layer including Ti or Cr as a primary component is formed, and an Al electrode layer including Al as a primary component is then formed on this underlying electrode layer. The Al electrode layer is an oriented film grown by epitaxial growth and is also a polycrystalline thin film having a twin structure in which a diffraction pattern observed in an X-ray diffraction pole figure has a plurality of symmetry centers.
    Type: Application
    Filed: December 27, 2002
    Publication date: July 17, 2003
    Inventors: Osamu Nakagawara, Masahiko Saeki, Kazuhiro Inoue
  • Publication number: 20020008437
    Abstract: A surface acoustic wave device includes a piezoelectric substrate made of a LiNO3 or LiTaO3 single crystal, and an electrode having excellent power endurance. After a damaged layer formed on a surface of the piezoelectric substrate is removed, an under-electrode layer including at least one of Ti and Cr as a main component is formed by a vacuum deposition process at a temperature of about 100° C. or less, and an Al electrode layer including Al or an Al main component is then formed on the under-electrode layer. The Al electrode layer has a twin crystal structure in which the Al crystal is oriented in a desired direction such that the (111) crystal plane of Al substantially coincides with the Z crystal direction of the piezoelectric substrate.
    Type: Application
    Filed: July 11, 2001
    Publication date: January 24, 2002
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Kazuhiro Inoue, Masanobu Watanabe, Osamu Nakagawara, Masahiko Saeki